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Research House Gives Higher Fair Value For 3REN

Research House Gives Higher Fair Value For 3REN

研究機構爲3REN提高了更高的公平價值
Business Today ·  10/18 02:54

Research house Public Investment Bank has given ratings review for 3REN before its official IPO, with a fair value of RM0.34 compared to its IPO price of RM0.28.

研究機構公共投資銀行在3REN正式首次公開募股之前已經對其進行了評級審查,其公允價值爲0.34令吉,而其首次公開募股價格爲0.28令吉。

Primarily serving the semiconductor and electronics industry value chain, 3REN Bhd (3REN) is principally involved in provision of product engineering services, provision of engineering support services for integrated circuit (IC) assembly and testing, iii) design, development, and sale of digitalised solutions, as well as iv) design, development, and sale of automated equipment.

3REN Bhd(3REN)主要爲半導體和電子行業價值鏈提供服務,主要參與提供產品工程服務,爲集成電路(IC)組裝和測試提供工程支持服務,iii)數字化解決方案的設計、開發和銷售,以及 iv)自動化設備的設計、開發和銷售。

Beyond the semiconductor and electronics sectors, its digitalised solutions and automated equipment are also tailored for customers in manufacturing industries, as well as other sectors such as automotive, healthcare, industrial, and local city councils. Currently, 3REN carries out most of its business through its Penang headquarters, with additional offices in Selangor.

除半導體和電子領域外,其數字化解決方案和自動化設備還爲製造業以及汽車、醫療保健、工業和地方市議會等其他領域的客戶量身定製。目前,3REN通過其檳城總部開展大部分業務,並在雪蘭莪州設有辦事處。

According to PIB, the group is strengthening its research and development (R&D) with projects like the Nervii Platform and Universal Test Automation Platform (Uni-TAP), aiming for commercialisation by 4QCY26. It also plans to open two Delivery Centres to enhance efficiency, scalability, and provide more sophisticated engineering services, with the first expected to begin operations in 4QCY24.

根據PiB的說法,該集團正在通過Nervi平台和通用測試自動化平台(Uni-Tap)等項目加強研發(R&D),目標是通過 4QCY26 實現商業化。它還計劃開設兩個交付中心,以提高效率和可擴展性並提供更復雜的工程服務,第一個交付中心預計將在 4QCY24 中開始運營。

Additionally, PIB said 3REN will establish a marketing and sales office in Singapore by 1HCY25 to ultimately expand its reach into international markets, boosting its competitiveness and operational growth. Public Investment Bank said it derives a fair value of RM0.34 based on a 16x PE multiple to its FY25F EPS of 2.1sen. The IPO is expected to raise approximately RM30.8m from the issuance of 110.0m new shares. Besides utilising 23.4% of the proceeds for setting up new Delivery Centres. 16.6% and 9.7% of the proceeds are allocated for R&D expenditure and establishment of new Singapore office, respectively.

此外,PiB表示,3REN將在 1HCY25 之前在新加坡建立一個營銷和銷售辦事處,以最終擴大其在國際市場的影響力,提高其競爭力和運營增長。公共投資銀行表示,根據其 FY25F 每股收益2.1仙的16倍市盈率,其公允價值爲0.34令吉。此次首次公開募股預計將通過發行11000萬股新股籌集約3080萬令吉的資金。除了將收益的23.4%用於建立新的交付中心外。16.6%和9.7%的收益分別用於研發支出和設立新的新加坡辦事處。

Growth drivers. 3REN's growth will be driven by: i) strengthening of its R&D capabilities, ii) setting up of new Delivery Centres, and iii) establishment of a new office in Singapore.

增長動力。3REN的增長將由以下因素驅動:i)加強其研發能力,ii)建立新的交付中心,以及iii)在新加坡設立新辦事處。

Competitive strengths. 3REN's competitive strengths include: i) wide range of solutions and services, ii) wide range of recurring and multinational customers, iii) experienced and technically-strong key management team, iv) solutions and services with consistent quality, as well as v) mobilisation of project team with contractual workforce.

競爭優勢。3REN的競爭優勢包括:i) 廣泛的解決方案和服務,ii) 廣泛的經常性客戶和跨國客戶,iii) 經驗豐富、技術實力雄厚的關鍵管理團隊,iv) 質量穩定的解決方案和服務,以及 v) 動員具有合同工的項目團隊。

Catalysts. Key drivers may include: i) growth in semiconductor and electronic industries, together with manufacturing-related industries, ii) modernisation and transformation of manufacturing facilities, iii) increased outsourcing and relocation of manufacturing activities to Southeast Asia, and iv) government initiatives to develop the nation's semiconductor ecosystem.

催化劑。關鍵驅動因素可能包括:i) 半導體和電子行業以及製造相關行業的增長,ii) 製造設施的現代化和轉型,iii) 增加製造活動的外包和向東南亞的遷移,以及 iv) 政府發展國家半導體生態系統的舉措。

Key risks. Key downside risks, among others, include: i) dependency on semiconductor and electronics industry, ii) competition, iii) dependency on its ability to secure new purchase orders, and iv) dependency on certain major customers.

主要風險。主要的下行風險包括:i) 對半導體和電子行業的依賴,ii) 競爭,iii) 對其獲得新採購訂單的能力的依賴,以及 iv) 對某些主要客戶的依賴。

声明:本內容僅用作提供資訊及教育之目的,不構成對任何特定投資或投資策略的推薦或認可。 更多信息
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