Lumotive Unveils Groundbreaking Open Development Platform (ODP): Moves to Democratize the Future of 3D Sensing
Lumotive Unveils Groundbreaking Open Development Platform (ODP): Moves to Democratize the Future of 3D Sensing
SEATTLE, Sept. 12, 2024 /PRNewswire/ -- Today, Lumotive, a pioneering force in optical semiconductor technology, proudly announces the launch of its state-of-the-art Open Development Platform (ODP). This innovative, configurable platform introduces camera module-like development capabilities resulting from extensive R&D efforts. It offers unparalleled customization and scalability in 3D sensing applications, significantly accelerating time-to-market for next-generation products.
西雅圖,2024年9月12日,今天, Lumotive,作爲光學半導體技術的開拓者,自豪地宣佈推出最先進的開放式開發平台(ODP)。該創新的可配置平台引入了類似相機模塊的開發能力,這是通過廣泛的研發工作而實現的。它在3D感應應用中提供了無與倫比的定製和可擴展性,顯著加快了下一代產品的上市時間。
"Our Open Development Platform empowers developers to customize 3D sensors, choose the best components, and reduce design cycles," stated Sam Heidari, Lumotive's CEO. "Developers can create a fully customized LiDAR stack with complete flexibility or use our ready-to-use development kits, which still offer flexibility in selecting core components. This platform unlocks the power of our cutting-edge Light Control Metasurface (LCM) technology, driving faster, more efficient innovation and bringing groundbreaking applications to market with unmatched speed and precision."
「我們的開發平台賦予開發人員定製3D傳感器的能力,選擇最佳元件,並縮短設計週期,」 Lumotive首席執行官Sam Heidari表示。「開發人員可以創建具有完全靈活性的定製LiDAR堆棧,或使用我們的即插即用開發套件,仍在選擇核心元件方面提供靈活性。該平台釋放了我們尖端的光控制超表面(LCM)技術的威力,推動更快、更高效的創新,並以無與倫比的速度和精度將開創性的應用帶入市場。」
Based on Lumotive's breakthrough Light Control Metasurface (LCM) technology, featuring the LM10 chip, the Open Development Platform represents a significant leap forward in 3D sensing system development by reducing development cycle time. LCM's solid-state, programmable optics eliminate the need for bulky and fragile mechanical parts found in traditional LiDAR systems, offering unparalleled stability and accuracy in object recognition and distance measurement—vital for maintaining consistent performance and safety in demanding industrial environments.
基於Lumotive的突破性光控制超表面(LCM)技術,採用LM10芯片,開發平台代表了在3D感應系統開發中的重大飛躍,通過縮短開發週期。LCM的固態可編程光學消除了傳統LiDAR系統中笨重且易碎的機械部件的需求,提供了無與倫比的穩定性和準確性,對於在苛刻的工業環境中保持一致的性能和安全至關重要。
With the launch of the Open Development Platform, sensor manufacturers and module makers are empowered to fully customize both hardware and software components using a modular subsystems approach, significantly reducing design cycle times from 18 months to as little as 3-6 months. The platform supports modular configurations of lasers, ToF sensors, optics, processors, and interfaces, allowing for the creation of optimized production systems tailored to specific applications. Equipped with software-defined features and scalability from 10 to over 200 meters and pre-built resources for swift development, this platform is ideally suited for various industries, including automotive, industrial automation, building automation, surveillance, service robotics, and drones.
隨着開發平台的推出,傳感器製造商和模塊製造商能夠利用模塊化子系統方法充分定製硬件和軟件元件,將設計週期從18個月減少到短至3-6個月。該平台支持激光器、ToF傳感器、光學器件、處理器和接口的模塊化配置,可創建針對特定應用定製的優化生產系統。具備軟件定義功能,從10至超過200米的可擴展性以及用於快速開發的預建資源,該平台非常適用於各種行業,包括汽車、工業自動化、建築自動化、監控、服務機器人和無人機。
To strike a perfect balance between flexibility and efficiency in product development, Lumotive will provide preconfigured development kits that empower customers to evaluate the performance of LCM-based 3D sensors and develop platform accelerators using the robust Open Development Platform.
爲在產品開發中實現靈活性和效率的完美平衡,Lumotive將提供預配置的開發套件,使客戶能夠評估基於LCm的3D傳感器的性能並使用強大的開發平台開發加速器。
These advanced modular systems seamlessly combine predesigned, ready-to-develop demo and prototype features with the flexibility to customize critical components like processors and ToF sensors. This bold approach allows developers to effortlessly integrate their preferred technologies while leveraging a pre-validated system architecture, ultimately accelerating time to market and streamlining development complexity.
這些先進的模塊化系統將預設計的、可開發的演示和原型功能與靈活性相結合,可以定製處理器和ToF傳感器等關鍵部件。這種大膽的方法使開發人員能夠輕鬆地集成他們喜歡的技術,同時利用預驗證的系統架構,最終加快上市時間,並簡化開發複雜性。
The platform's debut builds on Lumotive's established success with its LCM chips, which have won multiple awards and are in full production at multiple silicon foundries worldwide. With over 100 patents protecting its technology, Lumotive continues to lead the industry in 3D sensor development and deliver scalable, manufacturable, and reliable solutions that redefine the potential of 3D sensing.
該平台的首次亮相是基於Lumotive在其LCm芯片方面取得的成就,該芯片在全球多個硅晶圓廠處於全面生產狀態並獲得多個獎項。憑藉100多項專利保護其技術,Lumotive繼續引領3D傳感器開發行業,並提供可擴展、可製造和可靠的解決方案,重新定義了3D感知的潛力。
About Lumotive
關於Lumotive
Lumotive's award-winning programmable optical semiconductors improve perception, increase computing power, and enable reliable high-speed communication in various industries. The Light Control Metasurface (LCM) chip is a patented, software-defined photonic beamforming solid-state technology. As the first of its kind, it meets essential needs in various sectors, including 3D sensing and AI computing.
Lumotive的屢獲殊榮的可編程光學半導體提高了感知能力,增加了計算能力,並在各個行業實現了可靠的高速通信。光控制元表面(LCM)芯片採用了經過專利保護的軟件定義光子波束成形固態技術。作爲首個採用該技術的產品,它滿足了包括3D感知和AI計算在內的各個領域的重要需求。
Lumotive was named Fast Company's Next Big Thing in Tech and won two CES Innovation Awards. Headquartered in Redmond, WA, with offices in San Jose, CA, and Vancouver, Canada, Lumotive is backed by notable investors, including Gates Frontier, MetaVC Partners, Quan Funds, Samsung Ventures, and Uniquest.
Lumotive被Fast Company評爲下一個重要的技術,並獲得兩項CES創新獎。Lumotive總部位於美國華盛頓州雷德蒙德,設有聖何塞加利福尼亞和加拿大溫哥華的辦事處,受到包括蓋茨前沿、MetaVC Partners、Quan Funds、三星風險投資和Uniquest在內的知名投資者的支持。
SOURCE Lumotive
資料來源:Lumotive公司