share_log

Tower Semiconductor Releases 300mm 65nm 3.3V-Based BCD Power Management Platform

Tower Semiconductor Releases 300mm 65nm 3.3V-Based BCD Power Management Platform

Tower半导体发布300mm 65nm 3.3V基础BCD电源管理平台
GlobeNewswire ·  2024/12/23 19:00

Delivering high-efficiency power, high-performance analog, and high-density digital in a single power management platform for mobile, AI, and data center applications

在一个单一的电源管理平台中,为移动、人工智能和IDC概念应用提供高效能电源、高性能模拟和高密度数字服务。

MIGDAL HAEMEK, Israel, December 23, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced its new 300mm 65nm 3.3V-based BCD Power management platform, PML, in addition to its successful 5V-based offering already in high-volume production in Japan and that which is being qualified in Albuquerque, New Mexico, USA, manufacturing site. This new, cutting-edge platform addresses the stringent low-voltage requirements of mobile devices and meets the growing demands for high power efficiency and power density in AI and data center applications.

以色列米格达尔哈梅克,2024年12月23日 - Tower半导体(纳斯达克/TASE:TSEM),一家领先的高价值模拟半导体解决方案铸造厂,今天宣布推出其新的300mm 65nm 3.3V BCD电源管理平台PML,此外,当前在日本的高生产量5V基电源管理方案也取得了成功,并且正在美国新墨西哥州的阿尔伯克基制造基地进行验证。这一新的前沿平台满足了移动设备严格的低电压要求,并满足了人工智能和IDC概念应用中对高能效和高功率密度的不断增长的需求。

The advanced 300mm BCD PML offering comprises LDMOS devices with ultra-low on-resistance and best-in-class figure-of-merit, achieving highest power conversion efficiency for fast switching converters. In addition, it features power devices with wide voltage range and a nominal 3.3V gate voltage that can be substantially overdriven and underdriven addressing products such as PMIC, Audio IC, and high-power voltage regulators for GPU and CPU. These advantages enable users to achieve outstanding performance in power consumption and extend battery life in battery operated applications.

先进的300mm BCD PML产品包括具有超低导通电阻的LDMOS器件和最佳性能指标,能够实现快速切换变换器的最高电能转换效率。此外,它还具有宽电压范围和名义3.3V的门电压,可以大幅超压和欠压以满足诸如PMIC、音频IC和针对GPU和CPU的高功率电压调节器等产品的需求。这些优势使用户能够在电能消耗方面实现卓越性能,并延长电池供电应用中的电池寿命。

"Our new PML platform exemplifies Tower Semiconductor's continuous success in providing cutting-edge power management technology solutions," said Shimon Greenberg, General Manager of Power Management Business Unit. "Specifically designed for advanced power management applications, this innovation empowers our customers to develop industry-leading products with a competitive edge that address the evolving demands of the strategic mobile, AI, and data center markets".

“我们的新PML平台体现了Tower半导体在提供尖端电源管理技术解决方案方面的持续成功,”电源管理业务单元总经理Shimon Greenberg说。“专门为先进的电源管理应用而设计,这一创新使我们的客户能够开发出行业领先的具有竞争优势的产品,以应对战略移动、人工智能和IDC概念市场不断变化的需求。”

For additional information on Tower's PM technology platform, please visit here.

有关Tower的Pm技术平台的更多信息,请访问 这里.

About Tower Semiconductor

关于塔架半导体

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns two facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo, shares a 300mm facility in Agrate, Italy, with ST as well as has access to a 300mm capacity corridor in Intel's New Mexico factory. For more information, please visit: .

Tower半导体有限公司(纳斯达克/TASE:TSEM)是高价值模拟半导体解决方案的领先代工厂,为消费、工业、汽车、移动、制造行业、医疗和航空航天与国防等不断增长的市场客户提供技术、开发和工艺平台。Tower半导体专注于通过长期合作伙伴关系以及其先进和创新的模拟技术产品为世界创造积极和可持续的影响,产品包括一系列可定制的工艺平台,如SiGe、BiCMOS、混合信号/CMOS、RF CMOS、CMOS人形机器人-图像传感器、非成像传感器、显示器、集成电源管理(BCD和700V)、光子技术和MEMS。Tower半导体还为用户提供世界级的设计支持,确保快速准确的设计周期,以及包括开发、转移和优化在内的工艺转移服务,面向IDM和无晶圆厂公司。为了为客户提供多工厂采购和扩展产能,Tower半导体在以色列拥有两座工厂(150mm和200mm)、在美国拥有两座工厂(200mm)、在日本拥有两座工厂(200mm和300mm),通过对TPSCo的51%控股来拥有,同时与St共享位于意大利Agrate的300mm工厂,并且能够访问英特尔在新墨西哥工厂的300mm产能走廊。有关更多信息,请访问: .

Safe Harbor Regarding Forward-Looking Statements

关于前瞻性声明的安全港

This press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower's business is included under the heading "Risk Factors" in Tower's most recent filings on Forms 20-F and 6-K, as were filed with the Securities and Exchange Commission (the "SEC") and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release.

本新闻稿包含前瞻性声明,这些声明面临风险和不确定性。实际结果可能与这些前瞻性声明所预测或暗示的结果有所不同。关于可能影响本新闻稿中前瞻性声明准确性的风险和不确定性的完整讨论,以及可能影响塔架业务的风险,已包含在塔架最近提交的20-F和6-k表格的“风险因素”标题下,这些表格已提交给证券交易委员会("SEC")和以色列证券管理局。塔架不打算更新,并明确声明不承担更新本公告中所包含的信息的义务。

Tower Semiconductor Investor Relations Contact: Noit Levy | +972-4-604-7066 | noitle@towersemi.com
Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com

Tower半导体投资者关系联系方式:Noit Levy | +972-4-604-7066 | noitle@towersemi.com
Tower半导体公司联系方式:Orit Shahar | +972-74-7377440 | oritsha@towersemi.com

Attachment

附件

  • 300mm BCD PR_Final
  • 300mm BCD PR_Final

声明:本内容仅用作提供资讯及教育之目的,不构成对任何特定投资或投资策略的推荐或认可。 更多信息
    抢沙发