Advanced Micro Devices Inc (NASDAQ:AMD) reportedly plans to enter the mobile device market with new accelerated processing unit (APU) chips designed for smartphones.
The chips will leverage Taiwan Semiconductor Manufacturing Co's (NYSE:TSM) 3nm process, extending Taiwan Semiconductor's order visibility for 3nm production into late 2026, UDN.com reports.
The new APU chips are rumored to target flagship smartphones, potentially being used in models from Samsung Electronics (OTC:SSNLF).
AMD previously collaborated with Samsung on the Exynos 2200 processor, which featured a GPU based on AMD's RDNA 2 architecture. However, this earlier partnership focused on graphic enhancements rather than central processor development.
AMD's current MI300 series processors, known for their application in AI servers, could lay the groundwork for these upcoming mobile APUs. Industry insiders suggest that Samsung integrate these APUs into its premium devices, which rely heavily on Taiwan Semiconductor-manufactured components, such as Qualcomm Inc processors in the Galaxy S series.
According to Taiwan Semiconductor, its 3nm technology, including N3, N3E, and N3P nodes, has drawn significant interest from major clients like AMD, Apple Inc, and MediaTek. The demand for these advanced chips is so high that Taiwan Semiconductor has tripled its production capacity compared to last year. However, it still needs to work on meeting the overwhelming number of orders.
Taiwan Semiconductor's ongoing development of its 3nm family will further address emerging needs in AI, mobile devices, and automotive computing.
AMD posted third-quarter revenue of $6.8 billion, surpassing analyst expectations of $6.71 billion. Revenue grew 18%, driven by a 122% increase in Data Center revenue, which reached $3.5 billion. Client segment revenue rose 29% to $1.9 billion. However, Gaming revenue dropped 69% to $462 million, while Embedded revenue decreased 25% to $927 million.
For the fourth quarter, AMD projects revenue of $7.5 billion, plus or minus $300 million, reflecting 22% growth at the midpoint.
Goldman Sachs analyst Toshiya Hari credited AMD's growth to increasing capital investment in AI infrastructure, driven by enterprises in an "AI arms race." AMD's robust product pipeline, including competitive GPUs and the integration of ZT Systems, positions the company for accelerated growth.
Rebounding demand for server CPUs and market share gains in enterprise-targeted SKUs will likely boost revenue and margins.
Price Actions: AMD stock is up 2.4% at $141.75 at the last check on Monday. TSM is down 2.6%.
据报道，Advanced Micro Devices Inc（纳斯达克股票代码：AMD）计划通过专为智能手机设计的新型加速处理单元（APU）芯片进入移动设备市场。
UDN.com报道，这些芯片将利用台湾半导体制造有限公司（纽约证券交易所代码：TSM）的3纳米工艺，将台湾半导体3纳米生产的订单可见度延长至2026年底。
有传言称，新的APU芯片将针对旗舰智能手机，可能用于三星电子（场外交易代码：SSNLF）的机型。
AMD此前曾与三星合作开发Exynos 2200处理器，该处理器采用基于AMD的RDNA 2架构的GPU。但是，早期的合作伙伴关系侧重于图形增强，而不是中央处理器开发。
AMD 目前的 MI300 系列处理器以其在 AI 服务器中的应用而闻名，可以为这些即将推出的移动 APU 奠定基础。业内人士建议，三星将这些APU集成到其高端设备中，这些设备严重依赖台湾半导体制造的组件，例如Galaxy S系列中的高通公司处理器。
据台湾半导体称，其3纳米技术，包括N3、N3E和N3P节点，引起了AMD、苹果公司和联发科等主要客户的浓厚兴趣。对这些先进芯片的需求如此之高，以至于台湾半导体的产能与去年相比增长了三倍。但是，它仍然需要努力满足大量的订单。
台湾半导体对其3nm系列的持续开发将进一步满足人工智能、移动设备和汽车计算领域的新兴需求。
AMD公布的第三季度收入为68亿美元，超过了分析师预期的67.1亿美元。收入增长了18％，这得益于数据中心收入增长122％，达到35亿美元。客户群收入增长了29％，达到19亿美元。但是，游戏收入下降了69％，至4.62亿美元，而嵌入式收入下降了25％，至9.27亿美元。
AMD预计第四季度收入为75亿美元，正负3亿美元，中点增长22％。
高盛分析师Toshiya Hari将AMD的增长归因于企业在 “人工智能军备竞赛” 中的推动下，对人工智能基础设施的资本投资的增加。AMD 强大的产品线，包括竞争性的 GPU 和 Zt Systems 的集成，为公司的加速增长做好了准备。
对服务器CPU的需求反弹以及企业目标SKU的市场份额增加可能会提高收入和利润率。
价格走势：在周一的最后一次检查中，AMD股价上涨2.4％，至141.75美元。tSM 下跌了 2.6%。
