Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
新思科技和TSMC合作推動萬億晶體管人工智能和多芯片設計，使用優化的eda軟件-半導體和IP解決方案，針對N2和A16工藝，解決熱、功耗和系統性能挑戰
Synopsys And TSMC Collaborate To Advance Trillion-Transistor AI And Multi-Die Chip Design With Optimized EDA And IP Solutions For N2 And A16 Processes; Address Thermal, Power, And System Performance Challenges
新思科技和台積電合作推進萬億晶體管人工智能和多芯片芯片設計，爲N2和A16工藝提供優化的 EDA 和 IP 解決方案；應對散熱、功率和系統性能挑戰