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Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst Hybrid Bonding Process

Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst Hybrid Bonding Process

Kulicke & Soffa和ROHm半导体开发新的CuFirst混合键合工艺
PR Newswire ·  11/13 16:05

SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ROHM Co., Ltd (TYO: 6963) ("ROHM"), a producer of a wide-range of semiconductor devices, announces a new path to hybrid bonding leveraging Kulicke & Soffa's leading Fluxless Thermo-Compression (FTC) process.

新加坡,2024 年 11 月 13 日 /PRNewswire/-- Kulicke 和 Soffa Industries, Inc. 纳斯达克股票代码:KLIC)(“Kulicke & Soffa”、“K&S”、“我们” 或 “公司”)与生产各种半导体器件的罗姆有限公司(TYO:6963)(“ROHM”)合作,宣布了利用Kulicke & Soffa领先的无通量热压缩(FTC)工艺实现混合粘合的新途径。

Kulicke & Soffa's recently released APTURA FTC system, combined with technology innovations from ROHM, have successfully enhanced chip-to-wafer hybrid bonding with the innovative copper-first – CuFirst – hybrid solution. While existing die-to-wafer hybrid bonding capacity can enable significant I/O density – yield challenges, cost of ownership, and front-end processing requirements are limiting the adoption rate and market potential of existing hybrid solutions.

Kulicke & Soffa最近发布的APTURA FTC系统与罗姆的技术创新相结合,成功地使用创新的铜优先——cuFirst——混合解决方案增强了芯片间的混合粘合。尽管现有的晶片对晶圆混合键合能力可以实现显著的I/O密度,但产量挑战、拥有成本和前端处理要求限制了现有混合解决方案的采用率和市场潜力。

The CuFirst hybrid solution, utilizing the K&S APTURA FTC platform, addresses these production limitations and challenges. With the emerging CuFirst process, the copper interconnect is bonded first – leveraging the APTURA platform's FTC capability – then the dielectric (SiOx) connection is made once the device returns to room temperature. This CuFirst process is expected to support higher yields, lower infrastructure costs and better cost of ownership compared to conventional die-to-wafer hybrid bonding. In addition to CuFirst hybrid, the APTURA FTC system also supports traditional flux- and fluxless-based thermo-compression bonding (TCB), including the direct bonding of copper-to-copper pillars – down to an 8μm pitch. This system can also accommodate die-to-die, die-to-substrate, or die-to-wafer configurations comprehensively addressing a broad range of material handling and end-application requirements.

利用K&S APTURA FTC平台的CUFirst混合解决方案解决了这些生产限制和挑战。借助新兴的CuFirst工艺,首先利用APTURA平台的FTC功能绑定铜互连,然后在设备恢复到室温后建立介电(SiOx)连接。与传统的晶片对晶圆混合键合相比,这种CuFirst工艺有望支持更高的产量、更低的基础设施成本和更好的拥有成本。除了 CuFirst 混合材料外,APTURA FTC 系统还支持传统的基于助焊剂和无助焊剂的热压缩粘合 (TCB),包括铜与铜柱的直接粘合,间距小至 8μm。该系统还可以适应晶片到晶片、晶片到基板或晶圆对晶圆的配置,全面满足广泛的材料处理和最终应用要求。

"Through ongoing R&D commitments and collaborations, we have become a critical enabler supporting the industry's transition to a chiplet ecosystem. Our TCB business has grown by ten times over the past four years, and industry momentum continues to accelerate," said Bob Chylak, Kulicke and Soffa's Chief Technology Officer.

“通过持续的研发承诺和合作,我们已成为支持该行业向小芯片生态系统过渡的关键推动者。在过去四年中,我们的TcB业务增长了十倍,行业势头持续加速。” Kulicke和Soffa首席技术官鲍勃·奇拉克说。

The Company expects its leadership in FTC to further extend as the need for more complex assembly solutions continue to grow. During fiscal year 2025, K&S anticipates its TCB business will increase by 40-50% sequentially, driven by broadening adoption in leading-edge compute, optical, communications and industrial markets.

该公司预计,随着对更复杂装配解决方案的需求持续增长,其在联邦贸易委员会的领导地位将进一步扩大。在2025财年,K&S预计,其TcB业务将连续增长40-50%,这得益于领先的计算、光学、通信和工业市场的广泛采用。

About Kulicke & Soffa

关于 Kulicke & Soffa

Founded in 1951, Kulicke and Soffa Industries, Inc. specializes in developing cutting-edge semiconductor and electronics assembly solutions enabling a smarter and more sustainable future. Our ever-growing range of products and services supports growth and facilitates technology transitions across large-scale markets, such as advanced display, automotive, communications, compute, consumer, data storage, energy storage and industrial.

Kulicke和Soffa Industries, Inc.成立于1951年,专门开发尖端的半导体和电子组装解决方案,以实现更智能、更可持续的未来。我们不断增长的产品和服务范围支持增长并促进了大规模市场的技术过渡,例如高级显示器、汽车、通信、计算、消费品、数据存储、能源存储和工业。

Caution Concerning Results, Forward-Looking Statements and Certain Risks Related to our Business

谨慎对待业绩、前瞻性陈述和与我们的业务相关的某些风险

In addition to historical statements, this press release contains statements relating to future events and our future results. These statements are "forward-looking" statements within the meaning of the Private Securities Litigation Reform Act of 1995. While these forward-looking statements represent our judgments and future expectations concerning our business, including the importance and competitiveness of our thermo-compression bonding products and other advanced packaging technology transitions, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from our expectations. These factors include, but are not limited to our ability to develop, manufacture and gain market acceptance of new and enhanced products, disruptions, breaches or failures in our information technology systems and network infrastructures, the persistent macroeconomic headwinds on our business, actual or potential inflationary pressures, interest rate and risk premium adjustments, falling customer sentiment, or economic recession caused directly or indirectly by geopolitical tensions, our ability to operate our business in accordance with our business plan and the other factors listed or discussed in our Annual Report on Form 10-K for the fiscal year ended September 30, 2023, filed on November 16, 2023, and our other filings with the Securities and Exchange Commission. Kulicke and Soffa Industries, Inc. is under no obligation to (and expressly disclaims any obligation to) update or alter its forward-looking statements whether as a result of new information, future events or otherwise.

除历史陈述外,本新闻稿还包含与未来事件和我们未来业绩有关的声明。这些陈述是1995年《私人证券诉讼改革法》所指的 “前瞻性” 陈述。尽管这些前瞻性陈述代表了我们对业务的判断和未来预期,包括我们的热压缩粘合产品和其他先进封装技术过渡的重要性和竞争力,但许多风险、不确定性和其他重要因素可能导致实际发展和结果与我们的预期存在重大差异。这些因素包括但不限于我们开发、制造新产品和增强产品并获得市场认可的能力、信息技术系统和网络基础设施的中断、泄露或故障、我们业务持续面临的宏观经济阻力、实际或潜在的通货膨胀压力、利率和风险溢价调整、客户信心下降或地缘政治紧张局势直接或间接造成的经济衰退、我们根据业务计划经营业务的能力以及我们在2023年11月16日提交的截至2023年9月30日财年的10-k表年度报告以及我们向美国证券交易委员会提交的其他文件中列出或讨论的其他因素。无论是由于新信息、未来事件还是其他原因,Kulicke and Soffa Industries, Inc. 没有义务(也明确表示不承担任何义务)更新或修改其前瞻性陈述。

Contacts

联系人

Kulicke & Soffa
Marilyn Sim
Public Relations
+65-6880 9309
[email protected]

Kulicke & Soffa
玛丽莲·辛
公共关系
+65-6880 9309
[电子邮件保护]

Kulicke & Soffa
Joseph Elgindy
Finance
+1-215-784-7500
[email protected]

Kulicke & Soffa
约瑟夫·埃尔金迪
金融
+1-215-784-7500
[电子邮件保护]

SOURCE Kulicke & Soffa Industries, Inc.

来源 Kulicke & Soffa Industries, Inc.

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