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STMicroelectronics Unveils New Generation of Silicon Carbide Power Technology Tailored for Next-generation EV Traction Inverters

STMicroelectronics Unveils New Generation of Silicon Carbide Power Technology Tailored for Next-generation EV Traction Inverters

意法半導體推出針對下一代電動汽車牽引逆變器量身定製的新一代碳化硅功率技術
GlobeNewswire ·  09/24 09:00

STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters

意法半導體推出新一代碳化硅功率技術,專爲下一代新能源車牽引逆變器量身定製

  • Smaller, more efficient products to ramp-up in volumes through 2025 across 750V and 1200V classes, will bring the advantages of silicon carbide beyond premium models to mid-size and compact electric vehicles.
  • ST plans to introduce multiple silicon carbide technology innovations through 2027, including a radical innovation.
  • 更小、更高效的產品將在2025年之前擴大規模,覆蓋750V和1200V類別,將碳化硅的優勢帶到中型和緊湊型新能源車中
  • 意法半導體計劃通過2027年推出多項碳化硅技術創新,包括一項激進創新

Geneva, Switzerland, September 24, 2024 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power efficiency, power density and robustness. While serving the needs of both the automotive and industrial markets, the new technology is particularly optimized for traction inverters, the key component of electric vehicle (EV) powertrains. The company plans to introduce further advanced SiC technology innovations through 2027 as a commitment to innovation.

2024年9月24日瑞士日內瓦報道 - 意法半導體(紐交所:STM),作爲全球半導體領導者,爲跨電子應用領域的客戶提供服務,正在推出其第四代STPOWER碳化硅(SiC)MOSFEt技術。第四代技術在功率效率、功率密度和穩定性方面帶來了新的標準。在滿足汽車和工業市場需求的同時,這項新技術特別針對牽引逆變器進行了優化,這是新能源車動力傳動系統的關鍵組件。該公司計劃通過2027年進一步推出先進的SiC技術創新,致力於創新

"STMicroelectronics is committed to driving the future of electric mobility and industrial efficiency through our cutting-edge silicon carbide technology. We continue to advance SiC MOSFET technology with innovations in the device, advanced packages, and power modules," said Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group. "Together with our vertically integrated manufacturing strategy, we are delivering industry leading SiC technology performance and a resilient supply chain to meet the growing needs of our customers and contribute to a more sustainable future."

"意法半導體致力於通過我們先進的碳化硅技術推動電動出行和工業效率的未來。我們持續推進SiC MOSFEt技術,在器件、先進封裝和功率模塊方面進行創新,"馬可·卡西斯,模擬、功率與分立、MEMS和傳感器集團總裁表示。"憑藉我們的垂直一體化製造戰略,我們提供行業領先的SiC技術性能和具有彈性的供應鏈,以滿足客戶不斷增長的需求,爲更可持續的未來做出貢獻"

As the market leader in SiC power MOSFETs, ST is driving further innovation to exploit SiC's higher efficiency and greater power density compared to silicon devices. This latest generation of SiC devices is conceived to benefit future EV traction inverter platforms, with further advances in size and energy-saving potential. While the EV market continues to grow, challenges remain to achieve widespread adoption and car makers are looking to deliver more affordable electric cars. 800V EV bus drive systems based on SiC have enabled faster charging and reduced EV weight, allowing car makers to produce vehicles with longer driving ranges for premium models. ST's new SiC MOSFET devices, which will be made available in 750V and 1200V classes, will improve energy efficiency and performance of both 400V and 800V EV bus traction inverters, bringing the advantages of SiC to mid-size and compact EVs — key segments to help achieve mass market adoption. The new generation SiC technology is also suitable for a variety of high-power industrial applications, including solar inverters, energy storage solutions and datacenters, significantly improving energy efficiency for these growing applications.

作爲碳化硅功率MOSFET的市場領導者,意法半導體正在推動進一步創新,以開發碳化硅相比硅器件更高的效率和更大的功率密度。這一最新一代的碳化硅器件旨在爲未來的新能源車牽引變流器平台帶來好處,進一步提升尺寸和節能潛力。雖然新能源車市場持續增長,但要實現廣泛採用仍然面臨挑戰,汽車製造商正致力於推出更實惠的電動汽車。基於碳化硅的800V新能源汽車電池驅動系統實現了更快的充電速度和降低了新能源汽車的重量,使汽車製造商能夠爲高端車型生產擁有更長續航里程的車輛。意法半導體的新碳化硅MOSFEt器件將推出750V和1200V兩類,將提高400V和800V新能源汽車電池牽引變流器的能效和性能,將碳化硅的優勢帶給中型和緊湊型新能源汽車——對於幫助實現大衆市場採用起到關鍵作用。這一新一代碳化硅技術也適用於多種高功率工業應用,包括太陽能逆變器、能源存儲解決方案和數據中心,顯著提高了這些不斷增長應用的能效。

Availability
ST has completed qualification of the 750V class of the fourth generation SiC technology platform and expects to complete qualification of the 1200V class in the first quarter of 2025. Commercial availability of devices with nominal voltage ratings of 750V and 1200V will follow, allowing designers to address applications operating from standard AC-line voltages up to high-voltage EV batteries and chargers.

了解有關VAST與思科和NVIDIA的進一步合作,請單擊此處:
意法半導體已完成第四代碳化硅技術平台750V級別的資格認證,並預計將於2025年第一季度完成1200V級別的資格認證。隨後將推出額定電壓分別爲750V和1200V的器件,使設計人員能夠應對從標準交流線電壓到高壓新能源汽車電池和充電器的各種應用。

Use cases
ST's Generation 4 SiC MOSFETs provide higher efficiency, smaller components, reduced weight, and extended driving range compared to silicon-based solutions. These benefits are critical for achieving widespread adoption of EVs and leading EV manufacturers are engaged with ST to introduce the Generation 4 SiC technology into their vehicles, enhancing performance and energy efficiency. While the primary application is EV traction inverters, ST's Generation 4 SiC MOSFETs are also suitable for use in high-power industrial motor drives, benefiting from the devices' improved switching performance and robustness. This results in more efficient and reliable motor control, reducing energy consumption and operational costs in industrial settings. In renewable energy applications, the Generation 4 SiC MOSFETs enhance the efficiency of solar inverters and energy storage systems, contributing to more sustainable and cost-effective energy solutions. Additionally, these SiC MOSFETs can be utilized in power supply units for server datacenters for AI, where their high efficiency and compact size are crucial for the significant power demands and thermal management challenges.

使用情況
意法半導體第四代碳化硅MOSFET相比基於硅的解決方案提供更高效率、更小的元件、減輕重量和更長的行駛里程。這些優點對於實現新能源車的廣泛普及至關重要,主要新能源汽車製造商已與意法半導體合作,將第四代碳化硅技術引入其車輛,提升性能和能效。儘管主要應用是新能源車牽引變流器,但意法半導體第四代碳化硅MOSFET也適用於高功率工業電機驅動,受益於器件的改進開關性能和可靠性。這將實現更高效和可靠的電機控制,在工業環境中降低能耗和運營成本。在可再生能源應用中,第四代碳化硅MOSFET提高了太陽能逆變器和能源存儲系統的效率,爲更可持續和具成本效益的能源解決方案做出貢獻。此外,這些碳化硅MOSFET還可用於人工智能服務器數據中心的電源單元中,其高效率和緊湊尺寸對於有重大功率需求和熱管理挑戰的場合非常重要。

Roadmap
To accelerate the development of SiC power devices through its vertically integrated manufacturing strategy, ST is developing multiple SiC technology innovations in parallel to advance power device technologies over the next three years. The fifth generation of ST SiC power devices will feature an innovative high-power density technology based on planar structure. ST is at the same time developing a radical innovation that promises outstanding on-resistance RDS(on) value at high temperatures and further RDS(on) reduction, compared to existing SiC technologies.

路線圖
爲加速碳化硅功率器件的發展,意法半導體通過其垂直一體化製造戰略,正同時開發多項碳化硅技術創新,以在未來三年推動功率器件技術。意法半導體的第五代碳化硅功率器件將基於平面結構的創新高功率密度技術。與現有的碳化硅技術相比,意法半導體同時正在開發一項激進的創新,承諾在高溫下具有出色的導通電阻RDS(on)值,並進一步減少RDS(on)。

ST will attend ICSCRM 2024, the annual scientific and industry conference exploring the newest achievements in SiC and other wide bandgap semiconductors. The event, from September 29 to October 04, 2024, in Raleigh, North Carolina will include ST technical presentations and an industrial keynote on 'High volume industrial environment for leading edge technologies in SiC'. Find out more here: ICSCRM 2024 - STMicroelectronics.

意法半導體將參加ICSCRm 2024,這是一年一度的科學和行業會議,探討碳化硅和其他寬禁帶半導體的最新成就。此次活動將於2024年9月29日至10月4日在北卡羅來納州Raleigh舉行,屆時將包括意法半導體的技術演示和一個關於「碳化硅領先技術的高產量工業環境」的行業主題演講。點擊這裏了解更多: ICSCRm 2024 - 意法半導體.

Technical Note to Editors
The fourth generation SiC MOSFETs from STMicroelectronics represent a significant leap forward in power conversion technology compared to previous generations. These devices are engineered to deliver superior performance and robustness, addressing the stringent demands of future EV traction inverters. The Generation 4 SiC MOSFETs feature a significantly lower on-resistance (RDS(on)) measured against prior generations, minimizing conduction losses, and enhancing overall system efficiency. They offer faster switching speeds, which translate to lower switching losses, crucial for high-frequency applications and enabling more compact and efficient power converters. The Generation 4 technology provides extra robustness in Dynamic Reverse Bias (DRB) conditions, exceeding the AQG324 automotive standard, ensuring reliable operation under harsh conditions.

編輯技術說明
意法半導體第四代碳化硅MOSFET元件,與之前的幾代相比,在功率轉換技術上邁出了重大一步。這些元件經過精心設計,提供了卓越的性能和強大性能,滿足了未來新能源車牽引逆變器的嚴格要求。第四代碳化硅MOSFET元件的導通電阻(RDS(on))顯著降低,較之前代產品更小,降低了導通損耗,提升了整個系統的效率。它們擁有更快的開關速度,意味着更低的開關損耗,對於高頻應用至關重要,並實現了更緊湊、更高效的功率轉換器。第四代技術在動態反向偏置(DRB)條件下提供了額外的穩健性,超越了AQG324汽車標準,確保在惡劣環境下可靠運行。

With Generation 4 ST continues to deliver outstanding RDS(on) x die-area figure of merit to ensure high current-handling capability with minimal losses. The average die size of Generation 4 devices is 12-15% smaller than that of Generation 3, considering an RDS(on) at 25 degrees Celsius, allowing for more compact power converter designs, saving valuable space, and reducing system costs. The improved power density of these devices supports the development of more compact and efficient power converters and inverters, essential for both automotive and industrial applications. In addition, this is particularly beneficial for power supply units in server datacenters for AI, where space and efficiency are critical factors.

隨着第四代產品的推出,意法繼續提供出色的RDS(on) x 晶片面積品質,確保高電流處理能力並降低損耗。考慮到在25攝氏度下的RDS(on),第四代產品的平均晶片尺寸比第三代產品小12-15%,有助於設計更緊湊的功率轉換器,節省寶貴空間並降低系統成本。這些元器件的提高功率密度支持了更緊湊、更高效的功率轉換器和逆變器的發展,對於汽車和工業應用至關重要。此外,這對於服務器數據中心中人工智能電源單元特別有益,其中空間和效率是關鍵因素。

As an industry leader in this technology, ST has already supplied STPOWER SiC devices for more than five million passenger cars worldwide in a range of EV applications including traction inverter, OBC (onboard charger), DC-DC converter, EV charging station, and e-compressor application, significantly enhancing the performance, efficiency, and range of NEVs. ST's SiC strategy, as an integrated device manufacturer (IDM), ensures quality and security of supply to serve carmakers' strategies for electrification. With the recently announced fully vertically integrated SiC substrate manufacturing facility in Catania, expected to start production in 2026, ST is moving quickly to support the rapid market transition towards e-mobility and higher efficiency in industrial applications.

作爲這一技術的行業領軍企業,意法已經爲全球五百萬輛乘用車提供了STPOWER碳化硅器件,包括牽引逆變器、車載充電器、DC-DC變換器、充電樁和電子壓縮機等多種新能源車應用,顯著提升了新能源車的性能、效率和里程。作爲一家集成器件製造商(IDM)的碳化硅策略,確保了供貨的質量和安全,以服務於汽車製造商的新能源化戰略。隨着最近宣佈在卡塔尼亞投入使用的全面垂直一體化碳化硅襯底製造設施,預計將於2026年投產,意法正在迅速支持市場向新能源汽車移動和工業應用效率提高的迅速轉變。

For further information about ST's SiC portfolio, please visit

有關意法半導體碳化硅產品組合的更多信息,請訪問

About STMicroelectronics
At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027. Further information can be found at .

"
作爲一個擁有超過50,000個半導體技術創造者和製造者的半導體技術企業,意法半導體可以通過先進的製造設施掌控半導體供應鏈。作爲一個一體化器件製造商,我們與超過200,000個客戶和數千個合作伙伴合作,設計和建造滿足他們面臨的挑戰和機遇的產品、解決方案和生態系統,並推動更加可持續的世界發展。我們的技術可以實現更智能的移動、更高效的功率和能源管理,以及廣泛部署雲連接的自主物聯網應用。我們致力於在2027年前實現在一定程度上的碳排放中實現完全中性。更多信息請參見。

For further information, please contact:
INVESTOR RELATIONS:
Céline Berthier
Group VP, Investor Relations
Tel: +41.22.929.58.12
celine.berthier@st.com

如需更多信息,請聯繫:
投資者關係:
Céline Berthier
集團副總裁,投資者關係
電話:+41.22.929.58.12
celine.berthier@st.com

MEDIA RELATIONS:
Alexis Breton
Corporate External Communications
Tel: +33.6.59.16.79.08
alexis.breton@st.com

媒體關係:
Alexis Breton
公司對外溝通
電話:+33.6.59.16.79.08
alexis.breton@st.com

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  • C3283C - Sep 24 2024 -- SiC Gen4_FINAL FOR PUBLICATION
  • C3283C - 2024年9月24日 -- 碳化硅第四代_FINAL可供發佈

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