Rapidus Collaborates With Cadence on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
Rapidus Collaborates With Cadence on Leading-Edge 2nm Semiconductor Solutions for AI and HPC Applications
Rapidus and Cadence are working to develop an AI-driven digital and analog/mixed-signal reference design flow that includes Cadence design solutions. Customers will be able to use Cadence's broad portfolio of interface and memory IP components, including HBM4, 224G SerDes, PCI Express 7.0 and more, while also taking advantage of 2nm GAA and BSPDN design and manufacturing solutions that support Rapidus' Design for Manufacturing and Co-Optimization (DMCO) concept.Collaboration spans interface and memory IP utilizing 2nm gate-all-around, BSPDN technology and AI-driven reference flows to facilitate the development of advanced, energy-efficient chips
協作跨越接口和內存知識產權，利用2納米全柵極技術、BSPDN技術和人工智能驅動的參考流程，以促進先進、節能芯片的開發
TOKYO, Dec. 10, 2024 /PRNewswire/ -- SEMICON Japan Booth #2148 -- Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced a collaboration with Cadence Design Systems, Inc. to provide co-optimized AI-driven reference design flows and a broad IP portfolio. The new collaboration will support the Rapidus 2nm gate-all-around (GAA) process and leverage the design and manufacturing benefits from its backside power delivery network (BSPDN) technology to provide design solutions and IP portfolio to customers.
東京，2024年12月10日 / 美通社 / -- SEMICON日本展位#2148 -- Rapidus公司，一家先進邏輯半導體制造商，今天宣佈與鏗騰電子公司合作，提供共同優化的人工智能驅動參考設計流程和廣泛的知識產權組合。新的合作將支持Rapidus的2納米全柵極（GAA）工藝，並利用其背部電源分配網絡（BSPDN）技術的設計和製造優勢，爲客戶提供設計解決方案和知識產權組合。
As the semiconductor industry struggles to keep up with significantly increasing design challenges driven by the need for more computation, GAA and BSPDN manufacturing technologies are becoming vital to meet increasingly stringent power, performance and area requirements.
隨着半導體行業在滿足不斷增加的計算需求所帶來的設計挑戰上苦苦掙扎，GAA和BSPDN製造技術正在變得至關重要，以滿足日益嚴格的功率、性能和麪積要求。
Rapidus and Cadence are working to develop an AI-driven digital and analog/mixed-signal reference design flow that includes Cadence design solutions. Customers will be able to use Cadence's broad portfolio of interface and memory IP components, including HBM4, 224G SerDes, PCI Express 7.0 and more, while also taking advantage of 2nm GAA and BSPDN design and manufacturing solutions that support Rapidus' Design for Manufacturing and Co-Optimization (DMCO) concept.
Rapidus和Cadence正在合作開發一個人工智能驅動的數字和模擬/混合信號參考設計流程，其中包括Cadence的設計解決方案。客戶將能夠使用Cadence廣泛的接口和內存知識產權元件組合，包括HBM4、224G SerDes、PCI Express 7.0等，同時也將受益於2納米GAA和BSPDN設計及製造解決方案，這些方案支持Rapidus的製造設計與共同優化（DMCO）概念。
"Our broad collaboration with Rapidus for 2nm GAA BSPDN technology leverages Cadence's AI-driven solutions to solve real-world problems and meet customer needs," said Dr. Anirudh Devgan, president and CEO at Cadence. "By bringing together Cadence's advanced interface and memory IP technology, reference flows and Rapidus' process technology, we're empowering the buildout of the AI infrastructure of tomorrow."
"我們與Rapidus在2納米GAA BSPDN技術上的廣泛合作利用了Cadence的人工智能驅動解決方案，解決現實世界問題並滿足客戶需求，" Cadence總裁兼首席執行官安尼魯德·德夫甘博士表示。"通過將Cadence的先進接口和內存知識產權技術、參考流程與Rapidus的工藝技術結合起來，我們正在使明天的人工智能基礎設施得以構建。"
"Our collaboration with Cadence on 2nm BSPDN technology puts us at the industry's forefront, marking a major leap in semiconductor innovation for performance and efficiency. By combining our expertise, we're excited to set new technology standards and create transformative solutions for our mutual customers and the industry," said Dr. Atsuyoshi Koike, CEO of Rapidus.
"我們與Cadence在2納米BSPDN技術上的合作使我們站在行業最前沿，標誌着半導體創新在性能和效率上的重大飛躍。通過結合我們的專業知識，我們很高興設定新的技術標準，併爲我們的共同客戶和行業創造變革性解決方案，" Rapidus首席執行官小池篤義博士表示。
About Rapidus Corporation
Rapidus Corporation aims to develop and manufacture the world's most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging, and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity, and happiness of people's lives through the use of semiconductors.
關於Rapidus公司
Rapidus公司旨在開發和製造世界上最先進的邏輯半導體。我們將通過開發和提供服務來縮短設計、晶圓工藝、3D封裝等週期時間，與客戶一起創造新產業。我們將繼續挑戰自我，以通過使用半導體來貢獻人們生活的滿足、繁榮和幸福。
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About Rapidus Corporation | |
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Headquarters: |
4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0032, Japan |
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Establishment: |
August 10th, 2022 |
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Executives: |
Tetsuro Higashi, Chairman of the Board of Directors |
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Business: |
Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components |
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Capital, etc: |
7,346 million yen (as of November 2022) |
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關於Rapidus公司 | |
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總部： |
日本東京千代田區小冢町4-1，郵政編碼102-0032 |
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成立： |
2022年8月10日 |
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高管： |
東村哲郎，董事會主席 |
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業務: |
半導體器件、特斯拉-集成電路及其他電子元器件的研發、設計、製造和銷售 |
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資本，以太經典： |
734600萬日元（截至2022年11月） |
U.S. Media Contact:
Devan Gillick – Breakaway Communications for Rapidus
Email: [email protected]
Mobile: (530) 591-3194
美國媒體聯繫人：
Devan Gillick – Breakaway Communications 爲 Rapidus
電子郵件: [email protected]
手機: (530) 591-3194
SOURCE Rapidus Corporation
來源: Rapidus Corporation