Li Auto Plans HK Chip R&D Office, Self-driving Chip Could Be Mass-produced Soon, Report Says
Li Auto Plans HK Chip R&D Office, Self-driving Chip Could Be Mass-produced Soon, Report Says
The team is mainly responsible for software development related to smart driving chips, the report said, citing a source close to Li Auto.Li Auto's smart driving chip is expected to see tape-out results in the fourth quarter and start being loaded into cars in 2026, according to local media.
理想汽車的智能駕駛芯片預計將在第四季度看到tape-out的結果，並將在2026年開始加載到汽車中，據當地媒體報道。
Li Auto (NASDAQ: LI) plans to set up a chip R&D office in Hong Kong and is looking for senior AI chip architects, according to a report in local media outlet LatePost today.
理想汽車（納斯達克：LI）計劃在香港設立芯片研發辦公室，並正在尋找高級ai芯片架構師，據當地媒體LatePost今天報道。
The office, which will be positioned as an international technology exchange center, is part of Li Auto's chip pre-research division, and the team is expected to be about 10 people, according to the report.
據報道，該辦公室將定位爲國際技術交流中心，是理想汽車芯片預研部門的一部分，團隊預計將約10人。
The team is mainly responsible for software development related to smart driving chips, the report said, citing a source close to Li Auto.
報道稱，該團隊主要負責與智能駕駛芯片相關的軟件開發，引述了一位接近理想汽車的消息來源。
Li Auto is recruiting talents related to chips and training clusters in Hong Kong, requiring candidates to understand the chip industry's design technology, advanced processes, and have the ability to complete chip industry research, project research and investment, the report noted.
據報道，理想汽車正在香港招聘與芯片相關的人才和培訓集群，要求候選人了解芯片行業的設計技術、先進工藝，並具備完成芯片行業研究、項目研究和投資的能力。
The company is developing two chips in-house, an AI chip for smart driving, and a SiC power chip for motor controllers, according to LatePost.
據LatePost報道，該公司正在自主開發兩款芯片，一款用於智能駕駛的ai芯片，另一款是用於電機控制器的SiC功率芯片。
The AI chip uses an architecture similar to Tesla's (NASDAQ: TSLA) Hardware 5.0, with about 40 billion transistors, and has been sent to TSMC for tape-out, the report said.
報道稱，AI芯片採用類似於特斯拉（納斯達克：TSLA）硬件5.0的架構，約有400億個晶體管，並已經被送到TSMC進行tape-out。
The smart-driving chip is expected to see tape-out results in the fourth quarter and begin being loaded into cars in 2026, according to LatePost.
根據LatePost的報道，智能駕駛芯片預計將在第四季度看到投片結果，並於2026年開始加載進汽車。
Tape-out is a technical term in the field of integrated circuit design that refers to the process of transforming a circuit design into a chip that can be produced on an assembly line after the chip design has been completed.
投片是集成電路設計領域的技術術語，指的是在芯片設計完成後，將電路設計轉化爲可在裝配線上生產的芯片的過程。
After successful tape-out, a prototype chip can begin mass production if it passes subsequent testing.
成功投片後，如果通過後續測試，原型芯片就可以開始批量生產。
Nio (NYSE: NIO) unveiled the Shenji NX9031 at Nio Day 2023, held on December 23, 2023, which will be used in the ET9, with deliveries of the sedan set to begin in the first quarter of 2025.
蔚來（紐交所：NIO）在2023年12月23日舉辦的蔚來品牌日上發佈了Shenji NX9031，將用於ET9，該轎車預計於2025年第一季度開始交付。
At the Nio IN 2024 tech day event in Shanghai on July 27, Nio announced that it has seen successful tape-out of its Shenji NX9031 chip.
2024年7月27日在上海舉辦的蔚來IN 2024科技日活動上，蔚來宣佈已成功完成Shenji NX9031芯片的投片。
Another local electric vehicle (EV) maker, Xpeng (NYSE: XPEV), has also seen the tape-out of its smart driving chip.
另一家本地電動汽車（EV）製造商小鵬（紐交所：XPEV），也已經完成了其智能駕駛芯片的投片。
Xpeng announced at the launch of its new Mona M03 on August 27 that its first AI chip, Turing, saw a successful tape-out on August 23.
小鵬在8月27日新車Mona M03的發佈會上宣佈，其首款ai芯片Turing在8月23日成功投片。
The Turing chip will be used in Xpeng's EVs, robots, and flying cars, Xpeng said at the time.
小鵬當時表示，Turing芯片將用於小鵬的電動汽車、機器人和飛行汽車。
These Chinese EV makers followed Tesla's move, which mass-produced its self-developed FSD (Full Self-Driving) chip in March 2019, with cumulative shipments of over 12 million units.
這些中國電動汽車製造商效仿特斯拉的舉動，於2019年3月開始大規模生產其自主研發的FSD（全自動駕駛）芯片，累計出貨量超過1200萬台。
Nio IN 2024: Autonomous driving chip, SkyOS, 2nd-gen Nio Phone, and more
Nio在2024年的計劃：自主駕駛芯片、SkyOS、第二代Nio手機等等。
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