MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
MediaTek's Dimensity 7300 Chips Level Up AI and Mobile Gaming for High-Tech Smartphones and Foldables
HSINCHU, May 29, 2024 /PRNewswire/ -- MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of ultra-efficient 4nm chips for high-tech mobile offerings. Providing best-in-class power efficiency and excellent performance, the Dimensity 7300 chipsets enable effortless multitasking, superior photography, accelerated gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.
新竹，2024年5月29日 /PRNewswire/ — 聯發科今天宣佈推出天準7300和天準7300X，這是兩款用於高科技移動產品的超高效4納米芯片。Dimensity 7300 芯片組提供一流的能效和卓越的性能，可實現輕鬆的多任務處理、卓越的攝影、加速遊戲和人工智能增強型計算；此外，Dimensity 7300X 在設計時考慮了翻蓋式可摺疊設備，支持雙顯示屏。
Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores. The 4nm process provides up to 25% lower power consumption in the A78 cores compared to the Dimensity 7050. The CPU works together with the latest Arm Mali-G615 GPU and a suite of MediaTek HyperEngine optimizations to accelerate gaming experiences. In comparison to competitor alternatives, the Dimensity 7300 series offers 20% faster FPS and 20% improved energy efficiency. To further enhance gaming experiences, the new chips utilize smart resource optimization, optimize 5G and Wi-Fi game connections, and support Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio.
兩款聯發科天際 7300 芯片組都有一個八核 CPU，由 4 個 Arm Cortex-A78 內核組成，運行頻率高達 2.5GHz，搭配 4 個 Arm Cortex-A55 內核。與 Dimensity 7050 相比，4nm 工藝使 A78 內核的功耗降低了多達 25%。該CPU與最新的Arm Mali-G615 GPU和一系列聯發科HyperEngine優化配合使用，可加速遊戲體驗。與競爭對手的替代產品相比，天準7300系列的FPS速度提高了20％，能效提高了20％。爲了進一步增強遊戲體驗，新芯片利用智能資源優化，優化 5G 和 Wi-Fi 遊戲連接，並通過雙鏈路真無線立體聲音頻支持藍牙 LE 音頻技術。
"The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game," said Dr. Yenchi Lee, Deputy General Manager of MediaTek's Wireless Communications Business. "Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support."
聯發科無線通信業務副總經理李延奇博士表示：“聯發科天際 7300 芯片對於集成最新的人工智能增強和連接功能非常重要，這樣消費者就可以無縫地進行直播和玩遊戲。”“此外，Dimensity 7300X支持雙顯示屏，使原始設備製造商能夠開發創新的新外形。”
The Dimensity 7300 chipsets also offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera. Enhanced with new hardware engines providing precise noise reduction (MCNR), face detection (HWFD), and video HDR, the Dimensity 7300 lets users capture stunning images and videos in any lighting. Additionally, live focus photo performance is up to 1.3X faster and photo remastering is up to 1.5X faster than the Dimensity 7050. Users can also record 4K HDR video with over 50% wider dynamic range compared to competitor solutions, bringing out more details in videos.
天準7300芯片組還通過聯發科Imagiq 950提供升級版攝影功能，採用高級12位HDR-ISP，支持200萬像素主攝像頭。Dimensity 7300 採用了提供精確降噪 (MCNR)、人臉檢測 (HWFD) 和視頻 HDR 的新硬件引擎，可讓用戶在任何光線下捕捉令人驚歎的圖像和視頻。此外，實時對焦照片性能比天準7050快1.3倍，照片重製速度最高可快1.5倍。與競爭對手的解決方案相比，用戶還可以錄製4K HDR視頻，其動態範圍比競爭對手的解決方案要寬50％以上，從而在視頻中呈現出更多細節。
The MediaTek APU 655 significantly boosts AI task efficiency, delivering twice the performance of the Dimensity 7050. The Dimensity 7300 chips also accommodate new mixed precision data types to more efficiently utilize memory bandwidth and reduce memory requirements for larger AI models.
聯發科APU 655顯著提高了人工智能任務效率，其性能是天痕7050的兩倍。Dimensity 7300 芯片還可容納新的混合精度數據類型，以更有效地利用內存帶寬並降低更大 AI 模型的內存需求。
With MediaTek's MiraVision 955 built-in, the Dimensity 7300 SoCs support impressively detailed WFHD+ displays with 10-bit true color, along with support for global HDR standards, enhancing media streaming and playback. Additionally, the dedicated support for dual display flip phones on the Dimensity 7300X makes it easier for OEMs to meet the growing market demand for innovative form factors.
天準7300 SoC內置聯發科的MiraVision 955，支持細節令人印象深刻的10位真彩WFHD+顯示屏，同時支持全球HDR標準，增強了媒體直播和播放效果。此外，Dimensity 7300X 對雙顯示屏翻蓋手機的專門支持使 OEM 更容易滿足市場對創新外形規格不斷增長的需求。
Other key features of the Dimensity 7300 and the Dimensity 7300X include:
天際 7300 和天際 7300X 的其他主要功能包括：
- MediaTek 5G UltraSave 3.0+ technology incorporating a complete suite of R16 power saving enhancements, plus MediaTek's own optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios.
- Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.
- Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
- Dual 5G SIM support with dual VoNR to give users more choice.
- 聯發科5G UltraSave 3.0+技術整合了一整套R16省電增強功能，加上聯發科自己的優化，在常見的5G sub-6GHz連接場景中，與競爭對手的替代方案相比，能效提高了13-30％。
- 通過 3CC 載波聚合支持高達 3.27Gb/s 的 5G 下行鏈路，在城市和郊區環境中提供更快的下行鏈路速度。
- 三頻段 Wi-Fi 6E 支持快速可靠的多千兆位無線連接。
- 支持雙 5G SIM 卡和雙 VonR，爲用戶提供更多選擇。
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About MediaTek Inc.
關於聯發科公司
MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit for more information.
聯發科公司（TWSE：2454）是一家全球性無晶圓廠半導體公司，每年支持近20億臺聯網設備。我們在爲移動、家庭娛樂、連接和物聯網產品開發創新的片上系統 (SoC) 方面處於市場領導地位。我們對創新的執着使我們成爲多個關鍵技術領域的市場推動力，包括高能效移動技術、汽車解決方案和一系列先進的多媒體產品，如智能手機、平板電腦、數字電視、5G、語音助手設備 (VAD) 和可穿戴設備。聯發科賦能和激勵人們通過智能技術擴大視野並實現目標，比以往任何時候都更輕鬆、更高效。我們與您喜愛的品牌合作，讓所有人都能獲得優秀的技術，它推動着我們所做的一切。訪問以獲取更多信息。
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SOURCE MediaTek Inc.
來源 MediaTek Inc.