Reported Earlier, SK Hynix And TSMC Collaborate On HBM4 Development And Next-Generation Packaging Technology
Reported Earlier, SK Hynix And TSMC Collaborate On HBM4 Development And Next-Generation Packaging Technology
早些時候報道，SK海力士和台積電合作開發HBM4和下一代封裝技術
- SK hynix and TSMC sign MOU to collaborate on HBM4 development and next-generation packaging technology
- SK hynix will adopt TSMC's cutting-edge foundry process to advance HBM4 performance
- Product Design-Foundry-Memory trilateral collaboration to break memory performance limits for AI applications
- SK 海力士和台積電簽署諒解備忘錄，合作開發 HBM4 和下一代封裝技術
- SK 海力士將採用台積電的尖端鑄造工藝來提高 HBM4 性能
- 產品設計-Foundry-Memory三方合作打破人工智能應用的存儲器性能限制