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Earnings Call Summary | Kulicke & Soffa Industries(KLIC.US) Q3 2024 Earnings Conference

Earnings Call Summary | Kulicke & Soffa Industries(KLIC.US) Q3 2024 Earnings Conference

業績會總結 | 庫利克與索法工業(KLIC.US)2024年Q3業績會
moomoo AI ·  08/07 23:46  · 電話會議

The following is a summary of the Kulicke and Soffa Industries, Inc. (KLIC) Q3 2024 Earnings Call Transcript:

以下是歷嘉科技(Kulicke and Soffa Industries, Inc.)2024Q3業績發佈會的摘要:

Financial Performance:

金融業績:

  • Kulicke and Soffa Industries generated $181.7 million in revenue during Q3 2024.

  • Gross margin stood at 46.6%, influenced by product and customer mix.

  • Non-GAAP EPS exceeded expectations, although specific figures were not disclosed.

  • The company anticipates Q4 revenue to be approximately $180 million with a gross margin of 47%.

  • For Q4, projected GAAP EPS is $0.22 per share and non-GAAP EPS is $0.35 per share.

  • 2024Q3歷嘉科技實現了1.817億美元的營業收入。

  • 毛利率達到46.6%,受產品和客戶組合的影響。

  • 儘管沒有披露具體數字,但Non-GAAP每股收益超出預期。

  • 公司預計2024Q4營收約爲1.8億美元,毛利率爲47%。

  • 2024Q4預計GAAP每股收益爲0.22美元,Non-GAAP每股收益爲0.35美元。

Business Progress:

業務進展:

  • Strategic advancements in thermocompression and fluxless bonding technologies, including successful deployment in diverse semiconductor fabrication processes.

  • Key victories in thermocompression bonding within the past four years reflected a 10x business growth.

  • Continued dominance in ball bonding with improvements, and capitalizing on robust demand in power semiconductor assembly for automotive and industrial applications.

  • 熱壓焊和無焊點連接技術的戰略性進展,成功應用於不同的半導體制造流程中。

  • 在過去四年內,熱壓焊連接的重要進展體現了10倍的業務增長。

  • 在提高球焊連接技術上仍然佔據主導地位,並利用汽車和工業應用中強勁的需求實現了增長。

Opportunities:

機會:

  • Strong positioning in new markets such as AI, HPC, and mobility, traditionally not part of Kulicke and Soffa's core market.

  • Advanced packaging technologies and low-barrier, cost-effective solutions for mass-market chiplet adoption show substantial growth prospects.

  • Expected industry-wide semiconductor revenue growth of 17% through calendar year 2025, promises enhanced demand for the company's high-volume solutions.

  • 在人工智能,高性能計算和移動性等新市場上具有強大的地位,這些市場通常不屬於歷嘉科技的核心市場。

  • 固體芯片封裝技術和低阻,成本效益高的解決方案,爲大衆芯片採用提供了可觀的增長前景。

  • 預計行業範圍內的半導體收入增長將在2025年的日曆年度內達到17%,這將增強對該公司高量級方案的需求。

Risks:

風險:

  • Economic fluctuations may influence overall utilization rates which though improving, must maintain consistent above-average percentages to ensure sustained recovery and growth, particularly past the 75% utilization rate needed to drive high-volume customer demands.

  • 經濟波動可能會影響整體利用率,儘管有所改善,也必須保持持續的高於平均水平的百分比,以確保持續恢復和增長,特別是過去需要推動高量級客戶需求的75%利用率。

More details: Kulicke & Soffa Industries IR

更多詳情請參見歷嘉科技公司IR頁面。

Tips: This article is generated by AI. The accuracy of the content can not be fully guaranteed. For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.

提示:本文由AI生成。文章內容的準確性無法完全保證。有關更全面的詳細信息,請參閱IR網站。本文只是爲投資者提供參考,沒有任何指導或推薦建議。

声明:本內容僅用作提供資訊及教育之目的,不構成對任何特定投資或投資策略的推薦或認可。 更多信息
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