Silicon Labs Series 3 Platform Guides the IoT Evolution
Silicon Labs Series 3 Platform Guides the IoT Evolution
Silicon Labs execs showcase AI's role in shaping the future of wireless at first-ever embedded world North America keynote
Silicon Labs高管展示了人工智能在塑造無線未來方面的作用,首次在北美嵌入式世界大會上發表主題演講
AUSTIN, Texas, Oct. 8, 2024 /PRNewswire/ -- Silicon Labs, a leader in secure, intelligent wireless technology for a more connected world, delivered the opening keynote for the inaugural embedded world North America today, with CEO Matt Johnson and CTO Daniel Cooley discussing how AI is driving a revolution in IoT, while detailing the continued success of the company's growing Series 2 platform and upcoming Series 3 platform.
2024年10月8日,得克薩斯州奧斯汀 / PRNewswire/ - 領先的安全智能無線技術提供商Silicon Labs今天在首屆北美嵌入式世界大會上發表了開幕主題演講。首席執行官Matt Johnson和首席技術官Daniel Cooley討論了人工智能如何推動物聯網革命,同時詳細介紹了公司不斷成功的Series 2平台和即將推出的Series 3平台。
"AI is rapidly becoming a key growth catalyst that will enable the number of IoT devices to reach over a 100 billion in the next decade," said Silicon Labs President & CEO Matt Johnson. "Our upcoming Series 3 platform's unparalleled capabilities and productivity will unlock new applications and new capabilities across a vast range of industries, from manufacturing and retail to transportation, healthcare, energy distribution, fitness, and agriculture, helping transform each sector in remarkable ways."
「人工智能正迅速成爲一個關鍵的增長催化劑,將使物聯網設備數量在未來十年達到1000億以上,」 Silicon Labs總裁兼首席執行官Matt Johnson表示。「我們即將推出的Series 3平台具有無與倫比的功能和生產力,將解鎖製造和零售、運輸、醫療保健、能源分配、健身和農業等廣泛行業中的新應用和新能力,幫助以令人矚目的方式變革每個行業。」
To realize this vision, IoT devices need to bring powerful upgrades in connectivity, compute, security, and AI/ML capabilities. Silicon Labs today revealed more information on the Series 3 platform that will make that a reality.
爲了實現這一願景,物聯網設備需要在連接性、計算、安全性和人工智能/機器學習能力方面進行強大的升級。今天,Silicon Labs公佈了關於將實現這一願景的Series 3平台的更多信息。
Series 3 SoCs Will Feature World's Most Nimble Modem, Most Secure and Scalable Memory
Series 3 SoCs將擁有世界上最靈活的調制解調器、最安全和可擴展的內存
Series 3 devices will be able to answer the challenges that the continued acceleration of IoT poses: demands for more processing power at far-edge devices across all IoT applications in key areas including, but not limited to, smart cities and civil infrastructure, commercial buildings, retail and warehouses, smart factories and Industry 4.0, smart homes, connected health, and the demand for increasingly portable, secure, compute-intensive applications. They do this by addressing the key needs of the growing IoT:
Series 3設備將能夠應對物聯網持續加速帶來的挑戰:在包括但不限於智能城市和民用基礎設施、商業建築、零售店和倉庫、智能工廠和工業4.0、智能家居、互聯健康及對越來越便攜、安全、計算密集型應用的需求等關鍵領域中,遠端設備需要更多的處理能力。它們通過滿足快速增長的物聯網的關鍵需求來實現這一目標:
- Connectivity: The full Series 3 portfolio will include dozens of products covering all major protocols and frequency bands, to connect just about anything. The first Series 3 device is designed to include the world's most flexible IoT modem, capable of true concurrency on three wireless networks with micro-second channel switching.
- Compute: Series 3 devices will be multicore, with Arm Cortex-M application processors and dedicated co-processors for the radio and security subsystems as well as dedicated high performance machine learning subsystems for select devices. With the most scalable memory architecture in its class, combined with Cortex-M processors ranging from a Cortex-M33 at 133 MHz to dual Cortex-M55s running over 200 MHz, Series 3 devices enable complex applications and embedded real-time operating systems.
- Security: All Series 3 devices will support Silicon Labs Secure Vault High, with additional features like Authenticated Execute in Place to allow trusted communication between the device and the cloud. Series 3 will also have the world's most secure memory interface, hardening one of the primary vectors of attack when intruders gain physical access and protecting the device maker's IP. Series 3 will also incorporate the National Institute of Standards and Technology's recently released post-Quantum encryption standards.
- Smart: Select Series 3 devices will feature Silicon Labs' second-generation Matrix Vector Processor, which offloads complex ML operations off of the main CPU onto a specialized accelerator designed to increase ML performance by up to 100x in wireless, battery-powered devices, drastically reducing power draw.
- 連接性: 所有主要協議和頻段的產品涵蓋了所有主要領域,以連接幾乎所有內容。第一代Series 3設備設計包含了世界上最靈活的物聯網調制解調器,具有真正的三無線網絡併發功能,毫秒級頻道切換。
- 計算: Series 3設備將是多核心的,配備Arm Cortex-m應用處理器和專用協處理器用於射頻和安全子系統,以及專門爲選擇設備設計的高性能機器學習子系統。 具有其類別中最可伸縮的內存架構,結合從133 MHz的Cortex-M33到運行超過200 MHz的雙Cortex-M55的Cortex-m處理器,Series 3設備能夠支持複雜的應用程序和嵌入式實時操作系統。
- 安全性: 所有Series 3設備將支持Silicon Labs Secure Vault High,具有額外功能,如Authenticated Execute in Place,以允許設備與雲之間進行可信的通信。 Series 3還將擁有世界上最安全的內存接口,加固中入侵者獲取物理訪問時攻擊的主要渠道之一,並保護設備製造商的知識產權。 Series 3還將整合美國國家標準與技術研究所最近發佈的量子後加密標準。
- 智能功能: 選擇Series 3設備將配備Silicon Labs第二代Matrix Vector處理器,該處理器能夠將複雜的機器學習操作從主CPU轉移到專門設計的加速器上,從而在無線、電池供電設備上將機器學習性能提高至多達100倍,大幅降低功耗。
A key driver in the design for this IoT revolution is data, which flows between edge devices to the cloud and back again. This two-directional flow makes IoT edge devices an ideal partner in the growing world of AI. Not only can the devices be used to make limited decisions at the edge, like smart thermostats that assess ambient temperatures and adjust a home's HVAC, but also with the advent of massive cloud-based AI applications, edge devices can also play a critical role as data collectors and apply their ML abilities to filter the valuable data from the chaff better. The ability to identify and transmit the data for the "corner cases" that AI operators value to make their systems more intelligent.
這次物聯網革命設計的關鍵驅動力是數據,這些數據在邊緣設備與雲之間流動。這種雙向流動使得物聯網邊緣設備成爲AI快速發展世界中的理想合作伙伴。 這些設備不僅可以用於在邊緣做出有限決策,例如評估環境溫度並調整家庭的暖通空調,而且隨着大規模基於雲的AI應用程序的出現,邊緣設備還可以充當關鍵的數據收集器,將其機器學習功能應用於更好地過濾有價值的數據。通過識別和傳輸AI運營商重視的"邊緣案例"數據,使其系統更智能。
The first Series 3 SoC is currently being sampled by customers, and more information will be revealed in the first half of 2025.
第一代Series 3 SoC目前正在抽樣給客戶,並更多信息將在2025年上半年揭示。
Series 1 and Series 2 SoCs Continue to Break the Air Gap
Series 1和Series 2 SoC持續突破空氣隔離。
Silicon Labs Series 1 and Series 2 devices continue to be successful in helping to scale the IoT, provide secure, robust connectivity, and open up new applications. The Silicon Labs Series 2 platform grows today with the general availability of a family of new Wi-Fi 6 and Bluetooth LE ICs: the SiWG917 wireless MCU (SoC), the SiWN917 network-co-processor for hosted applications, and the SiWT917 radio co-processor IC targeted for applications running higher end operating systems. The SiWx917 family is designed from the ground-up for ultra-low-power Wi-Fi 6 applications, offering up to 2 years battery life on a single AAA battery in select IoT applications.
Silicon Labs Series 1和Series 2設備繼續成功幫助擴大物聯網規模,提供安全穩定的連接,並開發新應用。Silicon Labs Series 2平台如今具備一系列新的Wi-Fi 6和藍牙低功耗IC的通用供應:SiWG917 無線MCU (SoC)、SiWN917 網絡協處理器用於託管應用以及面向在高端操作系統運行應用的SiWT917 射頻協處理器IC。SiWx917系列從頭設計,供超低功耗Wi-Fi 6應用使用,在選擇的物聯網應用中,單個AAA電池可達2年的電池壽命。
Earlier this year, Silicon Labs announced the BG26 and MG26 devices for Bluetooth and 802.15.4 connectivity. These wireless SoCs are built to be future proof as the needs of the IoT grow and feature the same Matrix Vector Processor for dedicated machine learning as the upcoming Series 3. The MG26 and BG26 doubled their predecessor's Flash, RAM, and GPIO, and this innovation earned them one of IoT Evolution's Product of the Year awards.
今年早些時候,Silicon Labs宣佈爲藍牙和802.15.4連接性推出BG26和MG26設備。這些無線SoC旨在未來證明物聯網需求增長,擁有與即將推出的Series 3相同的專用機器學習矩陣矢量處理器。MG26和BG26將其前身的Flash、RAM和GPIO翻倍,此創新使它們贏得了物聯網進化年度產品獎之一。
Silicon Labs Series 2 devices also serve an emerging area around Ambient IoT. This exciting new technology allows IoT devices to draw power from ambient sources in their environment, like indoor or outdoor ambient light, ambient radio waves, and kinetic motion. In partnership with PMIC manufacturer e-peas, Silicon Labs announced the xG22E, a new ultra-low power variant of the xG22 wireless SoC that has a substantially reduced power budget and advanced sleep/wake engines that allow it to operate within the ambient IoT power envelope. This broadly applies to sensors, switches, and commercial applications like electronic shelf labels.
Silicon Labs Series 2設備還在服務於圍繞環境物聯網的新興領域。這一激動人心的新技術允許物聯網設備從環境中的自然來源獲取電力,如室內或室外環境光線、環境無線電波和動力源。與PMIC製造商e-peas合作,Silicon Labs宣佈了xG22E,這是xG22無線SoC的新的超低功耗變種,具有大幅降低的功耗預算以及先進的睡眠/喚醒引擎,使其能夠在環境物聯網的電力範圍內運行。這廣泛適用於傳感器、開關以及如電子貨架標籤等商業應用。
There is still more to come for Series 2 in 2025 and Series 1, Series 2, and Series 3 will co-exist as strong offerings for vast amount of IoT applications.
2025年Series 2還有更多的亮點,而Series 1、Series 2和Series 3將作爲強大的選擇,共同應用於大量物聯網應用。
Learn More About the Future of IoT at the Silicon Labs Works With Developers Conference
了解更多有關物聯網未來的信息,參加Silicon Labs與開發者會議合作的活動
These SoCs are just a few members of the broadest portfolio of wireless SoCs and MCUs designed for the IoT. There is no other IoT vendor that matches the breadth, depth, and expertise of Silicon Labs.
這些SoC僅是爲物聯網設計的無線SoC和MCU組合中的一小部分。沒有其他物聯網供應商能夠與Silicon Labs的廣度、深度和專業知識相媲美。
To convey that expertise to IoT developers and designers, Silicon Labs is hosting its fifth annual Works With Virtual Developers Conference on November 20 and 21. Free to attend, Works With is the premier developer event for the IoT with over 30 sessions, keynotes, and labs, they can hear about the trends shaping the IoT from experts at Silicon Labs and other industry leaders.
爲了向物聯網開發人員和設計師傳達這一專業知識,Silicon Labs將於11月20日和21日舉辦第五屆年度Works With虛擬開發者大會。參加此會議是免費的,Works With是物聯網的首要開發者活動,將有超過30場會議、主題演講和實驗室,參與者可以從Silicon Labs和其他行業領袖專家那裏了解塑造物聯網的趨勢。
Register for Works With 2024 Virtual and begin building an agenda today.
立即註冊參加2024年的Works With虛擬活動,並開始安排議程。
About Silicon Labs
Silicon Labs is a trailblazer in wireless connectivity for the Internet of Things. Its integrated hardware and software platform, intuitive development tools, and unmatched ecosystem support make Silicon Labs the ideal long-term partner in building advanced industrial, commercial, and home and life applications. Silicon Labs leads the industry in high performance, low power, and security with support for the broadest set of multi-protocol solutions.
關於芯科實驗室
硅實驗室是物聯網無線連接的先驅者。其集成的硬件和軟件平台、直觀的開發工具以及無與倫比的生態支持使硅實驗室成爲建設先進的工業、商業、家庭和生活應用的理想長期合作伙伴。硅實驗室在高性能、低功耗和安全性方面處於行業領先地位,支持最廣泛的多協議解決方案。
Media Contact: Sam Ponedal, [email protected]
媒體聯繫人:Sam Ponedal,[email protected]
SOURCE Silicon Labs
資料來源:芯科實驗室