Rapidus Collaborates With Synopsys to Shorten Semiconductor Design Cycles
Rapidus Collaborates With Synopsys to Shorten Semiconductor Design Cycles
TOKYO, Dec. 10, 2024 /PRNewswire/ -- SEMICON Japan Booth #2148 -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a leading provider of silicon to systems design solutions, to enable a solution that will shorten design cycle time, using a revolutionary new approach to natively model process sensitivity and variation in the design steps. This new approach dramatically reduces the need for expensive re-characterization of libraries and memories during different phases of the process evolution leading to a significant reduction in design iterations and acceleration of the overall project execution cycle.
東京,2024年12月10日 /PRNewswire/ — SEMICON 日本展位 #2148 — 先進邏輯半導體制造商Rapidus Corporation今天宣佈,它已與硅轉系統設計解決方案的領先提供商新思科技公司簽署協議,使用革命性的新方法對過程靈敏度和設計步驟的變化進行原生建模,從而實現縮短設計週期的解決方案。這種新方法極大地減少了在流程演進的不同階段對庫和存儲器進行昂貴的重新表徵的需求,從而顯著減少了設計迭代並加快了整個項目執行週期。
As part of the agreement, Synopsys will develop advanced design flows leveraging its AI-driven EDA suite and enable a broad IP portfolio on Rapidus' 2nm gate-all-around (GAA) process. The collaboration will facilitate Rapidus' Design for Manufacturing and Co-Optimization (DMCO) concept for simultaneously optimizing design and manufacturing and enabling agile design.
作爲協議的一部分,新思科技將利用其人工智能驅動的EDA套件開發先進的設計流程,並在Rapidus的2納米全能門(GAA)工藝上實現廣泛的IP產品組合。此次合作將促進Rapidus的製造與協同優化設計(DMCO)概念,以同時優化設計和製造,實現敏捷設計。
Characterization of the IP library is one of the bottlenecks in semiconductor design cycle time because the IP needs to be recharacterized each time the process design kit (PDK) or manufacturing process is updated. It can take two to three months to generate a timing model, which drastically slows down the design process. The new DMCO solution will address these bottlenecks by using Synopsys AI-driven EDA products, including Synopsys PrimeShield, a machine learning (ML)-based timing model generation tool employing sensitivity libraries whenever PDKs or manufacturing processes are updated. Additionally, calibration using silicon data from Rapidus' short turnaround time (TAT) manufacturing process will improve model accuracy and accelerate design convergence.
IP 庫的特性是半導體設計週期的瓶頸之一,因爲每次更新工藝設計套件 (PDK) 或製造過程時,都需要對 IP 進行重新表徵。生成時序模型可能需要兩到三個月的時間,這會大大減慢設計過程。新的DMCO解決方案將使用新思科技人工智能驅動的EDA產品來解決這些瓶頸,包括新思科技PrimeShield,這是一種基於機器學習(ML)的時序模型生成工具,每當更新PDK或製造流程時,都會使用靈敏度庫。此外,使用來自 Rapidus 短週轉時間 (TAT) 製造過程的硅數據進行校準將提高模型精度並加速設計融合。
"Synopsys continues to play a mission-critical role as an on-ramp to the world's leading foundries and we are often the first stop for foundry enablement," said Sassine Ghazi, president and CEO of Synopsys. "Our extensive collaboration with Rapidus across Synopsys AI-driven EDA flows, IP and expert methodology services will facilitate an advanced DMCO solution that will enable designers to achieve optimal quality of results and high manufacturing yield for Rapidus' 2nm GAA process."
新思科技總裁兼首席執行官Sassine Ghazi表示:「作爲通往世界領先鑄造廠的入口,新思科技繼續發揮關鍵任務的作用,我們通常是鑄造支持的第一站。」「我們與Rapidus在人工智能驅動的EDA流程、知識產權和專家方法服務方面的廣泛合作將促進先進的DMCO解決方案,使設計人員能夠爲Rapidus的2nm GAA工藝實現最佳的結果質量和高製造產量。」
By incorporating the concept of Manufacturing for Design (MFD) in addition to conventional Design for Manufacturing (DFM), Rapidus will be able to use sensors and AI in the wafer process to streamline designs based on silicon big data from the manufacturing process. This collaboration will incorporate Rapidus' big data into Synopsys AI-driven EDA flows to realize MFD for mutual customers. In addition, the Synopsys portfolio of interface and foundation IP for Rapidus process technologies will reduce integration risk and accelerate the path to silicon success.
除了傳統的製造設計(DFM)之外,通過整合以設計爲製造(MFD)的概念,Rapidus將能夠在晶圓工藝中使用傳感器和人工智能,根據製造過程中的硅大數據來簡化設計。此次合作將把Rapidus的大數據整合到新思科技的人工智能驅動的EDA流程中,爲共同的客戶實現MFD。此外,新思科技針對Rapidus工藝技術的接口和基礎IP產品組合將降低集成風險並加快硅成功之路。
Rapidus is building its Rapid and Unified Manufacturing Service (RUMS) to shorten the overall time-to-market for customers by providing integrated design support and front-end and back-end processes that will continue to enhance design support through DMCO.
Rapidus 正在構建其快速統一製造服務 (RUMS),通過提供集成的設計支持以及前端和後端流程來縮短客戶的總體上市時間,這些流程將繼續通過 DMCO 增強設計支持。
Dr. Atsuyoshi Koike, CEO of Rapidus, said: "Our partnership with Synopsys is an important milestone in helping to simplify and quicken the design process. Rapidus' vision for RUMS is to use a single-wafer front-end process. The massive amount of data that can be obtained from this process is highly compatible with Synopsys AI-driven EDA flows and IP, and we believe that this will be a step toward achieving our goal of short TAT production that is quicker than anywhere else."
Rapidus首席執行官小池厚義博士表示:「我們與新思科技的合作是幫助簡化和加快設計過程的重要里程碑。Rapidus對RUMS的願景是使用單晶圓前端工藝。從這個過程中可以獲得的大量數據與新思科技的人工智能驅動的EDA流程和IP高度兼容,我們相信這將是朝着實現比其他任何地方都更快的短TaT生產的目標邁出的一步。」
About Rapidus Corporation
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. By developing and providing services to shorten cycle times for design, wafer processes, 3D packaging, and other aspects of semiconductor production, Rapidus creates new industries together with customers. We continue to embrace challenges that contribute to the fulfillment, prosperity, and happiness of people's lives using semiconductors.
關於Rapidus Corporation
Rapidus 公司的目標是開發和製造世界上最先進的邏輯半導體。通過開發和提供縮短設計、晶圓工藝、三維封裝和半導體生產其他方面的週期時間的服務,Rapidus與客戶共同創造了新行業。我們將繼續接受挑戰,這些挑戰有助於使用半導體實現人們生活的充實、繁榮和幸福。
About Rapidus Corporation |
|
Headquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0032, Japan | |
Establishment: |
August 10th, 2022 |
Executives: |
Tetsuro Higashi, Chairman of the Board of Directors |
Atsuyoshi Koike, President and Representative Director |
|
Business: |
Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components |
Capital, etc: |
7,346 million yen (as of November 2022) |
(includes the amount of capital reserve) |
關於Rapidus Corporation |
|
總部:日本東京 102-0032 千代田區小路町 4-1 | |
設立: |
2022年8月10日 |
高管: |
董事會主席東哲郎 |
總裁兼代表董事小池厚義 |
|
業務: |
半導體器件、集成電路和其他電子元件的研究、開發、設計、製造和銷售 |
資本等: |
734600萬日元(截至2022年11月) |
(包括資本儲備金額) |
U.S. Media Contact:
Devan Gillick – Breakaway Communications for Rapidus
Email: [email protected]
Mobile: (530) 591-3194
美國媒體聯繫人:
Devan Gillick — Rapidus 的分離通訊
電子郵件:[電子郵件保護]
手機:(530) 591-3194
SOURCE Rapidus Corporation
來源 Rapidus Corporation