Xpeng's chip is a centralized computing architecture chip that supports powering the cockpit and smart driving, with AI computing power close to the level of 3 mainstream smart driving chips, according to local media.
Xpeng's (NYSE: XPEV) in-house developed smart driving chip has been successfully taped out, making it the next local automaker to see this achievement after Nio (NYSE: NIO).
Local media outlet 36kr reported the development today, citing a person familiar with the matter as saying that the chip is specifically designed for AI (artificial intelligence) needs and end-to-end large models.
The chip is a centralized computing architecture chip that supports driving smart cockpits and smart driving, with AI computing power close to the level of 3 mainstream smart driving chips, according to the report.
Xpeng will officially release information about the in-house developed chip at its 10th anniversary celebration and Mona M03's launch event on August 27, the report said.
Xpeng will launch the first model of the Mona array, the M03, on August 27, which will be its cheapest model.
The Xpeng Mona M03 will start at no more than RMB 135,900 ($19,080), the company said earlier this month.
Tape-out is a technical term used in the chip industry, which refers to the process of transforming a circuit design into a chip that can be produced on an assembly line after the chip design has been completed.
After a successful tape-out, a chip prototype can begin mass production if it passes subsequent tests.
Nio unveiled the Shenji NX9031 at Nio Day 2023 held on December 23, 2023, and the chip will be used in the ET9 executive flagship sedan. The sedan is already available for pre-order, but deliveries won't start until the first quarter of 2025.
At the Nio IN 2024 Tech Day event in Shanghai on July 27, Nio announced that the Shenji NX9031 chip had successfully taped out.
Li showed a prototype of the Shenji NX9031 chip at the time, claiming that the performance of one chip is comparable to that of four of the industry's flagship chips.
Xpeng moved ahead of both Nio and Li Auto (NASDAQ: LI) in its efforts to develop its own chips, starting to build its team in 2020, which is currently between 200-300 people in size, according to the report in 36kr today.
The computing power design of Xpeng's chip is tied to its use of big end-to-end models for autonomous driving. The company launched its end-to-end smart driving large model on May 20 that can be used in production vehicles.
Xpeng now knows where the computing power should be used, so it will be more sophisticated in its thinking about computing power allocation, the report said, citing an insider.
Li Auto also has a chip project codenamed "Schumacher," which started later than Nio and Xpeng, but would also tape out within the year, according to a July 9 report by 36kr.
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據當地媒體報道,小鵬的芯片是一種集中式計算架構芯片,支持爲駕駛艙供電和智能駕駛,其人工智能計算能力接近主流智能駕駛芯片的三級水平。
小鵬汽車(紐約證券交易所代碼:XPEV)內部開發的智能駕駛芯片已成功量產,使其成爲繼蔚來(紐約證券交易所代碼:NIO)之後下一家取得這一成就的本地汽車製造商。
當地媒體36kr今天報道了這一發展,援引一位知情人士的話說,該芯片是專門爲AI(人工智能)需求和端到端大型模型而設計的。
報告稱,該芯片是一種集中計算架構芯片,支持駕駛智能座艙和智能駕駛,其人工智能計算能力接近3種主流智能駕駛芯片的水平。
報告稱,小鵬將在其十週年慶典和8月27日的Mona M03發佈會上正式發佈有關內部開發的芯片的信息。
小鵬將於8月27日推出Mona陣列的首款機型——M03,這將是其最便宜的機型。
該公司本月早些時候表示,小鵬蒙娜M03的起價將不超過人民幣135,900元(合19,080美元)。
Tape-out是芯片行業中使用的技術術語,指的是將電路設計轉換爲芯片的過程,該芯片可以在芯片設計完成後在裝配線上生產。
成功流片後,如果芯片原型通過後續測試,就可以開始批量生產。
蔚來在 2023 年 12 月 23 日舉行的蔚來日 2023 上發佈了神吉 NX9031,該芯片將用於 ET9 行政旗艦轎車。該轎車已經可以預訂,但要到2025年第一季度才能開始交付。
在7月27日於上海舉行的蔚來IN 2024年科技日活動上,蔚來宣佈申基 NX9031 芯片已成功量產。
李當時展示了神機 NX9031 芯片的原型,聲稱一個芯片的性能與業內四款旗艦芯片的性能相當。
根據今天36kr的報道,小鵬汽車在開發自己的芯片方面領先於蔚來和理想汽車(納斯達克股票代碼:LI),於2020年開始組建團隊,目前團隊的規模在200-300人之間。
小鵬芯片的計算能力設計與其使用大型端到端模型進行自動駕駛有關。該公司於5月20日推出了端到端智能駕駛大型車型,可用於量產車。
報告援引內部人士的話說,小鵬現在知道應該在哪裏使用計算能力,因此它對計算能力分配的考慮將更加複雜。
根據36kr7月9日的一份報告,理想汽車還有一個代號爲 「舒馬赫」 的芯片項目,該項目比蔚來和小鵬汽車的啓動時間晚,但也將在年內完成。
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