On Friday, Taiwan Semiconductor Manufacturing Co (NYSE:TSM) unveiled its first advanced chip fabrication plant in Arizona, marking a significant milestone in U.S.-based semiconductor production.
The facility, covering 3.5 million square feet on a 1,100-acre site, represents Taiwan Semiconductor's commitment to bolstering domestic chip manufacturing. Apple Inc (NASDAQ:AAPL) is its largest customer.
Initially projected at $12 billion, the project has grown to $20 billion, and production has been delayed to 2025. Taiwan Semiconductor stock is trading upwards on Monday.
Currently in pilot production, the fab manufactures sample wafers for customer verification, CNBC reports.
Taiwan Semiconductor plans to build two additional fabs on the site by the end of the decade, bringing the total investment to $65 billion.
Rick Cassidy, chairman of Taiwan Semiconductor, highlighted to CNBC the challenges of navigating U.S. regulations, labor laws, and construction processes but expressed confidence that the project is nearly back on its original schedule.
Once operational, the Arizona plant will produce 4-nanometer chips at a rate of 20,000 wafers per month.
The Arizona fab is part of a broader strategy to diversify chip production outside Taiwan, ensuring supply chain resilience amid geopolitical tensions and natural disasters.
Nvidia Corp (NASDAQ:NVDA) is weighing the production of the front-end process of Blackwell AI chips at Taiwan Semiconductor's Arizona plant.
Currently, 92% of the world's most advanced chips are made in Taiwan, prompting Taiwan Semiconductor to ship the aforementioned Blackwell chips back to Taiwan for packaging.
The company aims to employ 6,000 workers for its three planned fabs in Arizona. Taiwan Semiconductor has also implemented water recycling initiatives to manage the 4.7 million gallons required daily for operations, reducing consumption to 1 million through sustainable practices.
Running the first Arizona fab requires significant power—2.85 gigawatt-hours per day, equivalent to the usage of 100,000 homes.
Taiwan Semiconductor is offsetting this demand by purchasing renewable energy credits and utilizing on-site solar energy.
International Data Corp expects Taiwan Semiconductor to control a 67% share of the global foundry market in 2025, backed by AI applications and crypto-mining technologies.
Taiwan Semiconductor posted third-quarter revenue of $23.50 billion, up 39%, surpassing guidance and estimates, driven by strong demand for 3nm and 5nm technologies. Needham analyst Charles Shi highlighted Apple's significant contribution to the robust 3nm performance.
Price Action: TSM stock is up 1.67% at $204.29 premarket at last check Monday.
周五，台湾半导体制造有限公司（纽约证券交易所代码：TSM）在亚利桑那州推出了其第一家先进的芯片制造工厂，这标志着美国半导体生产的一个重要里程碑。
该工厂占地1,100英亩，占地350万平方英尺，代表了台湾半导体对加强国内芯片制造的承诺。苹果公司（纳斯达克股票代码：AAPL）是其最大的客户。
该项目最初预计为120亿美元，现已发展到200亿美元，生产已推迟到2025年。周一，台湾半导体股价上涨。
据CNBC报道，该晶圆厂目前正在试生产，生产样品晶圆以供客户验证。
台湾半导体计划在本世纪末在该场地上再建造两个晶圆厂，使总投资达到650亿美元。
台湾半导体董事长里克·卡西迪向CNBC强调了驾驭美国法规、劳动法和施工流程所面临的挑战，但他表示相信该项目已接近原定计划。
投产后，亚利桑那州的工厂将以每月20,000块晶圆的速度生产4纳米芯片。
亚利桑那州的晶圆厂是实现台湾以外地区芯片生产多元化的更广泛战略的一部分，该战略旨在确保供应链在地缘政治紧张局势和自然灾害中的弹性。
英伟达公司（纳斯达克股票代码：NVDA）正在权衡台湾半导体亚利桑那州工厂布莱克韦尔人工智能芯片前端工艺的生产。
目前，世界上最先进的芯片中有92％是在台湾制造的，这促使台湾半导体将上述Blackwell芯片运回台湾进行封装。
该公司的目标是为计划在亚利桑那州建造的三个晶圆厂雇用6,000名员工。台湾半导体还实施了水资源回收计划，以管理每天运营所需的470万加仑，通过可持续的做法将消耗量减少到100万。
运营亚利桑那州的第一座晶圆厂需要大量的电力——每天 2.85 千兆瓦时，相当于 100,000 个家庭的使用量。
台湾半导体正在通过购买可再生能源积分和利用现场太阳能来抵消这一需求。
国际数据公司预计，在人工智能应用和加密采矿技术的支持下，台湾半导体将在2025年控制全球代工市场67％的份额。
受对3纳米和5纳米技术的强劲需求推动，台湾半导体公布的第三季度收入为235.0亿美元，增长39％，超过预期和预期。尼德姆分析师查尔斯·施强调了苹果对强劲的3纳米性能的重大贡献。
价格走势：周一最后一次盘前检查时，tSM股价上涨1.67％，至204.29美元。
