Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding
Revasum Inc and Asahi Diamond America, Inc Join Forces to Revolutionize Silicon Carbide Wafer Grinding
SAN LUIS OBISPO, Calif., Jan. 15, 2024 /PRNewswire/ -- Revasum Inc, a global leader in semiconductor manufacturing equipment, and Asahi Diamond America, Inc, a renowned provider of diamond and cubic boron nitride tools, are pleased to announce their strategic collaboration aimed at enhancing silicon carbide (SiC) wafer grinding.
加利福尼亞州聖路易斯奧比斯波，2024年1月15日 /PRNewswire/ — 全球半導體制造設備領導者Revasum Inc和著名的金剛石和立方氮化硼工具供應商朝日鑽石美國公司很高興地宣佈了旨在加強碳化硅（SiC）晶圓研磨的戰略合作。
The collaboration centers around the utilization of Revasum's industry-leading 7AF-HMG Silicon Carbide Grinder, a cutting-edge solution specifically designed for the unique challenges posed by 150mm and 200mm silicon carbide wafers. This collaboration brings together Revasum's expertise in semiconductor grinding and Asahi Diamond America's cutting-edge abrasive technology, marking a significant step forward in silicon carbide wafer manufacturing.
合作的中心是利用Revasum行業領先的7AF-HMG碳化硅研磨機，這是一種專爲應對150mm和200mm碳化硅晶圓構成的獨特挑戰而設計的尖端解決方案。此次合作彙集了Revasum在半導體研磨方面的專業知識和美國朝日鑽石公司的尖端磨料技術，標誌着碳化硅晶圓製造向前邁出了重要的一步。
The 7AF-HMG is distinguished by its hard material optimized grind engine that quickly and precisely thins and planarizes 150mm and 200mm silicon carbide wafers. Its advanced features and precision make it a game changer in the industry, ensuring highly efficient and productive processing of bare substrates and device wafers at customer facilities.
7AF-HMG 的特點是其經過硬質材料優化的研磨引擎，可快速精確地將 150 毫米和 200 毫米的碳化硅晶片變薄和平面化。其先進的功能和精度使其成爲行業的遊戲規則改變者，可確保在客戶設施中對裸基板和設備晶圓進行高效和高產的處理。
Scott Jewler, CEO of Revasum Inc, expressed his enthusiasm stating, "Our work with Asahi Diamond America is a testament to our commitment to innovation and excellence in semiconductor manufacturing. The 7AF-HMG Silicon Carbide Grinder is a groundbreaking solution that addresses the unique challenges of silicon carbide wafers, and this cooperation will propel the industry forward by improving efficiency and performance."
Revasum Inc首席執行官斯科特·朱勒表達了他的熱情，他說：“我們與朝日鑽石美國公司的合作證明了我們對半導體制造創新和卓越的承諾。7AF-HMG 碳化硅研磨機是解決碳化硅晶圓獨特挑戰的開創性解決方案，這種合作將通過提高效率和性能推動行業向前發展。”
Koichi "Ken" Kikuchi, President of Asahi Diamond America, Inc, echoed this sentiment, saying, "Asahi Diamond America is thrilled to collaborate with Revasum Inc to elevate silicon carbide wafer grinding to new heights. Our cutting-edge grind wheels combined with Revasum's advanced tools will empower semiconductor manufacturers to achieve unprecedented precision and efficiency in silicon carbide wafer processing."
朝日鑽石美國公司總裁菊池幸一也表達了這一觀點，他說：“朝日鑽石美國很高興與Revasum Inc合作，將碳化硅晶片研磨提升到新的高度。我們的尖端研磨輪與Revasum的先進工具相結合，將使半導體制造商能夠在碳化硅晶圓加工中實現前所未有的精度和效率。”
For more information, please contact:
欲了解更多信息，請聯繫：
Info@revasum.com
Info@revasum.com
About Revasum Inc:
關於 Revasum Inc：
Revasum Inc is a global leader in the design and manufacturing of advanced semiconductor processing equipment. With a focus on innovation and reliability, Revasum provides cutting-edge solutions for the production of silicon carbide wafers and other semiconductor materials.
Revasum Inc是先進半導體加工設備設計和製造領域的全球領導者。Revasum專注於創新和可靠性，爲碳化硅晶圓和其他半導體材料的生產提供尖端的解決方案。
About Asahi Diamond America, Inc:
關於朝日鑽石美國公司：
Asahi Diamond America, Inc is a leading provider of diamond and cubic boron nitride tools for a wide range of industries, including semiconductor manufacturing. With a commitment to quality and precision, Asahi Diamond America delivers advanced tools that enhance the efficiency and performance of semiconductor processing.
Asahi Diamond America, Inc是金剛石和立方氮化硼刀具的領先供應商，爲包括半導體制造在內的各種行業提供鑽石和立方氮化硼工具。Asahi Diamond America致力於提高質量和精度，提供先進的工具，以提高半導體加工的效率和性能。
SOURCE Revasum
來源 Revasum
