In early March, ten giants including$英特尔 (INTC.US)$.$台积电 (TSM.US)$. Samsung and$Asante Gold Corp (ASE.CA)$announced the establishment of a universal chip interconnection standard - UCle, to standardize Chiplet technology. This standard also provides specifications at the "advanced packaging"level. covering all hiah-density silicon bridge-based technologies such as EMIB and InFO.
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