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Aehr Test Systems Secures Initial $10 Million in Orders for Production Wafer-Level Burn-In of Advanced AI Processors

Aehr Test Systems Secures Initial $10 Million in Orders for Production Wafer-Level Burn-In of Advanced AI Processors

Aehr Test Systems獲得首批1000萬美元的訂單,用於先進人工智能處理器的生產晶圓級燒錄。
Aehr Test Systems ·  12/16 13:00

Fremont, CA (December 16, 2024) – Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced a significant milestone with the receipt of its first artificial intelligence (AI) customer order for multiple high-power FOX-XP wafer level test and burn-in systems and multiple sets of Aehr Test proprietary WaferPakTM Contactors. These initial volume production orders are valued at over $10 million with the first system scheduled to ship immediately and completion of the shipments of the systems and initial product WaferPaks within 90 days.

加利福尼亞州弗裏蒙特(2024年12月16日)——半導體測試和老化設備的全球供應商艾爾測試系統(納斯達克股票代碼:AEHR)今天宣佈了一個重要的里程碑,收到了其第一份人工智能(AI)客戶訂單,訂購了多個高功率FOX-XP晶圓級測試和老化系統以及多套Aehr Test專有WaferpakTM接觸器。這些初始批量生產訂單價值超過1000萬美元,第一套系統計劃立即發貨,並在90天內完成系統和初始產品WaferPaks的發貨。

Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are excited that after successfully proving the wafer level test performance and throughput on our systems at our headquarters in Silicon Valley California, this cutting-edge AI customer has chosen our new high-power FOX-XP solution for production wafer level test and burn-in of their AI processors. We were able to successfully demonstrate the FOX-XP production system to the customer and anticipated this order and first system shipment before the end of our fiscal quarter ended November 30, 2024. Instead, with the order received just now, the systems will all ship within this fiscal quarter ending February 28, 2025.

Aehr Test Systems總裁兼首席執行官蓋恩·埃裏克森評論說:“在我們位於加利福尼亞硅谷的總部成功證明了我們系統的晶圓級測試性能和吞吐量之後,這個尖端的人工智能客戶選擇了我們新的高功率FOX-XP解決方案進行生產晶圓級測試和人工智能處理器的老化,我們對此感到非常興奮。我們成功地向客戶演示了FOX-XP生產系統,並預計將在截至2024年11月30日的財政季度結束之前完成此訂單和第一批系統發貨。相反,由於剛剛收到訂單,這些系統將在截至2025年2月28日的本財政季度內全部發貨。

"This marks a technology and commercial breakthrough for Aehr as it significantly expands the market opportunities for our FOX-XP wafer level test and burn-in systems. This new AI customer recognizes the substantial advantages of conducting production test and burn-in at wafer level, before integration into the final product. This approach offers greater cost efficiency, improved yields, and scales significantly better in the semiconductor manufacturing process compared to the required burn-in testing later in the product manufacturing cycle.

“這標誌着Aehr在技術和商業上的突破,因爲它極大地擴大了我們的FOX-XP晶圓級測試和老化系統的市場機會。這個新的人工智能客戶認識到了在集成到最終產品之前在晶圓層面進行生產測試和老化的巨大優勢。與產品製造週期後期所需的老化測試相比,這種方法在半導體製造過程中提供了更高的成本效率、更高的良率,並且可以顯著改善半導體製造過程的規模。

"This latest turnkey solution from Aehr using our FOX-XP multi-wafer test and burn-in system with our proprietary WaferPak full wafer Contactors provides thousands of watts of power delivery and thermal control per wafer. It enables a first ever ability to do a cost-effective production test and burn-in of high-power devices such as AI accelerators at the wafer level with temperatures reaching up to 150 degrees Celsius. This process enables a significant cost saving and yield improvement with the detection and elimination of early life failures during the production process while the devices are still in wafer form, before they are assembled into modules or systems. Our proprietary WaferPaks are designed for high-power applications, providing precise voltage and currents to each device under test. They can deliver thousands of amps of current and cool thousands of watts per wafer while also transmitting the digital signals needed to assess the functionality of both good and bad devices.

“Aehr的最新一站式解決方案使用我們的FOX-XP多晶圓測試和老化系統以及我們專有的WaferPak全晶圓接觸器,爲每個晶圓提供數千瓦的功率傳輸和熱控制。它使人們首次能夠在晶圓級進行具有成本效益的生產測試和高功率設備(例如AI加速器)的老化,溫度可達150攝氏度。在設備仍處於晶圓形狀的情況下,在組裝成模塊或系統之前,該工藝可以檢測和消除生產過程中的早期故障,從而顯著節省成本並提高產量。我們專有的 WaferPAKs 專爲高功率應用而設計,可爲每個被測設備提供精確的電壓和電流。它們可以提供數千安培的電流,可以冷卻每個晶圓數千瓦的功率,同時還可以傳輸評估好壞設備功能所需的數字信號。

"With this solution, we are now able to offer our customers the ability to do production wafer level burn-in of their AI processors and accelerators in addition to our offering of both reliability qualification and production burn-in at package part with our Sonoma ultra-high-power test and burn-in system that we are now shipping in volume to many manufacturers around the world. Aehr Test Systems is the only company in the world that can now offer both wafer level and package level turnkey test and burn-in solutions for these AI processors."

「藉助該解決方案,我們現在能夠爲客戶提供對其人工智能處理器和加速器進行晶圓級燒錄的能力,此外我們還能夠通過我們的Sonoma超高功率測試和老化系統提供可靠性認證和封裝部件的生產老化,我們現在正在向全球許多製造商批量發貨。Aehr Test Systems是世界上唯一一家現在可以爲這些 AI 處理器提供晶圓級和封裝級交鑰匙測試和老化解決方案的公司。」

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as artificial intelligence processors and accelerators, silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.

FOX-XP 和 FOX-NP 系統可提供多個 WaferPak 接觸器(全晶圓測試)或多個 DiepakTM 載體(單晶片/模塊測試)配置,能夠對諸如人工智能處理器和加速器、碳化硅和氮化鎵功率半導體、硅光子學以及其他光學器件、二維和三維傳感器、閃存、磁性傳感器等設備進行功能測試和燒入/循環微控制器和其他前沿集成電路在組裝成單晶圓之前採用任一晶圓形尺寸或多芯片堆疊封裝,或採用單芯片或模塊外形封裝。

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions. Aehr has developed and introduced several innovative products including the FOX-PTM families of test and burn-in systems and FOX WaferPakTM Aligner, FOX WaferPak Contactor, FOX DiePak Carrier and FOX DiePak Loader. The FOX-XP and FOX-NP systems are full wafer contact and singulated die/module test and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge artificial intelligence processors and accelerators, silicon carbide-based and other power semiconductors, 2D and 3D sensors used in mobile phones, tablets, and other computing devices, memory semiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to the FOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mm that enables IC manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems. The FOX DiePak Carrier allows testing, burning in, and stabilization of singulated bare die and modules up to 1024 devices in parallel per DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. Acquired through its acquisition of Incal Technology, Inc., Aehr's new line of high-power packaged part reliability/burn-in test solutions for Artificial Intelligence (AI) semiconductor manufacturers, including its ultra-high-power Sonoma family of test solutions for AI accelerators, GPUs, and high-performance computing (HPC) processors, position Aehr within the rapidly growing AI market as a turn-key provider of reliability and testing that span from engineering to high volume production. For more information, please visit Aehr Test Systems' website at .

關於 Aehr 測試系統
Aehr Test Systems總部位於加利福尼亞州弗裏蒙特,是測試、老化和穩定晶圓級、單晶芯片和封裝零件形式的半導體器件的測試解決方案的領先提供商,已在全球安裝了數千個系統。用於多種應用(包括電動汽車、電動汽車充電基礎設施、太陽能和風能、計算、數據和電信基礎設施以及固態存儲器和存儲)的半導體的質量、可靠性、安全和安保需求不斷提高,這推動了額外的測試需求、容量需求的增加,以及Aehr Test產品和解決方案的新機遇。Aehr 開發並推出了幾款創新產品,包括 Fox-PTM 系列的測試和老化系統以及 FOX WaferPakTM 對準器、FOX WaferPak 接觸器、FOX DiePak Carrier 和 FOX DiePak Loader。FOX-XP 和 FOX-NP 系統是全晶圓接觸和單一晶片/模塊測試和老化系統,可以測試、老化和穩定各種設備,例如領先的人工智能處理器和加速器、基於碳化硅的和其他功率半導體、用於手機、平板電腦和其他計算設備的二維和三維傳感器、存儲器半導體、處理器、微控制器、片上系統和光子集成光學設備和集成光學器件。FOX-CP系統是用於邏輯、存儲器和光子器件的低成本單晶圓緊湊型測試解決方案,也是FOX-P產品系列的最新成員。FOX WaferPak 接觸器包含一個獨特的全晶圓接觸器,能夠測試最大300mm的晶圓,使集成電路製造商能夠在FOX-P系統上對整個晶圓進行測試、燒入和穩定。FOX DiePak Carrier 允許在 FOX-NP 和 FOX-XP 系統上同時測試、燒錄和穩定單個裸芯片和模塊,每個 DiePak 最多可並行 1024 台設備,一次最多可測試 9 個 DiePaks。通過收購Incal Technology, Inc.,Aehr爲人工智能(AI)半導體製造商提供的新系列高功率封裝零件可靠性/老化測試解決方案,包括其針對人工智能加速器、GPU和高性能計算(HPC)處理器的超高功率索諾瑪系列測試解決方案,將Aehr置於快速增長的人工智能市場中,成爲從工程到大批量生產的可靠性和測試的交鑰匙提供商。欲了解更多信息,請訪問 Aehr 測試系統的網站,網址爲。

Safe Harbor Statement
This press release contains certain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements generally relate to future events or Aehr's future financial or operating performance. In some cases, you can identify forward-looking statements because they contain words such as "may," "will," "should," "expects," "plans," "anticipates," "going to," "could," "intends," "target," "projects," "contemplates," "believes," "estimates," "predicts," "potential," or "continue," or the negative of these words or other similar terms or expressions that concern Aehr's expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr's new and existing customers; Aehr's ability to receive orders and generate revenue in the future, as well as Aehr's beliefs regarding the factors impacting the foregoing, including the growth of the markets referred to herein; Aehr's ability to integrate Incal efficiently; the timing and extent to which the acquisition is accretive; the closing of the acquisition; and the growth of the markets referred to herein. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr's recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.

安全港聲明
本新聞稿包含1933年《證券法》第27A條和1934年《證券交易法》第21E條所指的某些前瞻性陳述。前瞻性陳述通常與未來事件或Aehr的未來財務或經營業績有關。在某些情況下,您可以識別前瞻性陳述,因爲它們包含 「可能」、「將」、「應該」、「計劃」、「預期」、「將來」、「可能」、「打算」、「目標」、「項目」、「考慮」、「相信」、「估計」、「預測」、「潛力」 或 「繼續」 等詞語,或者這些詞語或其他詞語的否定性與 Aehr 的期望、戰略、優先事項、計劃或意圖相關的類似術語或表達。本新聞稿中的前瞻性陳述包括但不限於Aehr新老客戶的未來需求和訂單;Aehr接收訂單和未來創收的能力,以及Aehr對影響上述因素的看法,包括本文所述市場的增長;Aehr有效整合Incal的能力;收購增加的時機和程度;收購的結束收購;以及此處提及的市場的增長。本新聞稿中包含的前瞻性陳述還受到其他風險和不確定性的影響,包括Aehr最近向美國證券交易委員會提交的10-k、10-Q表和其他報告中更全面描述的風險和不確定性。Aehr不承擔更新任何前瞻性陳述中包含的信息以反映本新聞稿發佈之日之後發生的事件或情況的任何義務。

Contacts:
Aehr Test Systems
Vernon Rogers
EVP Sales and Marketing
(510) 623-9400 x215
vrogers@aehr.com
MKR Investor Relations Inc.
Todd Kehrli or Jim Byers
Analyst/Investor Contact
(323) 468-2300
aehr@mkr-group.com
聯繫人:
Aehr 測試系統
弗農羅傑斯
銷售和營銷執行副總裁
(510) 623-9400 x215
vrogers@aehr.com
MKR 投資者關係公司
Todd Kehrli 或 Jim Byers
分析師/投資者聯繫方式
(323) 468-2300
aehr@mkr-group.com
声明:本內容僅用作提供資訊及教育之目的,不構成對任何特定投資或投資策略的推薦或認可。 更多信息
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