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Qualcomm | 8-K: Entry into a Credit Agreement

Qualcomm | 8-K: Entry into a Credit Agreement

高通 | 8-K：簽訂信貸協議
美股sec公告 ·  08/09 16:08
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On August 8, 2024, Qualcomm Incorporated entered into a new Credit Agreement with Bank of America, N.A., serving as the administrative agent, swing line lender, and a letter of credit issuer. This agreement replaces Qualcomm's previous Credit Agreement from December 8, 2020. The new Credit Agreement provides Qualcomm with $4.0 billion in senior unsecured revolving loans, maturing on August 8, 2029, with the option to extend. The funds may be used for general corporate purposes, including working capital and capital expenditures. The agreement allows borrowing in various currencies and includes interest rates based on the Term SOFR Rate plus a margin or the Base Rate plus a margin, along with a facility fee. The terms also include customary representations, warranties, covenants, and events of default, with specific requirements on the Company's debt ratios. Concurrently, Qualcomm terminated all commitments under the previous Credit Agreement, which had no outstanding borrowings at the time of termination.
On August 8, 2024, Qualcomm Incorporated entered into a new Credit Agreement with Bank of America, N.A., serving as the administrative agent, swing line lender, and a letter of credit issuer. This agreement replaces Qualcomm's previous Credit Agreement from December 8, 2020. The new Credit Agreement provides Qualcomm with $4.0 billion in senior unsecured revolving loans, maturing on August 8, 2029, with the option to extend. The funds may be used for general corporate purposes, including working capital and capital expenditures. The agreement allows borrowing in various currencies and includes interest rates based on the Term SOFR Rate plus a margin or the Base Rate plus a margin, along with a facility fee. The terms also include customary representations, warranties, covenants, and events of default, with specific requirements on the Company's debt ratios. Concurrently, Qualcomm terminated all commitments under the previous Credit Agreement, which had no outstanding borrowings at the time of termination.
2024年8月8日，高通公司與美國銀行有限責任公司簽署了一份新的授信協議，美國銀行有限責任公司擔任行政代理、搖擺額度貸款人和信用證發行人。該協議取代了高通公司2020年12月8日的先前授信協議。新的授信協議爲高通公司提供了40億美元的無擔保高級循環貸款，在2029年8月8日到期，有續約選項。這筆資金可以用於一般企業用途，包括營運資本和資本支出。該協議允許以各種貨幣借款，幷包括基於期限SOFR利率加邊際或基準利率加邊際以及設施費用等利率。條款還包括習慣的陳述、保證、契約和違約事件，並具有公司債務比率的具體要求。同時，高通公司終止了先前授信協議下的所有承諾，在終止時未有未償還款項。
2024年8月8日，高通公司與美國銀行有限責任公司簽署了一份新的授信協議，美國銀行有限責任公司擔任行政代理、搖擺額度貸款人和信用證發行人。該協議取代了高通公司2020年12月8日的先前授信協議。新的授信協議爲高通公司提供了40億美元的無擔保高級循環貸款，在2029年8月8日到期，有續約選項。這筆資金可以用於一般企業用途，包括營運資本和資本支出。該協議允許以各種貨幣借款，幷包括基於期限SOFR利率加邊際或基準利率加邊際以及設施費用等利率。條款還包括習慣的陳述、保證、契約和違約事件，並具有公司債務比率的具體要求。同時，高通公司終止了先前授信協議下的所有承諾，在終止時未有未償還款項。
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