ACM Research Announced A Major Performance Breakthrough For Its Flagship Ultra C Tahoe Cleaning Tool, To Meet Technical Requirements Of Advanced Nodes For Foundry, Logic And Memory Applications For Front-end Semiconductor Manufacturing
ACM Research Announced A Major Performance Breakthrough For Its Flagship Ultra C Tahoe Cleaning Tool, To Meet Technical Requirements Of Advanced Nodes For Foundry, Logic And Memory Applications For Front-end Semiconductor Manufacturing
The Ultra C Tahoe now achieves the performance of standalone single-wafer cleaning tools on low-to-medium temperature sulfuric peroxide mix (SPM) processes. Tahoe's patented hybrid architecture is among the first in the industry to combine batch wafer processing and single wafer cleaning chambers into the same SPM tool. The hybrid architecture delivers enhanced cleaning performance, high throughput, and process flexibility, with up to 75% reduction in chemical consumption. ACM estimates cost savings of up to $500,000 per year from sulfuric acid alone, with additional environmental and cost benefits from reduced sulfuric acid treatment and disposal.
Ultra C Tahoe現在在低至中溫硫酸過氧化氫混合物（SPM）工藝上實現了獨立的單晶圓清潔工具的性能。Tahoe的專利混合架構是行業中首個將批處理晶圓加工和單晶圓清潔室結合在同一個SPM工具中的架構之一。混合架構提供了增強的清潔性能、高送轉和工藝靈活性，化學消耗量最多減少75%。ACm估計單單從硫酸中每年可節省高達50萬美元的成本，此外還可從減少硫酸處理和處置中獲得額外的環保和經濟效益。
