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6-K: Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

6-K: Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

6-K：Amkor與台積電擴大合作伙伴關係並在亞利桑那州開展先進封裝合作
美股SEC公告 ·  10/04 05:21

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Amkor Technology, Inc. and Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) have announced a memorandum of understanding to expand their partnership by collaborating on advanced packaging and test capabilities in Arizona. This collaboration aims to enhance the semiconductor ecosystem in the region and will involve Amkor providing turnkey advanced packaging and test services from their planned facility in Peoria, Arizona. TSMC will utilize these services to support its customers, especially those using TSMC's advanced wafer fabrication facilities in Phoenix. The agreement will accelerate product cycle times due to the proximity of TSMC's front-end fab and Amkor's back-end facility. The companies will jointly define specific packaging technologies to meet customer needs, emphasizing geographic flexibility and the development of a comprehensive semiconductor manufacturing ecosystem in the United States. The partnership is seen as a strategic move to drive innovation, advance semiconductor technology, and ensure resilient supply chains. Both companies have a history of collaboration and are committed to providing seamless technology alignment for customers globally.
Amkor Technology, Inc. and Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) have announced a memorandum of understanding to expand their partnership by collaborating on advanced packaging and test capabilities in Arizona. This collaboration aims to enhance the semiconductor ecosystem in the region and will involve Amkor providing turnkey advanced packaging and test services from their planned facility in Peoria, Arizona. TSMC will utilize these services to support its customers, especially those using TSMC's advanced wafer fabrication facilities in Phoenix. The agreement will accelerate product cycle times due to the proximity of TSMC's front-end fab and Amkor's back-end facility. The companies will jointly define specific packaging technologies to meet customer needs, emphasizing geographic flexibility and the development of a comprehensive semiconductor manufacturing ecosystem in the United States. The partnership is seen as a strategic move to drive innovation, advance semiconductor technology, and ensure resilient supply chains. Both companies have a history of collaboration and are committed to providing seamless technology alignment for customers globally.
Amkor Technology, Inc.和台積電製造股份有限公司（TSMC）已宣佈簽署諒解備忘錄，以擴大合作伙伴關係，在亞利桑那州就愛文思控股和測試能力展開合作。該合作旨在增強該地區的半導體生態系統，並將涉及愛文思控股在亞利桑那州皮奧利亞計劃設施提供一攬子愛文思控股高級封裝和測試服務。台積電將利用這些服務來支持其客戶，尤其是那些使用台積電在鳳凰城的先進硅片製造設施的客戶。由於台積電前端晶圓廠和愛文思控股後端設施之間的近距離，該協議將加快產品週期時間。雙方公司將共同定義滿足客戶需求的特定封裝技術，強調地理靈活性和在美國發展綜合半導體制造生態系統。這一合作被視爲推動創新、推進半導體技術並確保彈性供應鏈的戰略舉措。兩家公司歷史上有合作經驗，致力於爲全球客戶提供無縫的科技對齊。
Amkor Technology, Inc.和台積電製造股份有限公司（TSMC）已宣佈簽署諒解備忘錄，以擴大合作伙伴關係，在亞利桑那州就愛文思控股和測試能力展開合作。該合作旨在增強該地區的半導體生態系統，並將涉及愛文思控股在亞利桑那州皮奧利亞計劃設施提供一攬子愛文思控股高級封裝和測試服務。台積電將利用這些服務來支持其客戶，尤其是那些使用台積電在鳳凰城的先進硅片製造設施的客戶。由於台積電前端晶圓廠和愛文思控股後端設施之間的近距離，該協議將加快產品週期時間。雙方公司將共同定義滿足客戶需求的特定封裝技術，強調地理靈活性和在美國發展綜合半導體制造生態系統。這一合作被視爲推動創新、推進半導體技術並確保彈性供應鏈的戰略舉措。兩家公司歷史上有合作經驗，致力於爲全球客戶提供無縫的科技對齊。
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