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Camtek Receives Orders for Over $50 Million for Its New Product Line: Hawk

Camtek Receives Orders for Over $50 Million for Its New Product Line: Hawk

康特科技新产品线“Hawk”收到超过5000万美元的订单
PR Newswire ·  2024/11/27 20:15

The Hawk will be officially launched at Semicon Korea in February 2025

鹰将于2025年2月在韩国半导体展上正式发布

MIGDAL HAEMEK, Israel, Nov. 27, 2024 /PRNewswire/ -- Camtek Ltd. (NASDAQ: CAMT) (TASE: CAMT), today announced that it has received over $50 million in initial orders from several customers for its new Hawk product, with additional orders in the pipeline. These orders will be delivered throughout 2025.

以色列MIGDAL HAEMEk,2024年11月27日/ PRNewswire/ - 康特科技有限公司(纳斯达克:CAMT)(TASE:CAMT)宣布,它已收到来自多位客户2500万美元的初期订单,用于其新的Hawk产品,还有更多订单正在洽谈中。这些订单将在整个2025年内交付。

The Hawk, based on a groundbreaking new platform, addresses high-end Advanced Packaging technologies including capabilities for inspection and 3D measurements of wafers with 500 million micro bumps and Hybrid Bonding technology. Offering significantly enhanced capabilities beyond the Eagle product line, the Hawk expands Camtek's total addressable market (TAM).

基于突破性的新平台,Hawk涵盖了高端先进封装技术,包括具备对50000万微型凸起和混合键合技术晶片检测和3D测量能力。Hawk产品系列远远超越了Eagle产品线的功能,扩大了康特科技的总地址市场(TAM)。

The Hawk product line addresses the industry's most demanding applications, including High Bandwidth Memory (HBM), Chiplet and Hybrid Bonding as well as use-cases previously unserved by Camtek. With unmatched throughput and precision, the Hawk platform is engineered to meet current and future industry roadmaps, setting a new benchmark for inspection and metrology.

Hawk系列产品满足了行业苛刻的应用需求,包括高带宽存储器(HBM)、芯片组和混合键合,以及之前康特科技未曾服务的使用案例。具有无与伦比的吞吐量和精度,Hawk平台旨在满足当前和未来的行业路线图,树立了检测和计量的新标杆。

The Hawk will be officially launched in February 2025 at Semicon Korea.

鹰将于2025年2月在韩国半导体展上正式发布。

Rafi Amit, Camtek's CEO, commented: "Our new Hawk product line is an important addition to Camtek's portfolio and we are very pleased with the strong initial customer reception, as reflected by the over $50 million in orders received even before the official launch. These orders for the Hawk highlight the strong demand in the market for these solutions and reflect our customer's confidence in Camtek's products."

康特科技的首席执行官拉菲·阿米特(Rafi Amit)评论说:“我们的新Hawk产品系列是康特科技组合的重要补充,我们非常高兴看到,在官方发布之前,已收到超过2500万美元的强劲初期客户接待。这些Hawk产品的订单凸显了市场对这些解决方案的强劲需求,并反映了客户对康特科技产品的信心。”

Continued Mr. Amit: "Together with the new, recently unveiled, Eagle G5 model, and the thousands of Eagle systems already installed at customer sites, we continue to address the variety of applications of our customers around the world. We remain committed to supporting our customers as we continue to deliver cutting-edge solutions."

阿米特先生继续说:“除了最新推出的Eagle G5型号,以及已经安装在客户现场的成千上万的Eagle系统外,我们仍在继续满足全球客户各种应用的需求。我们始终致力于支持客户,为他们提供尖端解决方案。”

For more information about Camtek Ltd. and its advanced inspection and metrology solutions, please visit .

有关康特科技及其先进的检测和计量解决方案的更多信息,请访问。

ABOUT CAMTEK LTD.

关于Camtek Ltd.

Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry. Camtek's systems inspect IC and measure IC features on wafers throughout the production process of semiconductor devices, covering the front and mid-end and up to the beginning of assembly (Post Dicing). Camtek's systems inspect wafers for the most demanding semiconductor market segments, including Advanced Interconnect Packaging, Heterogenous Integration, Memory and HBM, CMOS Image Sensors, Compound Semiconductors, MEMS, and RF, serving numerous industry's leading global IDMs, OSATs, and foundries.

康特科技是半导体行业高端检测和测量设备的开发和制造商。康特科技的系统在半导体器件生产过程中,从前端到中端,以及在装配(切割后)的早期阶段,在晶片上检查晶体管并测量晶体管特征。康特科技的系统检查早期市场领先的全球集成电路设计厂商(IDM)、外包半导体封装测试服务公司(OSATs)和晶圆代工厂的最苛刻的半导体市场领域,包括先进的互联封装、异构集成、存储和HBM、CMOS图像传感器、复合半导体、MEMS和射频电路。

With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art solutions in line with customers' requirements.

康特科技在以色列和德国拥有制造设施,并在全球范围内设有八个办事处,为客户提供符合其要求的尖端解决方案。

This press release is available at .

此新闻稿可在此处获取。

This press release contains statements that may constitute "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements are based on Camtek's current beliefs, expectations and assumptions about its business and industry, all of which may change. Forward-looking statements can be identified by the use of words including "believe," "anticipate," "should," "intend," "plan," "will," "may," "expect," "estimate," "project," "positioned," "strategy," and similar expressions that are intended to identify forward-looking statements, including our expectations and statements relating to the compound semiconductors market and our position in this market and the anticipated timing of delivery of the systems. These forward-looking statements involve known and unknown risks and uncertainties that may cause the actual results, performance or achievements of Camtek to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. Factors that may cause our actual results to differ materially from those contained in the forward-looking statements include, but are not limited to, the effects of the evolving nature of the war situation in Israel, and the related evolving regional conflicts; the continued demand and future contribution of HBM and Chiplet applications and devices to the Company business resulting from, among other things, the field of AI surging worldwide across companies, industries and nations; formal or informal imposition by countries of new or revised export and/or import and doing-business regulations or sanctions, including but not limited to changes in U.S. trade policies, changes or uncertainty related to the U.S. government entity list and changes in the ability to sell products incorporating U.S originated technology, which can be made without prior notice, and our ability to effectively address such global trade issues and changes; ; and those other factors discussed in our Annual Report on Form 20-F as published on March 21, 2024 as well as other documents filed by the Company with the SEC as well as other documents that may be subsequently filed by Camtek from time to time with the Securities and Exchange Commission. We caution you not to place undue reliance on forward-looking statements, which speak only as of the date hereof. Camtek does not assume any obligation to update any forward-looking statements in order to reflect events or circumstances that may arise after the date of this release unless required by law.

此新闻稿中包含可能构成"前瞻性声明"的声明,此类前瞻性声明基于康特科技对其业务和行业的当前信念、期望和假设,所有这些可能会发生变化。前瞻性声明可通过使用"相信"、"预期"、"应该"、"打算"、"计划"、"将"、"可能"、"期望"、"估计"、"项目"、"定位"、"策略"等旨在识别前瞻性声明的词语和类似表达来识别,包括我们对化合物半导体市场、该市场中的地位以及系统交付的预期时间的期望和声明。这些前瞻性声明涉及可能导致康特科技的实际结果、业绩或成就与此类前瞻性声明所体现或暗示的任何未来结果、业绩或成就有实质不同的已知和未知风险和不确定性。可能导致我们的实际结果与前瞻性声明中包含的结果有实质不同的因素包括但不限于,以色列战争态势的演变以及相关的地区冲突演变所产生的影响;HBm和Chiplet应用及设备对公司业务的持续需求和未来贡献,包括人工智能领域在全球范围内迅猛增长跨越公司、行业和国家;各国对新或经修订的出口和/或进口以及做生意的规定或制裁的正式或非正式实施,包括但不限于美国贸易政策的变化,与美国政府实体清单相关的变化或不确定性,以及在没有事先通知的情况下改变的能够售卖包含美国原产技术的产品的能力,以及我们有效应对此类全球贸易问题和变化的能力;以及其他在2024年3月21日发布的我们的年度报告20-F中讨论的因素,以及公司向美国证券交易委员会提出的其他文件,以及康特科技随时向证券交易与交易委员会提交的其他文件。我们警告您不要过度依赖前瞻性声明,这些只代表截至本新闻稿日期的声明。康特科技不承担更新任何前瞻性声明以反映本新闻稿日期后可能出现的事件或情况的义务,除非法律要求。

While we believe that we have a reasonable basis for each forward-looking statement contained in this press release, we caution you that these statements are based on a combination of facts and factors currently known by us and our projections of the future, about which we cannot be certain. In addition, any forward-looking statements represent Camtek's views only as of the date of this press release and should not be relied upon as representing its views as of any subsequent date. Camtek does not assume any obligation to update any forward-looking statements unless required by law.

尽管我们相信我们对本新闻稿中包含的每个前瞻性声明均有合理的基础,但我们提醒您,这些声明基于我们当前已知的事实和因素的组合以及对未来的预测,对此我们无法确定。此外,任何前瞻性声明仅代表康特科技在本新闻稿的发布日期和不应被视为代表其在任何随后的日期作出的观点。康特科技不承担任何更新前瞻性声明的义务,除非法律要求。

Logo:

徽标:

CAMTEK LTD.
Moshe Eisenberg, CFO
Tel: +972 4 604 8308
Mobile: +972 54 900 7100
[email protected]

/s/摩西·艾森伯格
莫修·艾森伯格, 首席财务官
电话:+972 4 604 8308
手机号码:+972 54 900 7100
[email protected]

INTERNATIONAL INVESTOR RELATIONS
EK Global Investor Relations
Ehud Helft
Tel: (US) 1 212 378 8040
[email protected]

国际投资者关系
全球货币投资关系
Ehud Helft
电话:(美国)1 212 378 8040
[email protected]

SOURCE Camtek Ltd.

来源:康特科技有限公司。

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