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FTG Corporation to Present at the 2024 Cantech Letter Conference in Toronto, ON

FTG Corporation to Present at the 2024 Cantech Letter Conference in Toronto, ON

FTG公司將在2024年Cantech Letter會議上在多倫多進行展示。
newsfile ·  10/01 17:00

Toronto, Ontario--(Newsfile Corp. - October 1, 2024) - FTG Corporation (TSX: FTG), a global aerospace and defence electronics company, is pleased to announce its participation at the upcoming Cantech Letter Investment Conference on Wednesday, October 9, 2024 in Toronto Ontario. Mr. Brad Bourne, President and CEO of FTG Corporation will be doing an investor presentation and participating in 1-on-1 meetings with investors at the conference.

安大略省多倫多-(新聞稿 corp-2024年10月1日)-FTG公司(TSX: FTG), 一家全球航空航天和國防電子公司, 非常高興地宣佈將參加即將在2024年10月9日星期三在安大略省多倫多舉行的Cantech Letter投資大會。FTG Corporation的總裁兼首席執行官Brad Bourne先生將進行投資者演示,並在會議上與投資者進行一對一會議。

2024 Cantech Letter Conference
Date: Wednesday, October 9, 2024
Location: Arcadian Loft, 8th floor, 401 Bay Street, Toronto, ON
Contact: tara@cantechletter.com to register
More info:

2024 Cantech Letter大會
日期:2024年10月9日週三
地點:Arcadian Loft, Bay Street401號, 多倫多, 安大略省, 8樓
聯繫: 通過電子郵件tara@cantechletter.com註冊
更多信息:

Mr. Brad Bourne, President and CEO of FTG Corporation commented, "We are delighted to be participating in the Cantech Letter Conference as it's an excellent platform to strengthen our connections within the capital markets. We hope to enhance our visibility, showcase our achievements, and increase our profile among the investor communities."

FTG公司總裁兼首席執行官Brad Bourne先生評論說:「我們很高興能參加Cantech Letter大會,因爲這是一個加強我們在資本市場內部聯繫的絕佳平台。我們希望提升我們的知名度,展示我們的成就,並在投資者群體中提高我們的形象。」

About Cantech Letter Conference

關於 Cantech Letter 會議

The Cantech Letter Conference, recognized as Canada's foremost technology investment event, provides up and coming technology companies with the unique opportunity to showcase their innovations and growth strategies, and participate in individual 1-on-1 meetings with potential investors and capital markets professionals. The conference serves as a hub for networking, knowledge exchange, and investment opportunities, while also featuring panel discussions with industry experts to offer insights into current trends, challenges, and opportunities within the technology sector.

Cantech Letter會議被認爲是加拿大首要的科技投資活動,爲新興科技公司提供獨特機會,展示他們的創新與增長戰略,並與潛在投資者和資本市場專業人士進行一對一會議。 該會議是網絡、知識交流和投資機會的中心,並舉行與行業專家的小組討論,提供有關科技行業中當前趨勢、挑戰和機會的見解。

About FTG Corporation

關於FTG公司

FTG has two operating units and is growing fast through organic growth initiatives and acquisitions. FTG Circuits is a manufacturer of high technology, high reliability printed circuit boards for the aerospace and defence markets. FTG Aerospace designs, manufactures and repairs cockpit panels, keyboards and assemblies for the aerospace and defence markets. FTG has nine operating sites located in the United States, Canada and China.

FTG有兩個營運單位,並通過有機增長和收購迅速發展。 FTG Circuits是一家爲航空航天和國防市場製造高科技、高可靠性印刷電路板的製造商。 FTG Aerospace設計、製造和修復用於航空航天和國防市場的駕駛艙面板、鍵盤和總成。 FTG在美國、加拿大和中國擁有九個營運地點。

For additional Information, please contact:
Mr. Brad Bourne, President and CEO
416 471 9960
bradbourne@ftgcorp.com

如需更多信息,請聯繫:
布拉德·博恩先生,總裁兼首席執行官
416 471 9960
bradbourne@ftgcorp.com

声明:本內容僅用作提供資訊及教育之目的,不構成對任何特定投資或投資策略的推薦或認可。 更多信息
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