Taiwan Semiconductor Manufacturing Co (NYSE:TSM) is making waves in the semiconductor industry with a $65 billion investment in Arizona, bolstering the U.S.'s advanced chipmaking capabilities. The U.S. will likely secure the second-largest global market share in advanced semiconductor production by 2027, increasing its share from 9% to 21%, the Taipei Times cites from a TrendForce Corp report.
Taiwan Semiconductor is developing cutting-edge 3nm, 2nm, and even 1.4nm processes, with mass production of 3nm chips already underway in Tainan, Taiwan.
Two advanced fabs in Arizona will begin production in 2024 and 2028, focusing on 4nm and 3nm processes, respectively. A third fab using 2nm or more advanced technology is expected by 2030.
Taiwan, however, will likely see its share of advanced integrated circuit (IC) processes decline from 71% to 54% by 2027.
South Korea will likely experience a dip, dropping from 11% to 9%, relegating it to the third spot globally.
The U.S. government's focus on semiconductor self-sufficiency grows as global competition intensifies. Taiwan Semiconductor bagged up to $6.6 billion in U.S. subsidies and $5 billion in proposed loans to build advanced chip plants in Arizona.
A Boston Consulting Group report estimates that U.S. semiconductor manufacturing capacity could triple by 2032, driven by policies like the CHIPS Act. U.S. capital expenditure on semiconductors will likely constitute 28% of the global total between 2025 and 2032.
Taiwan Semiconductor is ramping up domestic and global expansion efforts. Over the next decade, the company plans to construct new factories annually in Taiwan, with sites in Kaohsiung, Tainan, and Taichung.
The contract chipmaker is also advancing its international projects, including a second facility in Japan's Kumamoto region set to begin construction in 2025 and advanced plants in Arizona and Dresden. The company continues to innovate in advanced packaging technologies like CoWoS and SoIC to stay ahead in the semiconductor market.
Taiwan Semiconductor forecasts record capital expenditures between $34 billion and $38 billion to support its growth in 2025.
Advanced Micro Devices, Inc (NASDAQ:AMD) has recently tapped Taiwan Semiconductor to foray into the smartphone market, leveraging the chipmaker's 3nm process to target Samsung's flagship models.
Taiwan Semiconductor stock surged over 82% year-to-date.
Price Action: TSM stock is down 0.15% at $184.80 premarket at last check Tuesday.
臺灣半導體制造有限公司（NYSE:TSM）在亞利桑那州投資 650 億美元，加強了美國先進的芯片製造能力，從而在半導體行業掀起了波瀾。《臺北時報》援引TrendForce Corp的一份報告稱，到2027年，美國可能會在先進半導體生產中獲得全球第二大市場份額，將其份額從9％增加到21％。
臺灣半導體正在開發尖端的3nm、2nm甚至1.4nm工藝，3nm芯片的批量生產已經在臺灣臺南進行。
亞利桑那州的兩座先進晶圓廠將在2024年和2028年開始生產，分別專注於4納米和3納米工藝。預計到2030年將有第三家晶圓廠使用2納米或更先進的技術。
但是，到2027年，臺灣在先進集成電路（IC）工藝中的份額可能會從71％下降到54％。
韓國可能會出現下滑，從11％下降到9％，降至全球第三位。
隨着全球競爭的加劇，美國政府對半導體自給自足的關注也越來越多。臺灣半導體獲得了高達66億美元的美國補貼和50億美元的擬議貸款，用於在亞利桑那州建造先進的芯片工廠。
波士頓諮詢集團的一份報告估計，受CHIPS法案等政策的推動，到2032年，美國的半導體制造能力可能會增加三倍。2025年至2032年間，美國在半導體方面的資本支出可能佔全球總額的28％。
臺灣半導體正在加大國內和全球擴張力度。在接下來的十年中，該公司計劃每年在臺灣建造新工廠，在高雄、臺南和臺中設立工廠。
這家合同芯片製造商還在推進其國際項目，包括定於2025年開始建設的日本熊本地區的第二座工廠，以及亞利桑那州和德累斯頓的先進工廠。該公司繼續在先進封裝技術方面進行創新，如CowOS和SoIC，以保持半導體市場的領先地位。
臺灣半導體預測，創紀錄的340億至380億美元的資本支出將支持其2025年的增長。
Advanced Micro Devices, Inc（納斯達克股票代碼：AMD）最近聘請臺灣半導體進軍智能手機市場，利用該芯片製造商的3納米工藝來瞄準三星的旗艦機型。
迄今爲止，臺灣半導體股價飆升了82％以上。
價格走勢：在週二的最後一次盤前檢查中，tSM股價下跌0.15％，至184.80美元。
