ACM Research Announces The Qualification Of Its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace Tool
ACM Research Announces The Qualification Of Its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace Tool
ACM Research, Inc. ("ACM") (NASDAQ:ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool. The tool has achieved process qualification at a mainland China semiconductor customer, and is now entering mass production. ACM also announced that its Ultra Fn A Thermal Atomic Layer Deposition (Thermal ALD) Furnace tool, introduced in 2022, has successfully completed process qualification with another leading mainland China customer, demonstrating performance parameters that it believes match or exceed competitive tools.
ACM Research, Inc.（"ACM"）（納斯達克：ACMR），作爲半導體和愛文思控股應用的領先晶圓加工解決方案供應商，今天宣佈其Ultra Fn A等離子體增強原子層沉積（PEALD）爐工具的驗證。這款工具已在中國大陸的一家半導體客戶處完成工藝驗證，現在正在進入大規模生產。ACM還宣佈，其在2022年推出的Ultra Fn A熱原子層沉積（熱ALD）爐工具，已成功在另一家領先的中國大陸客戶處完成工藝驗證，展示出其認爲與競爭工具相匹配或超越的性能參數。
