Taiwan Semiconductor Manufacturing Co (NYSE:TSM) is making waves in the semiconductor industry with a $65 billion investment in Arizona, bolstering the U.S.'s advanced chipmaking capabilities. The U.S. will likely secure the second-largest global market share in advanced semiconductor production by 2027, increasing its share from 9% to 21%, the Taipei Times cites from a TrendForce Corp report.
Taiwan Semiconductor is developing cutting-edge 3nm, 2nm, and even 1.4nm processes, with mass production of 3nm chips already underway in Tainan, Taiwan.
Two advanced fabs in Arizona will begin production in 2024 and 2028, focusing on 4nm and 3nm processes, respectively. A third fab using 2nm or more advanced technology is expected by 2030.
Taiwan, however, will likely see its share of advanced integrated circuit (IC) processes decline from 71% to 54% by 2027.
South Korea will likely experience a dip, dropping from 11% to 9%, relegating it to the third spot globally.
The U.S. government's focus on semiconductor self-sufficiency grows as global competition intensifies. Taiwan Semiconductor bagged up to $6.6 billion in U.S. subsidies and $5 billion in proposed loans to build advanced chip plants in Arizona.
A Boston Consulting Group report estimates that U.S. semiconductor manufacturing capacity could triple by 2032, driven by policies like the CHIPS Act. U.S. capital expenditure on semiconductors will likely constitute 28% of the global total between 2025 and 2032.
Taiwan Semiconductor is ramping up domestic and global expansion efforts. Over the next decade, the company plans to construct new factories annually in Taiwan, with sites in Kaohsiung, Tainan, and Taichung.
The contract chipmaker is also advancing its international projects, including a second facility in Japan's Kumamoto region set to begin construction in 2025 and advanced plants in Arizona and Dresden. The company continues to innovate in advanced packaging technologies like CoWoS and SoIC to stay ahead in the semiconductor market.
Taiwan Semiconductor forecasts record capital expenditures between $34 billion and $38 billion to support its growth in 2025.
Advanced Micro Devices, Inc (NASDAQ:AMD) has recently tapped Taiwan Semiconductor to foray into the smartphone market, leveraging the chipmaker's 3nm process to target Samsung's flagship models.
Taiwan Semiconductor stock surged over 82% year-to-date.
Price Action: TSM stock is down 0.15% at $184.80 premarket at last check Tuesday.
台湾半导体制造有限公司（NYSE:TSM）在亚利桑那州投资 650 亿美元，加强了美国先进的芯片制造能力，从而在半导体行业掀起了波澜。《台北时报》援引TrendForce Corp的一份报告称，到2027年，美国可能会在先进半导体生产中获得全球第二大市场份额，将其份额从9％增加到21％。
台湾半导体正在开发尖端的3nm、2nm甚至1.4nm工艺，3nm芯片的批量生产已经在台湾台南进行。
亚利桑那州的两座先进晶圆厂将在2024年和2028年开始生产，分别专注于4纳米和3纳米工艺。预计到2030年将有第三家晶圆厂使用2纳米或更先进的技术。
但是，到2027年，台湾在先进集成电路（IC）工艺中的份额可能会从71％下降到54％。
韩国可能会出现下滑，从11％下降到9％，降至全球第三位。
随着全球竞争的加剧，美国政府对半导体自给自足的关注也越来越多。台湾半导体获得了高达66亿美元的美国补贴和50亿美元的拟议贷款，用于在亚利桑那州建造先进的芯片工厂。
波士顿咨询集团的一份报告估计，受CHIPS法案等政策的推动，到2032年，美国的半导体制造能力可能会增加三倍。2025年至2032年间，美国在半导体方面的资本支出可能占全球总额的28％。
台湾半导体正在加大国内和全球扩张力度。在接下来的十年中，该公司计划每年在台湾建造新工厂，在高雄、台南和台中设立工厂。
这家合同芯片制造商还在推进其国际项目，包括定于2025年开始建设的日本熊本地区的第二座工厂，以及亚利桑那州和德累斯顿的先进工厂。该公司继续在先进封装技术方面进行创新，如CowOS和SoIC，以保持半导体市场的领先地位。
台湾半导体预测，创纪录的340亿至380亿美元的资本支出将支持其2025年的增长。
Advanced Micro Devices, Inc（纳斯达克股票代码：AMD）最近聘请台湾半导体进军智能手机市场，利用该芯片制造商的3纳米工艺来瞄准三星的旗舰机型。
迄今为止，台湾半导体股价飙升了82％以上。
价格走势：在周二的最后一次盘前检查中，tSM股价下跌0.15％，至184.80美元。
