Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
The consortium will help to further advance technology in back-end packaging, an area that has not been significantly focused on in the US
該聯盟將有助於進一步推進後端封裝技術,這是美國尚未重點關注的領域。
UNION CITY, Calif. – July 8, 2024 – Resonac Corporation today unveiled a new consortium of ten partners, called "US-JOINT," for its semiconductor back-end process R&D in Silicon Valley. The ten American and Japanese semiconductor materials and equipment companies are: Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; TOK; TOWA; and Resonac.
加利福尼亞聯合城-2024年7月8日-Resonac Corporation今天在硅谷推出了一個名爲"US-JOINt"的由十個合作伙伴組成的新聯盟,用於其半導體後端工藝研發。這十家美國和日本的半導體材料和設備公司分別是:Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; TOK; TOWA;和Resonac。
US-JOINT expands the activities of Japan-based open consortiums led by Resonac (known as "JOINT" and "JOINT2") in the U.S. and includes the participation of five U.S.-based companies. US-JOINT R&D will take place at a new R&D center in Union City, Calif., set up through co-investment with the partners. The construction of cleanrooms and equipment installation will begin this year, and the facility is expected to be fully operational in 2025.
US-JOINt擴展了由Resonac領導的日本開放聯盟在美國的活動(稱爲"JOINT"和"JOINT2"),幷包括五家美國公司的參與。US-JOINt R&D將在加利福尼亞聯和城的一個新研發中心開展,該中心通過與合作伙伴的聯合投資建立。潔淨室的建設和設備的安裝將於今年開始,該設施預計將在2025年全面投入運營。
Mr. Rahm Emanuel, the U.S. Ambassador to Japan, said, "With nearly every area of our daily lives now dependent on semiconductors, it is critical that we strengthen supply chains through cooperation with trusted partners in the sector. This new consortium of leading American and Japanese companies in the semiconductor industry is the latest example of our two nations joining forces to accelerate the development of advanced technologies of global importance."
美國駐日本大使拉姆·伊曼紐爾表示:“由於我們日常生活的幾乎每個領域現在都依賴於半導體,因此通過與在該行業有信任的合作伙伴合作來加強供應鏈至關重要。這家半導體行業領先的美國和日本公司的新聯盟是我們兩個國家聯手加快全球重要先進技術發展的最新例子。
US-JOINT is an open consortium designed for end-customer collaboration to verify the latest requirements for semiconductor packaging of advanced devices and validate new concepts in development. In addition, by co-creating with customers, Resonac and the US-JOINT members will capture market needs in real time, accelerating the R&D of materials and equipment technologies.
US-JOINt是一個面向最終客戶合作的開放性聯盟,以驗證先進設備的半導體封裝的最新要求並驗證正在開發的新概念。此外,通過與客戶共同創建,Resonac和US-JOINt成員將實時捕捉市場需求,加速材料和設備技術的研發。
"Today's rapidly expanding next-generation semiconductors for generative AI and autonomous driving require new approaches to advanced packaging technologies, such as 2.5D and 3D*1," said Hidenori Abe, executive director of Electronics Business Headquarters, Resonac. "In recent years, major semiconductor manufacturers and fabless companies in Silicon Valley, including GAFAM*2, are designing semiconductors in-house and creating new concepts in back-end packaging one after another. This is where the US-JOINT consortium can contribute significantly with our leading technology in materials and equipment on-shore in the U.S."
Resonac電子商務總部執行主任Hidenori Abe表示:“今天快速擴展的生成AI和自動駕駛的下一代半導體需要採用新的先進封裝技術,例如2.5D和3D *1。近年來,硅谷的主要半導體制造商和無廠半導體公司(包括GAFAM *2)正在自主設計半導體,並在後端封裝領域中不斷創造新的概念。這就是US-JOINt聯盟在美國領先的材料和設備技術可以帶來的貢獻所在。
Advanced packaging and back-end processing of semiconductors has traditionally been located primarily in Asia. Bringing packaging R&D closer to major semiconductor device makers in Silicon Valley will help to further advance the technology and solve technical issues, especially in the areas that other U.S. consortiums do not cover enough, including advancements in the substrate, interposer and fabrication of the package.
半導體先進封裝和後端處理傳統上主要位於亞洲。將封裝端的研發提前到硅谷的主要半導體器件製造商附近,將有助於進一步推進技術並解決技術問題,特別是在其他美國聯盟板塊沒有充分覆蓋的領域,包括基板、中間層和封裝製造的進展。
Jan Vardaman, president, TechSearch International, Inc., said, "This represents a tremendous opportunity for U.S. companies to take advantage of the expertise gathered in material and equipment for advanced packaging development."
TechSearch International,Inc.總裁Jan Vardaman表示:“這代表美國公司利用材料和設備方面的專業知識開發先進封裝的巨大機會。”
For details, please refer to the website, Resonac Holdings Corporation:
詳細信息請參見網站Resonac Holdings Corporation:
*1 2.5D packaging is a technology to place semiconductor chips in parallel on the interposer. 3D packaging is a technology to laminate chips with TSV (through silicon via).
*2 GAFAM stands for Google, Apple, Facebook, Amazon, Microsoft.
*1 2.5D封裝是一種將半導體芯片平行放置在中間層上的技術。3D封裝是一種利用TSV(透過硅孔)層壓芯片的技術。
*2 GAFAm是谷歌、蘋果、Facebook、亞馬遜和微軟的縮寫。