Rapidus Collaborates With Synopsys to Shorten Semiconductor Design Cycles
Rapidus Collaborates With Synopsys to Shorten Semiconductor Design Cycles
TOKYO, Dec. 10, 2024 /PRNewswire/ -- SEMICON Japan Booth #2148 -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a leading provider of silicon to systems design solutions, to enable a solution that will shorten design cycle time, using a revolutionary new approach to natively model process sensitivity and variation in the design steps. This new approach dramatically reduces the need for expensive re-characterization of libraries and memories during different phases of the process evolution leading to a significant reduction in design iterations and acceleration of the overall project execution cycle.
东京,2024年12月10日 /PRNewswire/ — SEMICON 日本展位 #2148 — 先进逻辑半导体制造商Rapidus Corporation今天宣布,它已与硅转系统设计解决方案的领先提供商新思科技公司签署协议,使用革命性的新方法对过程灵敏度和设计步骤的变化进行原生建模,从而实现缩短设计周期的解决方案。这种新方法极大地减少了在流程演进的不同阶段对库和存储器进行昂贵的重新表征的需求,从而显著减少了设计迭代并加快了整个项目执行周期。
As part of the agreement, Synopsys will develop advanced design flows leveraging its AI-driven EDA suite and enable a broad IP portfolio on Rapidus' 2nm gate-all-around (GAA) process. The collaboration will facilitate Rapidus' Design for Manufacturing and Co-Optimization (DMCO) concept for simultaneously optimizing design and manufacturing and enabling agile design.
作为协议的一部分,新思科技将利用其人工智能驱动的EDA套件开发先进的设计流程,并在Rapidus的2纳米全能门(GAA)工艺上实现广泛的IP产品组合。此次合作将促进Rapidus的制造与协同优化设计(DMCO)概念,以同时优化设计和制造,实现敏捷设计。
Characterization of the IP library is one of the bottlenecks in semiconductor design cycle time because the IP needs to be recharacterized each time the process design kit (PDK) or manufacturing process is updated. It can take two to three months to generate a timing model, which drastically slows down the design process. The new DMCO solution will address these bottlenecks by using Synopsys AI-driven EDA products, including Synopsys PrimeShield, a machine learning (ML)-based timing model generation tool employing sensitivity libraries whenever PDKs or manufacturing processes are updated. Additionally, calibration using silicon data from Rapidus' short turnaround time (TAT) manufacturing process will improve model accuracy and accelerate design convergence.
IP 库的特性是半导体设计周期的瓶颈之一,因为每次更新工艺设计套件 (PDK) 或制造过程时,都需要对 IP 进行重新表征。生成时序模型可能需要两到三个月的时间,这会大大减慢设计过程。新的DMCO解决方案将使用新思科技人工智能驱动的EDA产品来解决这些瓶颈,包括新思科技PrimeShield,这是一种基于机器学习(ML)的时序模型生成工具,每当更新PDK或制造流程时,都会使用灵敏度库。此外,使用来自 Rapidus 短周转时间 (TAT) 制造过程的硅数据进行校准将提高模型精度并加速设计融合。
"Synopsys continues to play a mission-critical role as an on-ramp to the world's leading foundries and we are often the first stop for foundry enablement," said Sassine Ghazi, president and CEO of Synopsys. "Our extensive collaboration with Rapidus across Synopsys AI-driven EDA flows, IP and expert methodology services will facilitate an advanced DMCO solution that will enable designers to achieve optimal quality of results and high manufacturing yield for Rapidus' 2nm GAA process."
新思科技总裁兼首席执行官Sassine Ghazi表示:“作为通往世界领先铸造厂的入口,新思科技继续发挥关键任务的作用,我们通常是铸造支持的第一站。”“我们与Rapidus在人工智能驱动的EDA流程、知识产权和专家方法服务方面的广泛合作将促进先进的DMCO解决方案,使设计人员能够为Rapidus的2nm GAA工艺实现最佳的结果质量和高制造产量。”
By incorporating the concept of Manufacturing for Design (MFD) in addition to conventional Design for Manufacturing (DFM), Rapidus will be able to use sensors and AI in the wafer process to streamline designs based on silicon big data from the manufacturing process. This collaboration will incorporate Rapidus' big data into Synopsys AI-driven EDA flows to realize MFD for mutual customers. In addition, the Synopsys portfolio of interface and foundation IP for Rapidus process technologies will reduce integration risk and accelerate the path to silicon success.
除了传统的制造设计(DFM)之外,通过整合以设计为制造(MFD)的概念,Rapidus将能够在晶圆工艺中使用传感器和人工智能,根据制造过程中的硅大数据来简化设计。此次合作将把Rapidus的大数据整合到新思科技的人工智能驱动的EDA流程中,为共同的客户实现MFD。此外,新思科技针对Rapidus工艺技术的接口和基础IP产品组合将降低集成风险并加快硅成功之路。
Rapidus is building its Rapid and Unified Manufacturing Service (RUMS) to shorten the overall time-to-market for customers by providing integrated design support and front-end and back-end processes that will continue to enhance design support through DMCO.
Rapidus 正在构建其快速统一制造服务 (RUMS),通过提供集成的设计支持以及前端和后端流程来缩短客户的总体上市时间,这些流程将继续通过 DMCO 增强设计支持。
Dr. Atsuyoshi Koike, CEO of Rapidus, said: "Our partnership with Synopsys is an important milestone in helping to simplify and quicken the design process. Rapidus' vision for RUMS is to use a single-wafer front-end process. The massive amount of data that can be obtained from this process is highly compatible with Synopsys AI-driven EDA flows and IP, and we believe that this will be a step toward achieving our goal of short TAT production that is quicker than anywhere else."
Rapidus首席执行官小池厚义博士表示:“我们与新思科技的合作是帮助简化和加快设计过程的重要里程碑。Rapidus对RUMS的愿景是使用单晶圆前端工艺。从这个过程中可以获得的大量数据与新思科技的人工智能驱动的EDA流程和IP高度兼容,我们相信这将是朝着实现比其他任何地方都更快的短TaT生产的目标迈出的一步。”
About Rapidus Corporation
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. By developing and providing services to shorten cycle times for design, wafer processes, 3D packaging, and other aspects of semiconductor production, Rapidus creates new industries together with customers. We continue to embrace challenges that contribute to the fulfillment, prosperity, and happiness of people's lives using semiconductors.
关于Rapidus Corporation
Rapidus 公司的目标是开发和制造世界上最先进的逻辑半导体。通过开发和提供缩短设计、晶圆工艺、三维封装和半导体生产其他方面的周期时间的服务,Rapidus与客户共同创造了新行业。我们将继续接受挑战,这些挑战有助于使用半导体实现人们生活的充实、繁荣和幸福。
About Rapidus Corporation |
|
Headquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0032, Japan | |
Establishment: |
August 10th, 2022 |
Executives: |
Tetsuro Higashi, Chairman of the Board of Directors |
Atsuyoshi Koike, President and Representative Director |
|
Business: |
Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components |
Capital, etc: |
7,346 million yen (as of November 2022) |
(includes the amount of capital reserve) |
关于Rapidus Corporation |
|
总部:日本东京 102-0032 千代田区小路町 4-1 | |
设立: |
2022年8月10日 |
高管: |
董事会主席东哲郎 |
总裁兼代表董事小池厚义 |
|
业务: |
半导体器件、集成电路和其他电子元件的研究、开发、设计、制造和销售 |
资本等: |
734600万日元(截至2022年11月) |
(包括资本储备金额) |
U.S. Media Contact:
Devan Gillick – Breakaway Communications for Rapidus
Email: [email protected]
Mobile: (530) 591-3194
美国媒体联系人:
Devan Gillick — Rapidus 的分离通讯
电子邮件:[电子邮件保护]
手机:(530) 591-3194
SOURCE Rapidus Corporation
来源 Rapidus Corporation