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6-K: ESMC Breaks Ground on Dresden Fab

6-K: ESMC Breaks Ground on Dresden Fab

6-K:ESMC德累斯頓工廠破土動工
美股SEC公告 ·  2024/08/20 21:23

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ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, commenced groundbreaking for Europe's first FinFET-capable pure-play foundry in Dresden, Germany. The European Commission approved €5B in state aid for the project, with total investments exceeding €10B. The facility will produce 40,000 300mm wafers monthly using 28/22nm CMOS and 16/12nm FinFET processes.The new fab is expected to create 2,000 direct high-tech jobs and numerous indirect positions throughout the EU supply chain. ESMC commits to sustainability standards, including energy-efficient construction, water reclamation, and LEED certification. Construction is scheduled to begin later this year.The project represents a significant advancement for European semiconductor manufacturing, particularly serving the automotive and industrial sectors. The collaboration strengthens TSMC's Grand Alliance and demonstrates its commitment to fostering innovation across Europe while enhancing the region's semiconductor ecosystem and digital sovereignty.
ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, commenced groundbreaking for Europe's first FinFET-capable pure-play foundry in Dresden, Germany. The European Commission approved €5B in state aid for the project, with total investments exceeding €10B. The facility will produce 40,000 300mm wafers monthly using 28/22nm CMOS and 16/12nm FinFET processes.The new fab is expected to create 2,000 direct high-tech jobs and numerous indirect positions throughout the EU supply chain. ESMC commits to sustainability standards, including energy-efficient construction, water reclamation, and LEED certification. Construction is scheduled to begin later this year.The project represents a significant advancement for European semiconductor manufacturing, particularly serving the automotive and industrial sectors. The collaboration strengthens TSMC's Grand Alliance and demonstrates its commitment to fostering innovation across Europe while enhancing the region's semiconductor ecosystem and digital sovereignty.
ESMC是台積電、博世、英飛凌和NXP的合資企業,在德國德累斯頓啓動了歐洲首個具有FinFEt能力的純代工廠的奠基儀式。歐盟委員會批准了項目的50億歐元國家援助,總投資超過100億歐元。該設施將每月生產40,000片300mm硅片,使用28/22nm CMOS和16/12nm FinFEt工藝。新工廠預計將創造2,000個直接高科技職位,以及整個歐盟供應鏈中的衆多間接職位。ESMC承諾遵守可持續發展標準,包括節能施工、水回收和LEED認證。施工計劃將在今年晚些時候開始。該項目代表着歐洲半導體製造的重要進步,特別是在汽車和工業部門服務。此次合作加強了台積電的宏大聯盟,展示了其在促進歐洲創新方面的承諾,同時增強該地域板塊的半導體生態系統和數字主權。
ESMC是台積電、博世、英飛凌和NXP的合資企業,在德國德累斯頓啓動了歐洲首個具有FinFEt能力的純代工廠的奠基儀式。歐盟委員會批准了項目的50億歐元國家援助,總投資超過100億歐元。該設施將每月生產40,000片300mm硅片,使用28/22nm CMOS和16/12nm FinFEt工藝。新工廠預計將創造2,000個直接高科技職位,以及整個歐盟供應鏈中的衆多間接職位。ESMC承諾遵守可持續發展標準,包括節能施工、水回收和LEED認證。施工計劃將在今年晚些時候開始。該項目代表着歐洲半導體製造的重要進步,特別是在汽車和工業部門服務。此次合作加強了台積電的宏大聯盟,展示了其在促進歐洲創新方面的承諾,同時增強該地域板塊的半導體生態系統和數字主權。
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