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Applied Materials | 424B2: Prospectus

Applied Materials | 424B2: Prospectus

應用材料 | 424B2:募資說明書
美股sec公告 ·  06/06 08:46
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Applied Materials, Inc., a leading provider of manufacturing equipment, services, and software to the semiconductor industry, has announced the issuance of senior notes due 20XX. The notes, offered globally, will pay interest semi-annually beginning on a specified date in 2024. The company may redeem the notes at any time prior to maturity at specified redemption prices. The offering price, underwriting discount, and proceeds to Applied Materials before expenses are yet to be determined. The issuance is subject to completion and is dated June 6, 2024. The notes are expected to be delivered to investors in registered book-entry form through The Depository Trust Company and its participants, including Clearstream Banking S.A. and Euroclear Bank, on a date around 2024, following the T+3 settlement cycle. The joint book-running managers for the offering include BofA Securities, J.P. Morgan, Citigroup, Mizuho, MUFG, and Wells Fargo Securities.
Applied Materials, Inc., a leading provider of manufacturing equipment, services, and software to the semiconductor industry, has announced the issuance of senior notes due 20XX. The notes, offered globally, will pay interest semi-annually beginning on a specified date in 2024. The company may redeem the notes at any time prior to maturity at specified redemption prices. The offering price, underwriting discount, and proceeds to Applied Materials before expenses are yet to be determined. The issuance is subject to completion and is dated June 6, 2024. The notes are expected to be delivered to investors in registered book-entry form through The Depository Trust Company and its participants, including Clearstream Banking S.A. and Euroclear Bank, on a date around 2024, following the T+3 settlement cycle. The joint book-running managers for the offering include BofA Securities, J.P. Morgan, Citigroup, Mizuho, MUFG, and Wells Fargo Securities.
半導體制造設備、服務和軟件的領先供應商應用材料公司宣佈發行到20XX年到期的高級票據。這些票據全球發行,將在2024年指定的日期開始半年支付一次利息。公司可以在到期之前的任何時間以指定的贖回價格贖回票據。發行價、承銷折扣以及應用材料在扣除開支前的收益尚未確定。此次發行須待完成,並於2024年6月6日起算。這些票據預計將以T+3結算週期後的2024年某日通過美國存託公司及其參與者(包括Clearstream銀行和Euroclear Bank)以已註冊的賬簿形式交付給投資者。本次發行的聯合主承銷商包括美國銀行證券、J.P. Morgan、花旗集團、瑞穗、三菱日聯和富國證券。
半導體制造設備、服務和軟件的領先供應商應用材料公司宣佈發行到20XX年到期的高級票據。這些票據全球發行,將在2024年指定的日期開始半年支付一次利息。公司可以在到期之前的任何時間以指定的贖回價格贖回票據。發行價、承銷折扣以及應用材料在扣除開支前的收益尚未確定。此次發行須待完成,並於2024年6月6日起算。這些票據預計將以T+3結算週期後的2024年某日通過美國存託公司及其參與者(包括Clearstream銀行和Euroclear Bank)以已註冊的賬簿形式交付給投資者。本次發行的聯合主承銷商包括美國銀行證券、J.P. Morgan、花旗集團、瑞穗、三菱日聯和富國證券。
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