SureCore Teams With Sarcina to Package Cryo Chips
SureCore Teams With Sarcina to Package Cryo Chips
SHEFFIELD, England and PALO ALTO, Calif., Dec. 17, 2024 /PRNewswire/ -- Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, the company has revealed that it has teamed with packaging experts, Sarcina, who designed a custom package specifically for use at cryogenic temperatures.
英格蘭謝菲爾德和加利福尼亞州帕洛阿爾託,2024年12月17日 /PRNewswire/ — 繼成功評估180 nm和22nm工藝節點的測試芯片之後,SureCore最近宣佈推出一系列低溫IP,該公司還透露已與封裝專家薩西納合作,後者設計了專門用於低溫環境的定製封裝。
Paul Wells, sureCore's CEO, explained, "This represents another critical step in our programme to make Cryo-CMOS available for the Quantum Computing (QC) ecosystem. Our CryoMem range of memory IP is silicon proven in addition to validating our library recharacterization service. We are also offering a range of cryogenic design capabilities to help QC companies design the control/interface chips which need to be migrated into the cryostat alongside the qubits. Reliable, robust, cryo-ready chip packaging is a necessity in these harsh, low temperature environments and to ensure this we partnered with Sarcina whose specialist package design expertise is second to none."
SureCore首席執行官保羅·威爾斯解釋說:「這是我們計劃向量子計算(QC)生態系統提供低溫CMO的又一個關鍵步驟。我們的 CryoMEM 存儲器 IP 系列除了驗證我們的庫重構服務外,還經過硅驗證。我們還提供一系列低溫設計功能,以幫助質量控制公司設計控制/接口芯片,這些芯片需要與量子比特一起遷移到低溫恒溫器中。在這些惡劣的低溫環境中,可靠、堅固、可冷凍的芯片封裝是必不可少的,爲了確保這一點,我們與Sarcina合作,後者的專業封裝設計專業知識是首屈一指的。」
Larry Zu, Sarcina's CEO, added, "We have developed a reputation as the "go-to" design expert for companies needing to push the boundaries of current packaging technology. Whether this be for complex multi-chip 3D solutions, or, as in this case, for extreme low temperature operation, our experience and know-how allowed us to develop a custom BGA package specially for cryogenic temperatures."
Sarcina首席執行官拉里·祖補充說:「對於需要突破當前包裝技術界限的公司來說,我們已經樹立了'首選'設計專家的聲譽。無論是複雜的多芯片三維解決方案,還是像本例一樣用於極端低溫運行,我們的經驗和專有技術使我們能夠開發出專門用於低溫的定製BGA封裝。」
Innovate UK project background
The IUK-funded consortium is a complete ecosystem of companies with the expertise and core competencies required to develop cryo-tolerant semiconductor IP. The aim of the project is to develop and prove a suite of foundation IP that can be licenced to designers allowing them to create their own Cryo-CMOS SoC solutions. By doing so, their competitive edge in the Quantum Computing space will be dramatically accelerated.
創新英國項目背景
IUK資助的聯盟是一個完整的生態系統,由具有開發耐低溫半導體IP所需的專業知識和核心能力的公司組成。該項目的目標是開發和驗證一套基礎IP,這些知識產權可以授權給設計人員,使他們能夠創建自己的低溫CMOS SoC解決方案。這樣,他們在量子計算領域的競爭優勢將大大加快。
sureCore has exploited its state-of-the-art, ultra-low power memory design skills to create embedded Static Random Access Memory (SRAM), an essential building block for any digital sub-system, that is capable of operating from 77K (-196°C) down to the near absolute zero temperatures needed by Quantum Computers (QCs). In addition, both standard cell and IO cell libraries have been re-characterised for operation at cryogenic temperatures thereby enabling an industry standard RTL to GDSII physical design flow to be readily adopted.
SureCore 利用其最先進的超低功耗存儲器設計技能創建了嵌入式靜態隨機存取存儲器 (SRAM),這是任何數字子系統的必備組件,能夠在 7.7萬 (-196°C) 到量子計算機 (QC) 所需的接近絕對零的溫度下運行。此外,標準細胞庫和 IO 細胞庫均已重新表徵,可在低溫下運行,從而使行業標準的 RTL 到 GDSII 物理設計流程易於採用。
A key barrier to QC scaling is being able to collocate ever increasingly complex control electronics close to the qubits that must be housed at cryogenic temperatures in a cryostat. In doing so, it is essential that the control chip power consumption is kept as low as possible to ensure that excess heat is kept to a minimum so it does not cause additional thermal load on the cryostat. Here, sureCore's low power design expertise proved pivotal.
質量控制擴展的一個關鍵障礙是能夠將越來越複雜的控制電子設備與必須在低溫恒溫器中存放的量子比特相匹配。爲此,必須將控制芯片的功耗保持在儘可能低的水平,以確保將多餘的熱量降至最低,這樣就不會對低溫恒溫器造成額外的熱負荷。在這裏,SureCore的低功耗設計專業知識被證明是至關重要的。
Current QC designs have the control electronics located outside the cryostat as modern semiconductor technology is only qualified to work down to -40°C. As the temperature is reduced close to absolute zero the operating characteristics of the transistors change markedly. Measuring, understanding and modelling this behavioural change over the past months showcases the potential to build interface chips that can control and monitor qubits at cryogenic temperatures.
當前 QC 設計的控制電子設備位於低溫恒溫器外部,因爲現代半導體技術只能在 -40°C 下工作。隨着溫度降至接近絕對零度,晶體管的工作特性會發生顯著變化。對過去幾個月的這種行爲變化進行測量、理解和建模表明瞭構建接口芯片的潛力,這些接口芯片可以在低溫溫度下控制和監視量子比特。
At the moment, expensive bulky cabling connects room temperature control electronics to the qubits housed in the cryostat. Enabling QC developers to be able to exploit the fabless design paradigm and create their own custom cryogenic control SoCs, which can be housed with the qubits inside the cryostat, is a game-changer that will rapidly enable QC scaling. Immediate benefits include cost, size and, most importantly, latency reduction. The next step will be characterising the demonstrator chip at cryo temperatures to further refine and validate the models to help improve the performance."
目前,昂貴的笨重電纜將室溫控制電子設備連接到低溫恒溫器中的量子比特。讓 QC 開發人員能夠利用無晶圓廠設計範例並創建自己的定製低溫控制 SoC(可與低溫恒溫器內的量子比特一起存放)將改變遊戲規則,將迅速實現 QC 擴展。立竿見影的好處包括成本、規模,最重要的是減少延遲。下一步將在低溫下對演示器芯片進行特性分析,以進一步完善和驗證模型,以幫助提高性能。”
About sureCore
sureCore is the Low Power leader that empowers the IC design community to meet their aggressive power budgets through a portfolio of innovative, ultra-low power memory design services and standard products. sureCore's low-power engineering methodologies and design flows helps you meet your most exacting memory requirements with customized low power SRAM IP and low power mixed signal design services that create clear marketing differentiation. The company's low-power product line encompasses a range of down to near-threshold silicon proven, process-independent SRAM IP.
關於 SureCore
SureCore 是低功耗領導者,通過一系列創新的超低功耗存儲器設計服務和標準產品,使 IC 設計界能夠滿足其激進的功率預算。SureCore 的低功耗工程方法和設計流程通過定製的低功耗 SRAM IP 和低功耗混合信號設計服務,幫助您滿足最嚴格的存儲器需求,從而創造明顯的市場差異化。該公司的低功耗產品線包括一系列經過硅驗證且不受工藝限制的低至接近閾值的 SRAM IP。
For more information, visit sure-core.com
欲了解更多信息,請訪問 sure-core.com
Media Contact:
Nigel Robson, Vortex PR
Email: [email protected]
Phone: +44 1481 233080
媒體聯繫人:
奈傑爾·羅布森,Vortex PR
電子郵件:[電子郵件保護]
電話:+44 1481 233080
About Sarcina Technology
Founded in 2011, Sarcina Technology specializes in advanced semiconductor package design for high-performance computing AI chips and high-performance communication silicon photonics chips. The company also offers a comprehensive, one-stop solution for semiconductor packaging, testing, qualification, and production. With a proven track record of 100% "right-the-first-time" advanced packaging, Sarcina Technology delivers wafer-to-production services that minimize overhead and accelerate time-to-volume.
關於薩西納科技
Sarcina Technology成立於2011年,專門從事高性能計算人工智能芯片和高性能通信硅光子學芯片的先進半導體封裝設計。該公司還爲半導體封裝、測試、認證和生產提供全面的一站式解決方案。Sarcina Technology 擁有 100% 「一次性正確」 先進封裝的良好記錄,可提供晶圓到生產的服務,從而最大限度地減少開銷並縮短量產時間。
For more information, visit sarcinatech.com.
欲了解更多信息,請訪問sarcinatech.com。
Media Contact
Larry Zu
Email: [email protected]
Phone: +1-650-681-9157
媒體聯繫人
拉里·祖
電子郵件:[電子郵件保護]
電話:+1-650-681-9157
SOURCE Sarcina Technology LLC
來源 Sarcina 科技有限責任公司