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NXP, and Foxconn Industrial Internet Ltd. Announced Strategic Partnership to Accelerate Automotive Innovation

NXP, and Foxconn Industrial Internet Ltd. Announced Strategic Partnership to Accelerate Automotive Innovation

恩智浦和富士康工业互联网有限公司宣布建立战略合作伙伴关系加速汽车创新
Benzinga Real-time News ·  2021/12/16 05:56

NXP Semiconductors N.V. (NASDAQ:NXPI), a leading automotive semiconductor company, has announced a strategic partnership with Foxconn Industrial Internet Ltd., a subsidy company of Foxconn group, (FII;601138.SH) to transform the car into the ultimate edge device. NXP will provide FII with its comprehensive portfolio of automotive technologies. The initial phase of the joint project will focus on the development of a full digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable leading global automotive OEMs and Tier Ones to deliver vivid in-vehicle experiences for their customers. The digital cockpit solution is expected to start mass production in 2023. The companies aim to expand the relationship into UWB-based secure car access, and safe automated driving, augmented by NXP's leading radar solutions. "FII is committed to providing clients with an automated, connected platform and big data-based technology, services and solutions, in order to create application platforms across cloud computing, mobile devices, Internet of Things (IoT), artificial intelligence (AI), smart networks, robotics and automation, among other industries," said Brand Cheng, CEO at Foxconn Industrial Internet Co. Ltd. "We believe that EVs and emerging technology innovation are derived from computing power, system integration, and energy management. We are pleased to join forces with NXP to strengthen the development blueprint of FII and drive innovation for connected cars by leveraging NXP's leading automotive technology." "As a leading global automotive semiconductor supplier, NXP has combined its strong heritage in safety, security and quality with innovation across the vehicle's domains," said Ron Martino, Executive Vice President and General Manager of Edge Processing for NXP Semiconductors. "We are excited to extend the benefits of our i.MX 8 series processors for a full digital cockpit solution.to FII, a leading technology services provider, and look forward to a long-term strategic partnership, which will provide system-level solutions for the realization of next-generation automotive innovation."

领先的汽车半导体公司恩智浦半导体(纳斯达克:NXPI)宣布与富士康集团的补贴公司富士康工业互联网有限公司(FII;601138.SH)建立战略合作伙伴关系,将这款车转变为终极边缘设备。恩智浦将向FII提供其全面的汽车技术组合。联合项目的第一阶段将专注于开发基于恩智浦i.MX 8 QuadMax的全数字驾驶舱解决方案。该平台将包括数字集群和平视显示器(HUD)系统,这将使领先的全球汽车OEM和Tier One能够为他们的客户提供生动的车载体验。数字驾驶舱解决方案预计将于2023年开始批量生产。两家公司的目标是通过恩智浦领先的雷达解决方案,将合作关系扩展到基于UWB的安全汽车接入和安全自动驾驶领域。富士康工业互联网有限公司首席执行官Brand Cheng表示:“FII致力于为客户提供自动化、互联平台和基于大数据的技术、服务和解决方案,以创建跨越云计算、移动设备、物联网(IoT)、人工智能(AI)、智能网络、机器人和自动化等行业的应用平台。”我们相信电动汽车和新兴技术创新源于计算能力、系统集成和能源管理。我们很高兴与恩智浦联手,加强FII的发展蓝图,并通过利用恩智浦领先的汽车技术来推动联网汽车的创新。罗恩·马蒂诺说:“作为全球领先的汽车半导体供应商,恩智浦将其在安全、安保和质量方面的强大传统与汽车领域的创新结合在一起。”, 恩智浦半导体执行副总裁兼边缘加工部总经理。我们很高兴能将我们i.MX 8系列处理器的好处扩展到领先的技术服务提供商FII公司,提供全数字驾驶舱解决方案,并期待着建立长期的战略合作伙伴关系,这将为实现下一代汽车创新提供系统级的解决方案。“

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