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AMD Announces Expanded Consumer and Commercial AI PC Portfolio at CES

AMD Announces Expanded Consumer and Commercial AI PC Portfolio at CES

AMD在CES上宣布扩展消费和商用人工智能个人电脑产品组合
GlobeNewswire ·  01/06 14:45

Ryzen AI Max Chip Shot

Ryzen AI Max芯片快照

Ryzen AI Max Chip Shot
Ryzen AI Max芯片快照

— AMD Ryzen AI Max, AMD Ryzen AI 300 Series and AMD Ryzen 200 Series processors bring incredible performance for next-gen AI PCs —

— 美国超微公司Ryzen AI Max、AMD Ryzen AI 300系列和AMD Ryzen 200系列处理器为下一代人工智能计算机带来了开多性能 —

— AMD Ryzen AI Max PRO, AMD Ryzen AI 300 PRO and AMD Ryzen 200 PRO Series processors bring cutting-edge performance to business PCs —

— 美国超微公司Ryzen AI Max PRO、AMD Ryzen AI 300 PRO和AMD Ryzen 200 PRO系列处理器为商务计算机带来了尖端性能 —

LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) unveiled new processors today, ahead of CES 2025, furthering its leadership in the AI PC market and offering mobile users the most innovative PCs processors. AMD announced the new Ryzen AI Max Series processors, exceeding the demands for high-performance computing in premium thin and light notebooks; new Ryzen AI 300 Series "Zen-5"-based processors, rounding out the stack with additional models; and to continue the legacy of AMD "Zen 4" architecture, AMD also announced Ryzen 200 Series processors for everyday productivity.

拉斯维加斯,2025年1月6日(全球新闻通讯社)-- 美国超微公司(纳斯达克:AMD)今天发布了新的处理器,在2025年国际消费电子展(CES)前进一步巩固了其在人工智能个人电脑市场的领导地位,并为移动用户提供了最创新的处理器。美国超微公司宣布了新的Ryzen AI Max系列处理器,满足了高性能计算在优质轻薄笔记本电脑上的需求;新款基于“Zen-5”的Ryzen AI 300系列处理器,增加了额外型号以完善产品线;并且为了延续AMD“Zen 4”架构的传统,AMD还发布了用于日常生产力的Ryzen 200系列处理器。

AMD also expanded its commercial AI PC lineup integrating AMD PRO Technologies into the Ryzen AI Max, Ryzen AI 300 and Ryzen AI 200 Series processors. Ryzen PRO Series processors feature enterprise-grade security and manageability tools designed to help secure the modern enterprise and streamline IT operations.

美国超微公司还扩展了其商业人工智能计算机系列,将AMD PRO技术集成到Ryzen AI Max、Ryzen AI 300和Ryzen AI 200系列处理器中。Ryzen PRO系列处理器具有企业级安全性和可管理性工具,旨在帮助保护现代企业并简化IT操作。

"As consumers and professionals increasingly recognize the productivity benefits of AI PCs, AMD is further increasing its performance leadership in the market," said Jack Huynh, senior vice president and general manager, Computing and Graphics Group, AMD. "With the next generation of AI-enabled processors, we are proliferating AI to devices everywhere, and bringing the power of a workstation to thin and light laptops."

"随着消费者和专业人士日益认识到人工智能计算机的生产力优势,AMD在市场上的性能领导地位进一步增强," AMD计算与图形集团高级副总裁兼总经理Jack Huynh表示。"通过下一代支持人工智能的处理器,我们将在各类设备上普及人工智能,并将工作站的强大性能带入轻薄笔记本电脑。"

AMD Ryzen AI Max and Ryzen AI Max PRO Series Processors
The new Ryzen AI Max Series processors revolutionize what's possible for next-gen AI PCs, offering incredible power and performance for gamers, creators and everyday users. With workstation-level performance, the Ryzen AI Max processors offer up to 16 "Zen 5" CPU cores, up to 40 AMD RDNA 3.5 graphics compute units, and an AMD XDNA 2 Neural Processing Unit (NPU) with up to 50 TOPS of AI processing ability1 – all in ultra-portable form factors for optimum mobility.

AMD Ryzen AI Max和Ryzen AI Max PRO系列处理器
新的Ryzen AI Max系列处理器正在革新下一代人工智能计算机的可能性,为游戏玩家、创作者和日常用户提供令人难以置信的性能和能力。Ryzen AI Max处理器具有工作站级性能,提供多达16个“Zen 5”CPU核心,最多可支持40个AMD RDNA 3.5图形计算单元,以及一个AMD XDNA 2神经处理单元(NPU),具备高达50 TOPS的人工智能处理能力——所有这些都在超便携的形态中,确保最佳移动性。

Featuring up to 128GB of unified memory with up to 96GB available for graphics, systems powered by Ryzen AI Max for seamless and reliable multitasking, with the ability to support incredibly large AI models. With the addition of an NPU with up to 50 TOPS, Ryzen AI Max Series processors are the ultimate powerhouse for next-gen AI PCs and accelerating demanding AI-enabled workstation and creator software.

配备高达128Gb的统一内存,其中最高可用于图形的为96Gb,搭载Ryzen AI Max的系统能够实现无缝且可靠的多任务处理,支持极为庞大的人工智能模型。再加上一个具备50 TOPS处理能力的NPU,Ryzen AI Max系列处理器成为下一代人工智能计算机和加速高负载人工智能工作站及创作者软件的终极强大动力。

Built to redefine thin and light workstations, the new Ryzen AI Max PRO Series processors enable users to work with large engineering and architectural models and to tackle complex, AI-accelerated workloads. Equipped with AMD PRO Technologies, workstations powered by Ryzen AI Max PRO Series processors set a new standard for business-class mobile workstations.

新推出的Ryzen AI Max PRO系列处理器旨在重新定义薄型和轻型工作站,使用户能够处理大型工程和建筑模型,并应对复杂的人工智能加速工作负载。配备AMD PRO技术的工作站由Ryzen AI Max PRO系列处理器驱动,为商务级移动工作站树立了新的标准。

Systems powered by Ryzen AI Max and Ryzen AI Max PRO Series Processors are expected to be available starting in Q1 2025.

搭载Ryzen AI Max和Ryzen AI Max PRO系列处理器的系统预计将在2025年第一季度开始上市。

Model Cores /
Threads
Boost2 / Base
Frequency
Total
Cache
Graphics Model
AMD
cTDP NPU
TOPS
Graphics
Cores
AMD Ryzen AI Max+ 395 16C/32T Up to 5.1 /3.0 GHz 80MB AMD Radeon 8060S Graphics 45-120W 50 40
AMD Ryzen AI Max 390 12C/24T Up to 5.0 / 3.2 GHz 76MB AMD Radeon 8050S Graphics 45-120W 50 32
AMD Ryzen AI Max 385 8C/16T Up to 5.0 / 3.6 GHz 40MB AMD Radeon 8050S Graphics 45-120W 50 32
AMD Ryzen AI Max+ PRO 395 16C/32T Up to 5.1 / 3.0 GHz 80MB AMD Radeon 8060S Graphics 45-120W 50 40
AMD Ryzen AI Max PRO 390 12C/24T Up to 5.0 / 3.2 GHz 76MB AMD Radeon 8050S Graphics 45-120W 50 32
AMD Ryzen AI Max PRO 385 8C/16T Up to 5.0 / 3.6 GHz 40MB AMD Radeon 8050S Graphics 45-120W 50 32
AMD Ryzen AI Max PRO 380 6C/12T Up to 4.9 / 3.6 GHz 22MB AMD Radeon 8040S Graphics 45-120W 50 16
型号 内核 /
讨论区
提升2 / 基础
频率
总计
缓存
图形模型
AMD
cTDP NPU
TOPS
图形
核心
美国超微公司锐龙人工智能Max+ 395 16C/32T 最高可达5.1/3.0 GHz 80MB 美国超微公司Radeon 8060S图形 45-120W 50 40
美国超微公司锐龙人工智能Max 390 12C/24T 高达5.0 / 3.2 GHz 76MB 美国超微公司Radeon 8050S显卡 45-120W 50 32
美国超微公司 Ryzen AI Max 385 8C/16T 最高可达 5.0 / 3.6 GHz 40MB 美国超微公司Radeon 8050S显卡 45-120W 50 32
美国超微公司 Ryzen AI Max+ PRO 395 16C/32T 最高5.1 / 3.0 GHz 80MB 美国超微公司Radeon 8060S图形 45-120W 50 40
美国超微公司Ryzen AI Max PRO 390 12C/24T 高达5.0 / 3.2 GHz 76MB 美国超微公司Radeon 8050S显卡 45-120W 50 32
美国超微公司锐龙人工智能MAX PRO 385 8C/16T 最高可达 5.0 / 3.6 GHz 40MB 美国超微公司Radeon 8050S显卡 45-120W 50 32
美国超微公司 Ryzen 人工智能 Max PRO 380 6核/12线程 最高 4.9 / 3.6 GHz 22MB 美国超微公司 Radeon 8040S 图形 45-120W 50 16


AMD Ryzen AI 300 and Ryzen AI 300 PRO Series Processors

AMD is introducing new Ryzen AI 300 Series processors, to join the Ryzen AI 300 Series family and enable premium AI experiences across notebooks. In addition to the previously announced Ryzen 9 models, the new Ryzen AI 7 and Ryzen AI 5 processor models are bringing the same trusted performance and AI capabilities to everyone.


美国超微公司Ryzen AI 300和Ryzen AI 300 PRO系列处理器
美国超微公司正在推出新的Ryzen AI 300系列处理器,以加入Ryzen AI 300系列家族,并在笔记本电脑上实现优质人工智能体验。除了之前宣布的Ryzen 9型号外,新的Ryzen AI 7和Ryzen AI 5处理器型号将同样的可靠性能和人工智能功能带给每一个人。

The new Ryzen AI 300 Series processors, feature up to 8 "Zen 5" CPU cores and the latest RDNA 3.5 graphics architecture. With an industry-leading NPU3 powered by AMD XDNA 2 technology, Ryzen AI 300 Series processors provide up to five times better performance than the first generation NPU, for more AI power4.

新的Ryzen AI 300系列处理器,最多配备8个“Zen 5”CPU内核和最新的RDNA 3.5图形架构。凭借业界领先的NPU3,由AMD XDNA 2技术驱动,Ryzen AI 300系列处理器提供比第一代NPU高出五倍的性能,为更多人工智能提供动力。

For everyday business productivity, the new Ryzen AI 7 PRO 350 and Ryzen AI 5 PRO 340 processors are designed to support the next generation of Microsoft Copilot+ experiences. With a leading peak 50+ NPU TOPS of AI performance, commercial systems powered by Ryzen AI 300 PRO Series processors offer enterprises systems with the compute power to support the shift to an AI-enabled workforce. With AMD PRO Technologies, Ryzen AI 300 PRO Series processors deliver exceptional security and manageability features for business professionals on the go.

为了日常商业生产力,新的Ryzen AI 7 PRO 350和Ryzen AI 5 PRO 340处理器旨在支持下一代微软Copilot+体验。凭借领先的50+ NPU TOPS的人工智能性能,搭载Ryzen AI 300 PRO系列处理器的商业系统为企业提供支持向人工智能驱动的工作队伍转变所需的计算能力。凭借AMD PRO技术,Ryzen AI 300 PRO系列处理器为在外工作的商业专业人士提供卓越的安全性和可管理性特性。

Systems powered by the new Ryzen AI 300 processors are expected to be available starting in Q1 2025.

搭载新款Ryzen AI 300处理器的系统预计将在2025年第一季度上市。

Model Cores /
Threads
Boost5 / Base
Frequency
Total
Cache
Graphics Model
AMD
cTDP NPU
TOPS
AMD Ryzen AI 7 350 8C/16T Up to 5.0 / 2.0 GHz 24 MB AMD Radeon 860M Graphics 15-54W 50
AMD Ryzen AI 5 340 6C/12T Up to 4.8 / 2.0 GHz 22 MB AMD Radeon 840M Graphics 15-54W 50
AMD Ryzen AI 7 PRO 350 8C/16T Up to 5.0 / 2.0 GHz 24 MB AMD Radeon 860M Graphics 15-54W 50
AMD Ryzen AI 5 PRO 340 6C/12T Up to 4.8 / 2.0 GHz 22 MB AMD Radeon 840M Graphics 15-54W 50
型号 内核 /
讨论区
加速 / 基础
频率
总计
缓存
图形模型
AMD
cTDP NPU
TOPS
AMD Ryzen AI 7 350 8C/16T 高达5.0 / 2.0 GHz 24 MB 美国超微公司Radeon 86000万 图形卡 15-54W 50
美国超微公司Ryzen AI 5 340 6核/12线程 高达4.8 / 2.0 GHz 22 MB AMD Radeon 84000万 图形 15-54W 50
AMD Ryzen AI 7 PRO 350 8C/16T 高达5.0 / 2.0 GHz 24 MB 美国超微公司Radeon 86000万 图形卡 15-54W 50
美国超微公司Ryzen人工智能 5 PRO 340 6核/12线程 高达4.8 / 2.0 GHz 22 MB AMD Radeon 84000万 图形 15-54W 50


AMD Ryzen 200 and Ryzen 200 PRO Series Processors
With the AMD Ryzen 200 Series processors, AMD is bringing the power and capability of "Zen 4" into the FP8 platform infrastructure bringing AI capabilities further down the stack. Ryzen 200 PRO Series mobile processors are designed to offer highly efficient and exceptional performance for everyday professionals. With up to eight CPU cores and 16 threads, AMD RDNA 3 graphics and up to 16 NPU TOPS, the Ryzen 200 Series processors offer incredible AI processing capabilities for essential applications, and sustained performance and battery life for uninterrupted use.


AMD Ryzen 200和Ryzen 200 PRO系列处理器
凭借AMD Ryzen 200系列处理器,AMD将"Zen 4"的强大功能和能力引入FP8平台基础设施,将人工智能能力进一步扩展。Ryzen 200 PRO系列移动处理器旨在为日常专业人士提供高效且卓越的性能。配备多达八个CPU核心和16个线程,AMD RDNA 3图形以及高达16 NPU TOPS,Ryzen 200系列处理器为必要应用提供了令人难以置信的人工智能处理能力,并为不间断使用提供持久的性能和电池寿命。

Systems powered by Ryzen 200 and Ryzen 200 PRO Series processors are expected to be available starting in Q2 2025.

配备Ryzen 200和Ryzen 200 PRO系列处理器的系统预计将在2025年第二季度开始上市。

Model Cores /
Threads
Boost6 / Base
Frequency
Total
Cache
Graphics Model
AMD
cTDP NPU
TOPS
AMD Ryzen 9 270 8C/16T Up to 5.2 / 4.0 GHz 24MB AMD Radeon 780M Graphics 35-54W 16
AMD Ryzen 7 260 8C/16T Up to 5.1 / 3.8 GHz 24MB AMD Radeon 780M Graphics 35-54W 16
AMD Ryzen 7 250 8C/16T Up to 5.1 / 3.3 GHz 24MB AMD Radeon 780M Graphics 15-30W 16
AMD Ryzen 5 240 6C/12T Up to 5.0 / 4.3 GHz 22MB AMD Radeon 760M Graphics 35-54W 16
AMD Ryzen 5 230 6C/12T Up to 4.9 / 3.5 GHz 22MB AMD Radeon 760M Graphics 15-30W 16
AMD Ryzen 5 220 6C/12T Up to 4.9 / 3.2 GHz 22MB AMD Radeon 740M Graphics 15-30W N/A
AMD Ryzen 3 210 4C/8T Up to 4.7 / 3.0 GHz 12MB AMD Radeon 740M Graphics 15-30W N/A
AMD Ryzen 7 PRO 250 8C/16T Up to 5.1 / 3.3 GHz 24 MB
AMD Radeon 780M graphics 15-30W 16
AMD Ryzen 5 PRO 230 6C/12T Up to 4.9 / 3.5 GHz 22 MB
AMD Radeon 760M graphics 15-30W 16
AMD Ryzen 5 PRO 220 6C/12T Up to 4.9 / 3.2 GHz 22 MB AMD Radeon 740M graphics 15-30W N/A
AMD Ryzen 3 PRO 210 4C/8T Up to 4.7 / 3 GHz 12 MB
AMD Radeon 740M graphics 15-30W N/A
型号 内核 /
讨论区
提升6 / 基础
频率
总计
缓存
图形模型
AMD
cTDP NPU
TOPS
AMD Ryzen 9 270 8C/16T 最高可达5.2 / 4.0 GHz 24MB 美国超微公司Radeon 78000万显卡 35-54W 16
美国超微公司Ryzen 7 260 8C/16T 最高达到5.1 / 3.8 GHz 24MB 美国超微公司Radeon 78000万显卡 35-54W 16
AMD Ryzen 7 250 8C/16T 最高可达5.1 / 3.3 GHz 24MB 美国超微公司Radeon 78000万显卡 15-30W 16
美国超微公司 Ryzen 5 240 6核/12线程 最高可达5.0 / 4.3 GHz 22MB 美国超微公司 Radeon 76000万 图形 35-54W 16
美国超微公司锐龙5 230 6核/12线程 高达4.9 / 3.5 GHz 22MB 美国超微公司 Radeon 76000万 图形 15-30W 16
美国超微公司 Ryzen 5 220 6核/12线程 最高可达 4.9 / 3.2 GHz 22MB 美国超微公司 Radeon 74000万 显卡 15-30W 不适用
美国超微公司 Ryzen 3 210 4核8线程 高达4.7 / 3.0 GHz 12MB 美国超微公司 Radeon 74000万 显卡 15-30W 不适用
美国超微公司锐龙7 PRO 250 8C/16T 最高可达5.1 / 3.3 GHz 24 MB
AMD Radeon 78000万图形 15-30W 16
AMD Ryzen 5 PRO 230 6核/12线程 高达4.9 / 3.5 GHz 22 MB
AMD Radeon 76000万 图形 15-30W 16
AMD Ryzen 5 PRO 220 6核/12线程 最高可达 4.9 / 3.2 GHz 22 MB 美国超微公司Radeon 74000万显卡 15-30W 不适用
美国超微公司Ryzen 3 PRO 210 4核8线程 最高可达4.7 / 3 GHz 12 MB
美国超微公司Radeon 74000万显卡 15-30W 不适用


AMD PRO Technologies
AMD PRO Technologies provide users with enterprise-grade manageability and multi-layer security features, helping IT decision makers manage enterprise PC fleets at scale. With the recent addition of cloud-based recovery, supply chain security and additional detection and recovery processes, AMD PRO Technologies exceeds the requirements and gives users continuous protection against sophisticated attacks.


AMD PRO技术
AMD PRO技术为用户提供企业级可管理性和多层安全功能,帮助IT决策者大规模管理企业PC阵列。凭借最近增加的基于云的恢复、供应链安全以及额外的检测和恢复流程,AMD PRO技术超越了要求,并为用户提供对复杂攻击的持续保护。

OEM Partners and Customers Continue to Lead AI PC Adoption with New Ryzen-Powered Systems
OEM partners continue to announce new AI-powered PCs and workstations featuring AMD Ryzen processors. With incredible power, performance and compatibility, these news systems exceed expectations for next-generation Copilot+ PCs. At CES this year AMD is deepening its relationships with major OEM partners, introducing a new strategic expansion with Dell, bringing new Dell Pro systems to the market powered by AMD Ryzen AI PRO processors later this year.

OEM合作伙伴和客户继续引领AI PC的采用,推出全新的Ryzen驱动系统
OEM合作伙伴继续宣布新的AI驱动PC和工作站,配备AMD Ryzen处理器。凭借强大的性能和兼容性,这些新系统超越了对下一代Copilot+ PC的期望。今年在CES上,AMD正在加深与主要OEM合作伙伴的关系,推出与戴尔的新战略扩展,预计在今年晚些时候推出由AMD Ryzen AI PRO处理器驱动的新戴尔Pro系统。

"It's been incredible to see AMD and Microsoft's longstanding partnership move into the next wave of technology, bringing AI innovation to our OEM partners," said Pavan Davuluri, CVP Windows + Devices, Microsoft. "We're thrilled to see the expansion of Copilot+ PCs with AMD's new Ryzen AI products for professionals, content creators, and mainstream consumers alike."

"看到美国超微公司与微软长期合作关系迈向下一个科技浪潮,给我们的OEM合作伙伴带来人工智能创新,真令人不可思议,"微软Windows + 设备部门副总裁Pavan Davuluri说,"我们很高兴看到搭载美国超微公司新款Ryzen人工智能产品的Copilot+ PC的扩展,这些产品适用于专业人士、内容创作者和大众消费者。"

"ASUS has always been on the cutting edge of technology, working to bring the highest level of performance to our customers," said Samson Hu, co-CEO, ASUS. "Today, we are announcing new Ryzen-powered systems, bringing best-in-class processing power to enable our customers to be on the forefront of AI innovation."

"华硕一直走在科技的最前沿,致力于为我们的客户带来最高水平的性能,"华硕联合首席执行官Samson Hu说,"今天,我们宣布全新搭载Ryzen的系统,为客户带来一流的处理能力,使他们能够走在人工智能创新的最前沿。"

"In collaboration with AMD, HP identified pain points in customer workflows that the new HP ZBook Ultra G1a and HP Z2 Mini G1a solve. Powered by AMD's Ryzen AI Max PRO Series processors, these workstations will be the first to offer this architecture on a workstation," said Jim Nottingham, Senior Vice President and Division President, Advanced Compute and Solutions, HP Inc. "By redefining the boundaries of what is possible on highly mobile or mini desk-side workstations, together we're bringing customers the ability to tackle complex professional ISV and data science workflows simultaneously, while seamlessly integrating high-performance computing with the functionality of an AI PC."

"在与美国超微公司合作的过程中,惠普识别出客户工作流程中的痛点,而新的惠普ZBook Ultra G1a和HP Z2 Mini G1a正是为了解决这些问题。这些工作站搭载美国超微公司Ryzen AI Max PRO系列处理器,将是第一款在工作站上提供这种架构的产品,"惠普高级副总裁及高级计算与解决方案部总裁Jim Nottingham说,"通过重新定义超移动或迷你桌面工作站在可能性上的界限,我们共同为客户带来同时处理复杂专业ISV和数据科学工作流程的能力,同时无缝集成高性能计算与人工智能计算机的功能。"

"At Lenovo, we believe meaningful innovation stems from strong partnerships. Our collaboration with AMD is a testament to this, as we work together to shape the future of computing with advanced, AI-driven solutions," said Luca Rossi, President of Lenovo Intelligent Devices Group. "By leveraging AMD's latest generation of cutting-edge platforms, we're laying the groundwork for exciting new products designed to enhance personalization, boost productivity, and provide robust security. Stay tuned as we continue to empower users—whether creative professionals, businesses, or gamers—with groundbreaking solutions that push the boundaries of performance, collaboration, and innovation."

"在LENOVO B2401,我们相信有意义的创新源于强大的合作伙伴关系。我们与美国超微公司的合作正是这一点的证明,随着我们共同努力塑造未来计算的高级人工智能驱动解决方案,"LENOVO B2401智能设备组总裁Luca Rossi说,"通过利用美国超微公司最新一代的尖端平台,我们正在为激动人心的新产品奠定基础,旨在增强个性化、提升生产力并提供强大的安全性。请继续关注,我们将继续赋能用户——无论是创意专业人士、企业还是游戏玩家——以突破性能、协作和创新界限的突破性解决方案。"

"At MSI we are proud to build products that help gamers, creators and professionals' level up their computing experiences," said Eric Kuo, the Executive Vice President & NB BU GM of MSI. "Powered by new Ryzen AI 300 Series processors, the new Stealth A16 AI+ and A18 AI+ laptops bring a new level of performance for our customers."

"在MSI,我们自豪地制造出能帮助游戏玩家、创作者和专业人士提升计算体验的产品,"MSI的执行副总裁兼NB业务总经理Eric Kuo说。"新款Stealth A16 AI+和A18 AI+笔记本电脑搭载最新的Ryzen AI 300系列处理器,为我们的客户带来了全新的性能水平。"

Customers around the globe are on the forefront of AI PC adoption, enabling their workforce to seamlessly innovate faster at all stages of their business.

全球客户在AI个人电脑的采用方面处于前沿,使他们的员工能够在业务的各个阶段迅速创新。

"Altair Inspire accelerates simulation-driven design, making fluid simulation accessible to all users. Running fluid simulation code on GPU boosts performance and scalability, enabling users to innovate faster and more efficiently," said, Sam Mahalingam, CTO, Altair. "By leveraging the capabilities of the ROCm/HIP stack the Altair team was able to rapidly expand GPU support to AMD Radeon, including the Ryzen AI Max PRO."

"Altair Inspire加速了以仿真驱动的设计,使流体仿真对所有用户都变得可访问。运行在GPU上的流体仿真代码提升了性能和可扩展性,使用户能够更快、更高效地创新,"Altair首席技术官Sam Mahalingam说。"通过利用ROCm/HIP堆栈的能力,Altair团队能够快速扩展对AMD Radeon的GPU支持,包括Ryzen AI Max PRO。"

"KeyShot is thrilled to extend support for KeyShot Studio's high-speed GPU rendering to include AMD Radeon," said Henrik Wann Jensen, Chief Scientist, KeyShot. "The seamless enablement provided by ROCm/HIP tools was remarkable, and we are particularly excited about the substantial frame buffer available on the Ryzen AI Max PRO, which significantly enhances our rendering capabilities."

"KeyShot很高兴能够扩展对KeyShot Studio的高速GPU渲染的支持,以包括AMD Radeon,"KeyShot首席科学家Henrik Wann Jensen说。"ROCm/HIP工具提供的无缝支持令人瞩目,我们特别为Ryzen AI Max PRO上可用的大量帧缓冲感到兴奋,这显著增强了我们的渲染能力。"

Supporting Resources

支持资源

  • Visit the AMD CES 2025 page for more information
  • Learn more about Ryzen mobile processors
  • Learn more about Ryzen mobile workstation processors
  • Learn more about Ryzen PRO mobile processors
  • Learn more about AMD PRO Technologies
  • Learn more about Ryzen AI
  • Learn more about Ryzen AI Software
  • Become a fan of AMD on Facebook
  • Follow AMD on X
  • 访问AMD CES 2025页面以获取更多信息
  • 了解更多关于Ryzen移动处理器的信息
  • 了解更多关于Ryzen移动工作站处理器的信息
  • 了解更多关于Ryzen PRO移动处理器
  • 了解更多关于AMD PRO技术
  • 了解更多关于Ryzen人工智能
  • 了解更多关于Ryzen人工智能软件
  • 在Facebook上关注AMD
  • 在X上关注美国超微公司

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.

关于美国超微公司
超过50年来,AMD一直在高性能计算、图形和可视化技术方面推动创新。数十亿人、领先的财富500强企业以及全球前沿的科学研究机构每天依赖AMD技术来改善他们的生活、工作和娱乐。AMD员工专注于构建领导级的高性能和适应性产品,突破可能的界限。有关AMD如何支持今天并激励明天的更多信息,请访问AMD(纳斯达克:AMD)网站、博客、LinkedIn和X页面。

Cautionary Statement

警示声明

This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products, including Ryzen AI Max, Ryzen AI 300 Series and Ryzen 200 Series processors and Ryzen AI Max PRO, Ryzen AI 300 PRO and Ryzen 200 PRO Series processors as well as expected benefits of AMD's OEM partnerships, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation's dominance of the microprocessor market and its aggressive business practices; Nvidia's dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD's products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD's ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD's products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD's products; AMD's reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD's products; AMD's reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD's internal business processes and information systems; compatibility of AMD's products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD's ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD's business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD's ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD's notes, the guarantees of Xilinx's notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD's business and AMD's ability to integrate acquired businesses; AMD's ability to complete the acquisition of ZT Systems; impact of any impairment of the combined company's assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD's ability to attract and retain qualified personnel; and AMD's stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's most recent reports on Forms 10-K and 10-Q.

本新闻稿包含了有关美国超微公司的前瞻性陈述,如AMD产品的特性、功能、性能、可用性、时间及预期利益,包括Ryzen AI Max、Ryzen AI 300系列和Ryzen 200系列微处理器,以及Ryzen AI Max PRO、Ryzen AI 300 PRO和Ryzen 200 PRO系列微处理器,以及AMD的OEM合作伙伴关系的预期利益,这些陈述是根据1995年《私人证券诉讼改革法》的安全港条款作出的。前瞻性陈述通常以“将”、“可能”、“预期”、“相信”、“计划”、“打算”、“项目”等类似词汇进行识别。投资者应注意,这份新闻稿中的前瞻性陈述基于当前的信念、假设和预期,仅代表新闻稿发布之日的意见,并涉及可能导致实际结果与当前预期严重不同的风险和不确定性。这些陈述受一些已知和未知风险及不确定性的约束,其中许多是难以预测并通常超出美国超微公司的控制范围,可能导致实际结果及其他未来事件与前瞻性信息及陈述中的表达、暗示或预测出现重大差异。可能导致实际结果与当前预期重大不同的关键因素包括但不限于:英特尔在微处理器市场的主导地位及其激进的商业行为;英伟达在图形处理单元市场的主导地位及其激进的商业行为;美国超微产品销售的竞争市场;半导体行业的周期性特点;美国超微产品销售相关行业的市场状况;美国超微按时推出预期特性和性能水平的能力;重要客户的流失;经济和市场的不确定性;季度和季节性销售模式;美国超微对于技术或其他知识产权的有效保护能力;不利的货币兑换率波动;第三方制造商及时生产美国超微产品的能力(数量足够且使用竞争性技术);必需的设备、材料、基板或制造工艺的可用性;实现美国超微产品预期制造产量的能力;美国超微从其半定制SoC产品中产生营业收入的能力;潜在的安防-半导体漏洞;潜在的安防-半导体事件,包括IT宕机、数据丢失、数据泄露和网络攻击;涉及美国超微产品订购和运输的不确定性;美国超微对于第三方知识产权的依赖,以设计和推出新产品;美国超微对于第三方公司在主板、软件、内存和其他计算机平台元件的设计、制造和供应的依赖;美国超微对于微软和其他软件供应商支持的依赖,以设计和开发能够在美国超微产品上运行的软件;美国超微对于第三方分销商和增值板合作伙伴的依赖;对美国超微内部业务流程和信息系统修改或中断的影响;美国超微产品与某些或所有行业标准软件和硬件的兼容性;与产品缺陷有关的成本;美国超微供应链的效率;美国超微对第三方供应链物流职能的依赖;美国超微有效控制其产品在灰色市场上销售的能力;气候变化对美国超微业务的长期影响;政府行动和法规的影响,如出口法规、关税和贸易保护措施;美国超微实现其递延税资产的能力;潜在的税务责任;当前及未来的索赔及诉讼;环保法律、冲突矿产相关条款及其他法律或法规的影响;政府、投资者、客户及其他利益相关者对企业责任事务的期望变化;与人工智能的负责使用相关的问题;协议对美国超微票据、赛灵思票据的担保及循环信贷协议施加的限制;收购、合资和/或投资对美国超微业务的影响以及美国超微整合收购企业的能力;美国超微完成收购Zt Systems的能力;合并公司资产减值的影响;政治、法律及经济风险和自然灾害;未来技术许可证购买的减值;美国超微吸引和留住合格人才的能力;以及美国超微股价的波动性。投资者被敦促详细审查美国超微在证券交易委员会的文件中列出的风险和不确定性,包括但不限于美国超微最新的10-K表格和10-Q表格报告。

2025 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, RDNA, Ryzen, XDNA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Certain AMD technologies may require third-party enablement or activation. Supported features may vary by operating system. Please confirm with the system manufacturer for specific features. No technology or product can be completely secure.

2025 美国超微公司。版权所有。AMD、AMD箭头logo、Radeon、RDNA、Ryzen、XDNA及其组合是美国超微公司的商标。某些AMD技术可能需要第三方启用或激活。支持的功能可能因操作系统而异。请与系统制造商确认具体功能。没有任何技术或产品可以完全安全。

The information contained herein is for informational purposes only and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change.

本文件中包含的信息仅供参考,并可能随时更改,恕不另行通知。新闻稿中显示的时间表、路线图和/或产品发布日期仅为计划,可能会有所更改。

Contact:
Stacy MacDiarmid
AMD Communications
+1 (512) 658-2265
Stacy.MacDiarmid@amd.com

联系:
斯泰西·麦克迪尔米德
通信-半导体
+1 (512) 658-2265
Stacy.MacDiarmid@amd.com

A photo accompanying this announcement is available at

此公告的配图可在此查看

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1 Trillions of Operations per Second (TOPS) for an AMD Ryzen processor is the maximum number of operations per second that can be executed in an optimal scenario and may not be typical. TOPS may vary based on several factors, including the specific system configuration, AI model, and software version. GD-243.
2 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
3 Based on AMD product specifications and competitive products announced as of Oct 2024. AMD Ryzen AI PRO 300 Series processors' NPU offers up to 55 peak TOPS. This is the most TOPS offered on any system found in enterprise today. AI PC is defined as a laptop PC with a processor that includes a neural processing unit (NPU). STXP-06.
4 Testing as of Sept 2024 by AMD performance labs on a Lenovo ThinkPad T14s Gen 6 with an AMD Ryzen AI 7 PRO 360 processor @22W, Radeon 880M graphics, 32GB RAM, 1TB SSD, VBS=ON, Windows 11 Pro vs. a Dell Latitude 7450 with an Intel Core Ultra 7 165U processor @15W (vPro enabled), Intel Integrated Graphics, VBS=ON, 32GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Professional in the application(s) (Best Performance Mode): Cinebench R24 nT. Laptop manufactures may vary configurations yielding different results. STXP-13.
5 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
6 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.

_______________________________________
AMD Ryzen处理器的每秒万亿次操作(TOPS)是在最佳情况下可以执行的最大操作数,这可能并不典型。TOPS可能会根据多个因素而变化,包括特定的系统配置、人工智能模型和软件版本。GD-243。
提升时钟频率是CPU在运行突发工作负载时可以达到的最高频率。提升时钟的可实现性、频率和可持续性将依据多个因素而变化,包括但不限于:热条件以及应用和工作负载的变化。GD-150。
2. 基于AMD产品规格和截至2024年10月宣布的竞争产品。AMD Ryzen AI PRO 300系列处理器的NPU提供高达55个TOPS的峰值性能。这是当今企业中任何系统中所提供的最高TOPS。AI PC被定义为具有包括神经处理单元(NPU)的处理器的笔记本电脑。STXP-06。
截至2024年9月在美国超微公司的性能实验室对LENOVO B2401 ThinkPad T14s Gen 6进行的测试,配备AMD Ryzen AI 7 PRO 360处理器@22W,Radeon 88000万显卡,32Gb内存,1Tb SSD,VBS=开启,Windows 11 Pro,与配备英特尔-T的Core Ultra 7 165U处理器@15W(启用vPro)、英特尔集成显卡、VBS=开启,32Gb内存,512Gb NVMe SSD的戴尔Latitude 7450进行比较,在应用程序中(最佳性能模式):Cinebench R24 nt。笔记本生产商可能会因配置变化而产生不同结果。STXP-13。
5 Boost时钟频率是在运行突发工作负载时CPU可达到的最大频率。Boost时钟的可实现性、频率和可持续性将根据多种因素而有所不同,包括但不限于:热条件以及应用程序和工作负载的变化。GD-150。
6 Boost Clock Frequency是CPU在运行突发工作负载时可以达到的最大频率。提升时钟的可实现性、频率和持续性将根据多种因素而变化,包括但不限于:热态条件和应用程序以及工作负载的变化。GD-150。


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