AMD Announces Expanded Consumer and Commercial AI PC Portfolio at CES
AMD Announces Expanded Consumer and Commercial AI PC Portfolio at CES
Ryzen AI Max Chip Shot
Ryzen AI Max芯片快照
— AMD Ryzen AI Max, AMD Ryzen AI 300 Series and AMD Ryzen 200 Series processors bring incredible performance for next-gen AI PCs —
— 美國超微公司Ryzen AI Max、AMD Ryzen AI 300系列和AMD Ryzen 200系列處理器爲下一代人工智能計算機帶來了開多性能 —
— AMD Ryzen AI Max PRO, AMD Ryzen AI 300 PRO and AMD Ryzen 200 PRO Series processors bring cutting-edge performance to business PCs —
— 美國超微公司Ryzen AI Max PRO、AMD Ryzen AI 300 PRO和AMD Ryzen 200 PRO系列處理器爲商務計算機帶來了尖端性能 —
LAS VEGAS, Jan. 06, 2025 (GLOBE NEWSWIRE) -- AMD (NASDAQ: AMD) unveiled new processors today, ahead of CES 2025, furthering its leadership in the AI PC market and offering mobile users the most innovative PCs processors. AMD announced the new Ryzen AI Max Series processors, exceeding the demands for high-performance computing in premium thin and light notebooks; new Ryzen AI 300 Series "Zen-5"-based processors, rounding out the stack with additional models; and to continue the legacy of AMD "Zen 4" architecture, AMD also announced Ryzen 200 Series processors for everyday productivity.
拉斯維加斯,2025年1月6日(全球新聞通訊社)-- 美國超微公司(納斯達克:AMD)今天發佈了新的處理器,在2025年國際消費電子展(CES)前進一步鞏固了其在人工智能個人電腦市場的領導地位,併爲移動用戶提供了最創新的處理器。美國超微公司宣佈了新的Ryzen AI Max系列處理器,滿足了高性能計算在優質輕薄筆記本電腦上的需求;新款基於「Zen-5」的Ryzen AI 300系列處理器,增加了額外型號以完善產品線;並且爲了延續AMD「Zen 4」架構的傳統,AMD還發佈了用於日常生產力的Ryzen 200系列處理器。
AMD also expanded its commercial AI PC lineup integrating AMD PRO Technologies into the Ryzen AI Max, Ryzen AI 300 and Ryzen AI 200 Series processors. Ryzen PRO Series processors feature enterprise-grade security and manageability tools designed to help secure the modern enterprise and streamline IT operations.
美國超微公司還擴展了其商業人工智能計算機系列,將AMD PRO技術集成到Ryzen AI Max、Ryzen AI 300和Ryzen AI 200系列處理器中。Ryzen PRO系列處理器具有企業級安全性和可管理性工具,旨在幫助保護現代企業並簡化IT操作。
"As consumers and professionals increasingly recognize the productivity benefits of AI PCs, AMD is further increasing its performance leadership in the market," said Jack Huynh, senior vice president and general manager, Computing and Graphics Group, AMD. "With the next generation of AI-enabled processors, we are proliferating AI to devices everywhere, and bringing the power of a workstation to thin and light laptops."
"隨着消費者和專業人士日益認識到人工智能計算機的生產力優勢,AMD在市場上的性能領導地位進一步增強," AMD計算與圖形集團高級副總裁兼總經理Jack Huynh表示。"通過下一代支持人工智能的處理器,我們將在各類設備上普及人工智能,並將工作站的強大性能帶入輕薄筆記本電腦。"
AMD Ryzen AI Max and Ryzen AI Max PRO Series Processors
The new Ryzen AI Max Series processors revolutionize what's possible for next-gen AI PCs, offering incredible power and performance for gamers, creators and everyday users. With workstation-level performance, the Ryzen AI Max processors offer up to 16 "Zen 5" CPU cores, up to 40 AMD RDNA 3.5 graphics compute units, and an AMD XDNA 2 Neural Processing Unit (NPU) with up to 50 TOPS of AI processing ability1 – all in ultra-portable form factors for optimum mobility.
AMD Ryzen AI Max和Ryzen AI Max PRO系列處理器
新的Ryzen AI Max系列處理器正在革新下一代人工智能計算機的可能性,爲遊戲玩家、創作者和日常用戶提供令人難以置信的性能和能力。Ryzen AI Max處理器具有工作站級性能,提供多達16個「Zen 5」CPU核心,最多可支持40個AMD RDNA 3.5圖形計算單元,以及一個AMD XDNA 2神經處理單元(NPU),具備高達50 TOPS的人工智能處理能力——所有這些都在超便攜的形態中,確保最佳移動性。
Featuring up to 128GB of unified memory with up to 96GB available for graphics, systems powered by Ryzen AI Max for seamless and reliable multitasking, with the ability to support incredibly large AI models. With the addition of an NPU with up to 50 TOPS, Ryzen AI Max Series processors are the ultimate powerhouse for next-gen AI PCs and accelerating demanding AI-enabled workstation and creator software.
配備高達128Gb的統一內存,其中最高可用於圖形的爲96Gb,搭載Ryzen AI Max的系統能夠實現無縫且可靠的多任務處理,支持極爲龐大的人工智能模型。再加上一個具備50 TOPS處理能力的NPU,Ryzen AI Max系列處理器成爲下一代人工智能計算機和加速高負載人工智能工作站及創作者軟體的終極強大動力。
Built to redefine thin and light workstations, the new Ryzen AI Max PRO Series processors enable users to work with large engineering and architectural models and to tackle complex, AI-accelerated workloads. Equipped with AMD PRO Technologies, workstations powered by Ryzen AI Max PRO Series processors set a new standard for business-class mobile workstations.
新推出的Ryzen AI Max PRO系列處理器旨在重新定義薄型和輕型工作站,使用戶能夠處理大型工程和建築模型,並應對複雜的人工智能加速工作負載。配備AMD PRO技術的工作站由Ryzen AI Max PRO系列處理器驅動,爲商務級移動工作站樹立了新的標準。
Systems powered by Ryzen AI Max and Ryzen AI Max PRO Series Processors are expected to be available starting in Q1 2025.
搭載Ryzen AI Max和Ryzen AI Max PRO系列處理器的系統預計將在2025年第一季度開始上市。
Model | Cores / Threads |
Boost2 / Base Frequency |
Total Cache |
Graphics Model AMD |
cTDP | NPU TOPS |
Graphics Cores |
AMD Ryzen AI Max+ 395 | 16C/32T | Up to 5.1 /3.0 GHz | 80MB | AMD Radeon 8060S Graphics | 45-120W | 50 | 40 |
AMD Ryzen AI Max 390 | 12C/24T | Up to 5.0 / 3.2 GHz | 76MB | AMD Radeon 8050S Graphics | 45-120W | 50 | 32 |
AMD Ryzen AI Max 385 | 8C/16T | Up to 5.0 / 3.6 GHz | 40MB | AMD Radeon 8050S Graphics | 45-120W | 50 | 32 |
AMD Ryzen AI Max+ PRO 395 | 16C/32T | Up to 5.1 / 3.0 GHz | 80MB | AMD Radeon 8060S Graphics | 45-120W | 50 | 40 |
AMD Ryzen AI Max PRO 390 | 12C/24T | Up to 5.0 / 3.2 GHz | 76MB | AMD Radeon 8050S Graphics | 45-120W | 50 | 32 |
AMD Ryzen AI Max PRO 385 | 8C/16T | Up to 5.0 / 3.6 GHz | 40MB | AMD Radeon 8050S Graphics | 45-120W | 50 | 32 |
AMD Ryzen AI Max PRO 380 | 6C/12T | Up to 4.9 / 3.6 GHz | 22MB | AMD Radeon 8040S Graphics | 45-120W | 50 | 16 |
型號 | 內核 / 討論區 |
提升2 / 基礎 頻率 |
總計 緩存 |
圖形模型 AMD |
cTDP | NPU TOPS |
圖形 核心 |
美國超微公司銳龍人工智能Max+ 395 | 16C/32T | 最高可達5.1/3.0 GHz | 80MB | 美國超微公司Radeon 8060S圖形 | 45-120W | 50 | 40 |
美國超微公司銳龍人工智能Max 390 | 12C/24T | 高達5.0 / 3.2 GHz | 76MB | 美國超微公司Radeon 8050S顯卡 | 45-120W | 50 | 32 |
美國超微公司 Ryzen AI Max 385 | 8C/16T | 最高可達 5.0 / 3.6 GHz | 40MB | 美國超微公司Radeon 8050S顯卡 | 45-120W | 50 | 32 |
美國超微公司 Ryzen AI Max+ PRO 395 | 16C/32T | 最高5.1 / 3.0 GHz | 80MB | 美國超微公司Radeon 8060S圖形 | 45-120W | 50 | 40 |
美國超微公司Ryzen AI Max PRO 390 | 12C/24T | 高達5.0 / 3.2 GHz | 76MB | 美國超微公司Radeon 8050S顯卡 | 45-120W | 50 | 32 |
美國超微公司銳龍人工智能MAX PRO 385 | 8C/16T | 最高可達 5.0 / 3.6 GHz | 40MB | 美國超微公司Radeon 8050S顯卡 | 45-120W | 50 | 32 |
美國超微公司 Ryzen 人工智能 Max PRO 380 | 6核/12線程 | 最高 4.9 / 3.6 GHz | 22MB | 美國超微公司 Radeon 8040S 圖形 | 45-120W | 50 | 16 |
AMD Ryzen AI 300 and Ryzen AI 300 PRO Series Processors
AMD is introducing new Ryzen AI 300 Series processors, to join the Ryzen AI 300 Series family and enable premium AI experiences across notebooks. In addition to the previously announced Ryzen 9 models, the new Ryzen AI 7 and Ryzen AI 5 processor models are bringing the same trusted performance and AI capabilities to everyone.
美國超微公司Ryzen AI 300和Ryzen AI 300 PRO系列處理器
美國超微公司正在推出新的Ryzen AI 300系列處理器,以加入Ryzen AI 300系列家族,並在筆記本電腦上實現優質人工智能體驗。除了之前宣佈的Ryzen 9型號外,新的Ryzen AI 7和Ryzen AI 5處理器型號將同樣的可靠性能和人工智能功能帶給每一個人。
The new Ryzen AI 300 Series processors, feature up to 8 "Zen 5" CPU cores and the latest RDNA 3.5 graphics architecture. With an industry-leading NPU3 powered by AMD XDNA 2 technology, Ryzen AI 300 Series processors provide up to five times better performance than the first generation NPU, for more AI power4.
新的Ryzen AI 300系列處理器,最多配備8個「Zen 5」CPU內核和最新的RDNA 3.5圖形架構。憑藉業界領先的NPU3,由AMD XDNA 2技術驅動,Ryzen AI 300系列處理器提供比第一代NPU高出五倍的性能,爲更多人工智能提供動力。
For everyday business productivity, the new Ryzen AI 7 PRO 350 and Ryzen AI 5 PRO 340 processors are designed to support the next generation of Microsoft Copilot+ experiences. With a leading peak 50+ NPU TOPS of AI performance, commercial systems powered by Ryzen AI 300 PRO Series processors offer enterprises systems with the compute power to support the shift to an AI-enabled workforce. With AMD PRO Technologies, Ryzen AI 300 PRO Series processors deliver exceptional security and manageability features for business professionals on the go.
爲了日常商業生產力,新的Ryzen AI 7 PRO 350和Ryzen AI 5 PRO 340處理器旨在支持下一代微軟Copilot+體驗。憑藉領先的50+ NPU TOPS的人工智能性能,搭載Ryzen AI 300 PRO系列處理器的商業系統爲企業提供支持向人工智能驅動的工作隊伍轉變所需的計算能力。憑藉AMD PRO技術,Ryzen AI 300 PRO系列處理器爲在外工作的商業專業人士提供卓越的安全性和可管理性特性。
Systems powered by the new Ryzen AI 300 processors are expected to be available starting in Q1 2025.
搭載新款Ryzen AI 300處理器的系統預計將在2025年第一季度上市。
Model | Cores / Threads |
Boost5 / Base Frequency |
Total Cache |
Graphics Model AMD |
cTDP | NPU TOPS |
AMD Ryzen AI 7 350 | 8C/16T | Up to 5.0 / 2.0 GHz | 24 MB | AMD Radeon 860M Graphics | 15-54W | 50 |
AMD Ryzen AI 5 340 | 6C/12T | Up to 4.8 / 2.0 GHz | 22 MB | AMD Radeon 840M Graphics | 15-54W | 50 |
AMD Ryzen AI 7 PRO 350 | 8C/16T | Up to 5.0 / 2.0 GHz | 24 MB | AMD Radeon 860M Graphics | 15-54W | 50 |
AMD Ryzen AI 5 PRO 340 | 6C/12T | Up to 4.8 / 2.0 GHz | 22 MB | AMD Radeon 840M Graphics | 15-54W | 50 |
型號 | 內核 / 討論區 |
加速 / 基礎 頻率 |
總計 緩存 |
圖形模型 AMD |
cTDP | NPU TOPS |
AMD Ryzen AI 7 350 | 8C/16T | 高達5.0 / 2.0 GHz | 24 MB | 美國超微公司Radeon 86000萬 圖形卡 | 15-54W | 50 |
美國超微公司Ryzen AI 5 340 | 6核/12線程 | 高達4.8 / 2.0 GHz | 22 MB | AMD Radeon 84000萬 圖形 | 15-54W | 50 |
AMD Ryzen AI 7 PRO 350 | 8C/16T | 高達5.0 / 2.0 GHz | 24 MB | 美國超微公司Radeon 86000萬 圖形卡 | 15-54W | 50 |
美國超微公司Ryzen人工智能 5 PRO 340 | 6核/12線程 | 高達4.8 / 2.0 GHz | 22 MB | AMD Radeon 84000萬 圖形 | 15-54W | 50 |
AMD Ryzen 200 and Ryzen 200 PRO Series Processors
With the AMD Ryzen 200 Series processors, AMD is bringing the power and capability of "Zen 4" into the FP8 platform infrastructure bringing AI capabilities further down the stack. Ryzen 200 PRO Series mobile processors are designed to offer highly efficient and exceptional performance for everyday professionals. With up to eight CPU cores and 16 threads, AMD RDNA 3 graphics and up to 16 NPU TOPS, the Ryzen 200 Series processors offer incredible AI processing capabilities for essential applications, and sustained performance and battery life for uninterrupted use.
AMD Ryzen 200和Ryzen 200 PRO系列處理器
憑藉AMD Ryzen 200系列處理器,AMD將"Zen 4"的強大功能和能力引入FP8平台基礎設施,將人工智能能力進一步擴展。Ryzen 200 PRO系列移動處理器旨在爲日常專業人士提供高效且卓越的性能。配備多達八個CPU核心和16個線程,AMD RDNA 3圖形以及高達16 NPU TOPS,Ryzen 200系列處理器爲必要應用提供了令人難以置信的人工智能處理能力,併爲不間斷使用提供持久的性能和電池壽命。
Systems powered by Ryzen 200 and Ryzen 200 PRO Series processors are expected to be available starting in Q2 2025.
配備Ryzen 200和Ryzen 200 PRO系列處理器的系統預計將在2025年第二季度開始上市。
Model | Cores / Threads |
Boost6 / Base Frequency |
Total Cache |
Graphics Model AMD |
cTDP | NPU TOPS |
AMD Ryzen 9 270 | 8C/16T | Up to 5.2 / 4.0 GHz | 24MB | AMD Radeon 780M Graphics | 35-54W | 16 |
AMD Ryzen 7 260 | 8C/16T | Up to 5.1 / 3.8 GHz | 24MB | AMD Radeon 780M Graphics | 35-54W | 16 |
AMD Ryzen 7 250 | 8C/16T | Up to 5.1 / 3.3 GHz | 24MB | AMD Radeon 780M Graphics | 15-30W | 16 |
AMD Ryzen 5 240 | 6C/12T | Up to 5.0 / 4.3 GHz | 22MB | AMD Radeon 760M Graphics | 35-54W | 16 |
AMD Ryzen 5 230 | 6C/12T | Up to 4.9 / 3.5 GHz | 22MB | AMD Radeon 760M Graphics | 15-30W | 16 |
AMD Ryzen 5 220 | 6C/12T | Up to 4.9 / 3.2 GHz | 22MB | AMD Radeon 740M Graphics | 15-30W | N/A |
AMD Ryzen 3 210 | 4C/8T | Up to 4.7 / 3.0 GHz | 12MB | AMD Radeon 740M Graphics | 15-30W | N/A |
AMD Ryzen 7 PRO 250 | 8C/16T | Up to 5.1 / 3.3 GHz | 24 MB |
AMD Radeon 780M graphics | 15-30W | 16 |
AMD Ryzen 5 PRO 230 | 6C/12T | Up to 4.9 / 3.5 GHz | 22 MB |
AMD Radeon 760M graphics | 15-30W | 16 |
AMD Ryzen 5 PRO 220 | 6C/12T | Up to 4.9 / 3.2 GHz | 22 MB | AMD Radeon 740M graphics | 15-30W | N/A |
AMD Ryzen 3 PRO 210 | 4C/8T | Up to 4.7 / 3 GHz | 12 MB |
AMD Radeon 740M graphics | 15-30W | N/A |
型號 | 內核 / 討論區 |
提升6 / 基礎 頻率 |
總計 緩存 |
圖形模型 AMD |
cTDP | NPU TOPS |
AMD Ryzen 9 270 | 8C/16T | 最高可達5.2 / 4.0 GHz | 24MB | 美國超微公司Radeon 78000萬顯卡 | 35-54W | 16 |
美國超微公司Ryzen 7 260 | 8C/16T | 最高達到5.1 / 3.8 GHz | 24MB | 美國超微公司Radeon 78000萬顯卡 | 35-54W | 16 |
AMD Ryzen 7 250 | 8C/16T | 最高可達5.1 / 3.3 GHz | 24MB | 美國超微公司Radeon 78000萬顯卡 | 15-30W | 16 |
美國超微公司 Ryzen 5 240 | 6核/12線程 | 最高可達5.0 / 4.3 GHz | 22MB | 美國超微公司 Radeon 76000萬 圖形 | 35-54W | 16 |
美國超微公司銳龍5 230 | 6核/12線程 | 高達4.9 / 3.5 GHz | 22MB | 美國超微公司 Radeon 76000萬 圖形 | 15-30W | 16 |
美國超微公司 Ryzen 5 220 | 6核/12線程 | 最高可達 4.9 / 3.2 GHz | 22MB | 美國超微公司 Radeon 74000萬 顯卡 | 15-30W | 不適用 |
美國超微公司 Ryzen 3 210 | 4核8線程 | 高達4.7 / 3.0 GHz | 12MB | 美國超微公司 Radeon 74000萬 顯卡 | 15-30W | 不適用 |
美國超微公司銳龍7 PRO 250 | 8C/16T | 最高可達5.1 / 3.3 GHz | 24 MB |
AMD Radeon 78000萬圖形 | 15-30W | 16 |
AMD Ryzen 5 PRO 230 | 6核/12線程 | 高達4.9 / 3.5 GHz | 22 MB |
AMD Radeon 76000萬 圖形 | 15-30W | 16 |
AMD Ryzen 5 PRO 220 | 6核/12線程 | 最高可達 4.9 / 3.2 GHz | 22 MB | 美國超微公司Radeon 74000萬顯卡 | 15-30W | 不適用 |
美國超微公司Ryzen 3 PRO 210 | 4核8線程 | 最高可達4.7 / 3 GHz | 12 MB |
美國超微公司Radeon 74000萬顯卡 | 15-30W | 不適用 |
AMD PRO Technologies
AMD PRO Technologies provide users with enterprise-grade manageability and multi-layer security features, helping IT decision makers manage enterprise PC fleets at scale. With the recent addition of cloud-based recovery, supply chain security and additional detection and recovery processes, AMD PRO Technologies exceeds the requirements and gives users continuous protection against sophisticated attacks.
AMD PRO技術
AMD PRO技術爲用戶提供企業級可管理性和多層安全功能,幫助IT決策者大規模管理企業PC陣列。憑藉最近增加的基於雲的恢復、供應鏈安全以及額外的檢測和恢復流程,AMD PRO技術超越了要求,併爲用戶提供對複雜攻擊的持續保護。
OEM Partners and Customers Continue to Lead AI PC Adoption with New Ryzen-Powered Systems
OEM partners continue to announce new AI-powered PCs and workstations featuring AMD Ryzen processors. With incredible power, performance and compatibility, these news systems exceed expectations for next-generation Copilot+ PCs. At CES this year AMD is deepening its relationships with major OEM partners, introducing a new strategic expansion with Dell, bringing new Dell Pro systems to the market powered by AMD Ryzen AI PRO processors later this year.
OEM合作伙伴和客戶繼續引領AI PC的採用,推出全新的Ryzen驅動系統
OEM合作伙伴繼續宣佈新的AI驅動PC和工作站,配備AMD Ryzen處理器。憑藉強大的性能和兼容性,這些新系統超越了對下一代Copilot+ PC的期望。今年在CES上,AMD正在加深與主要OEM合作伙伴的關係,推出與戴爾的新戰略擴展,預計在今年晚些時候推出由AMD Ryzen AI PRO處理器驅動的新戴爾Pro系統。
"It's been incredible to see AMD and Microsoft's longstanding partnership move into the next wave of technology, bringing AI innovation to our OEM partners," said Pavan Davuluri, CVP Windows + Devices, Microsoft. "We're thrilled to see the expansion of Copilot+ PCs with AMD's new Ryzen AI products for professionals, content creators, and mainstream consumers alike."
"看到美國超微公司與微軟長期合作關係邁向下一個科技浪潮,給我們的OEM合作伙伴帶來人工智能創新,真令人不可思議,"微軟Windows + 設備部門副總裁Pavan Davuluri說,"我們很高興看到搭載美國超微公司新款Ryzen人工智能產品的Copilot+ PC的擴展,這些產品適用於專業人士、內容創作者和大衆消費者。"
"ASUS has always been on the cutting edge of technology, working to bring the highest level of performance to our customers," said Samson Hu, co-CEO, ASUS. "Today, we are announcing new Ryzen-powered systems, bringing best-in-class processing power to enable our customers to be on the forefront of AI innovation."
"華碩一直走在科技的最前沿,致力於爲我們的客戶帶來最高水平的性能,"華碩聯合首席執行官Samson Hu說,"今天,我們宣佈全新搭載Ryzen的系統,爲客戶帶來一流的處理能力,使他們能夠走在人工智能創新的最前沿。"
"In collaboration with AMD, HP identified pain points in customer workflows that the new HP ZBook Ultra G1a and HP Z2 Mini G1a solve. Powered by AMD's Ryzen AI Max PRO Series processors, these workstations will be the first to offer this architecture on a workstation," said Jim Nottingham, Senior Vice President and Division President, Advanced Compute and Solutions, HP Inc. "By redefining the boundaries of what is possible on highly mobile or mini desk-side workstations, together we're bringing customers the ability to tackle complex professional ISV and data science workflows simultaneously, while seamlessly integrating high-performance computing with the functionality of an AI PC."
"在與美國超微公司合作的過程中,惠普識別出客戶工作流程中的痛點,而新的惠普ZBook Ultra G1a和HP Z2 Mini G1a正是爲了解決這些問題。這些工作站搭載美國超微公司Ryzen AI Max PRO系列處理器,將是第一款在工作站上提供這種架構的產品,"惠普高級副總裁及高級計算與解決方案部總裁Jim Nottingham說,"通過重新定義超移動或迷你桌面工作站在可能性上的界限,我們共同爲客戶帶來同時處理複雜專業ISV和數據科學工作流程的能力,同時無縫集成高性能計算與人工智能計算機的功能。"
"At Lenovo, we believe meaningful innovation stems from strong partnerships. Our collaboration with AMD is a testament to this, as we work together to shape the future of computing with advanced, AI-driven solutions," said Luca Rossi, President of Lenovo Intelligent Devices Group. "By leveraging AMD's latest generation of cutting-edge platforms, we're laying the groundwork for exciting new products designed to enhance personalization, boost productivity, and provide robust security. Stay tuned as we continue to empower users—whether creative professionals, businesses, or gamers—with groundbreaking solutions that push the boundaries of performance, collaboration, and innovation."
"在LENOVO B2401,我們相信有意義的創新源於強大的合作伙伴關係。我們與美國超微公司的合作正是這一點的證明,隨着我們共同努力塑造未來計算的高級人工智能驅動解決方案,"LENOVO B2401智能設備組總裁Luca Rossi說,"通過利用美國超微公司最新一代的尖端平台,我們正在爲激動人心的新產品奠定基礎,旨在增強個性化、提升生產力並提供強大的安全性。請繼續關注,我們將繼續賦能用戶——無論是創意專業人士、企業還是遊戲玩家——以突破性能、協作和創新界限的突破性解決方案。"
"At MSI we are proud to build products that help gamers, creators and professionals' level up their computing experiences," said Eric Kuo, the Executive Vice President & NB BU GM of MSI. "Powered by new Ryzen AI 300 Series processors, the new Stealth A16 AI+ and A18 AI+ laptops bring a new level of performance for our customers."
"在MSI,我們自豪地製造出能幫助遊戲玩家、創作者和專業人士提升計算體驗的產品,"MSI的執行副總裁兼NB業務總經理Eric Kuo說。"新款Stealth A16 AI+和A18 AI+筆記本電腦搭載最新的Ryzen AI 300系列處理器,爲我們的客戶帶來了全新的性能水平。"
Customers around the globe are on the forefront of AI PC adoption, enabling their workforce to seamlessly innovate faster at all stages of their business.
全球客戶在AI個人電腦的採用方面處於前沿,使他們的員工能夠在業務的各個階段迅速創新。
"Altair Inspire accelerates simulation-driven design, making fluid simulation accessible to all users. Running fluid simulation code on GPU boosts performance and scalability, enabling users to innovate faster and more efficiently," said, Sam Mahalingam, CTO, Altair. "By leveraging the capabilities of the ROCm/HIP stack the Altair team was able to rapidly expand GPU support to AMD Radeon, including the Ryzen AI Max PRO."
"Altair Inspire加速了以仿真驅動的設計,使流體仿真對所有用戶都變得可訪問。運行在GPU上的流體仿真代碼提升了性能和可擴展性,使用戶能夠更快、更高效地創新,"Altair首席技術官Sam Mahalingam說。"通過利用ROCm/HIP堆棧的能力,Altair團隊能夠快速擴展對AMD Radeon的GPU支持,包括Ryzen AI Max PRO。"
"KeyShot is thrilled to extend support for KeyShot Studio's high-speed GPU rendering to include AMD Radeon," said Henrik Wann Jensen, Chief Scientist, KeyShot. "The seamless enablement provided by ROCm/HIP tools was remarkable, and we are particularly excited about the substantial frame buffer available on the Ryzen AI Max PRO, which significantly enhances our rendering capabilities."
"KeyShot很高興能夠擴展對KeyShot Studio的高速GPU渲染的支持,以包括AMD Radeon,"KeyShot首席科學家Henrik Wann Jensen說。"ROCm/HIP工具提供的無縫支持令人矚目,我們特別爲Ryzen AI Max PRO上可用的大量幀緩衝感到興奮,這顯著增強了我們的渲染能力。"
Supporting Resources
支持資源
- Visit the AMD CES 2025 page for more information
- Learn more about Ryzen mobile processors
- Learn more about Ryzen mobile workstation processors
- Learn more about Ryzen PRO mobile processors
- Learn more about AMD PRO Technologies
- Learn more about Ryzen AI
- Learn more about Ryzen AI Software
- Become a fan of AMD on Facebook
- Follow AMD on X
- 訪問AMD CES 2025頁面以獲取更多信息
- 了解更多關於Ryzen移動處理器的信息
- 了解更多關於Ryzen移動工作站處理器的信息
- 了解更多關於Ryzen PRO移動處理器
- 了解更多關於AMD PRO技術
- 了解更多關於Ryzen人工智能
- 了解更多關於Ryzen人工智能軟體
- 在Facebook上關注AMD
- 在X上關注美國超微公司
About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies. Billions of people, leading Fortune 500 businesses and cutting-edge scientific research institutions around the world rely on AMD technology daily to improve how they live, work and play. AMD employees are focused on building leadership high-performance and adaptive products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, LinkedIn and X pages.
關於美國超微公司
超過50年來,AMD一直在高性能計算、圖形和可視化技術方面推動創新。數十億人、領先的財富500強企業以及全球前沿的科學研究機構每天依賴AMD技術來改善他們的生活、工作和娛樂。AMD員工專注於構建領導級的高性能和適應性產品,突破可能的界限。有關AMD如何支持今天並激勵明天的更多信息,請訪問AMD(納斯達克:AMD)網站、博客、LinkedIn和X頁面。
Cautionary Statement
警示聲明
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products, including Ryzen AI Max, Ryzen AI 300 Series and Ryzen 200 Series processors and Ryzen AI Max PRO, Ryzen AI 300 PRO and Ryzen 200 PRO Series processors as well as expected benefits of AMD's OEM partnerships, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation's dominance of the microprocessor market and its aggressive business practices; Nvidia's dominance in the graphics processing unit market and its aggressive business practices; competitive markets in which AMD's products are sold; the cyclical nature of the semiconductor industry; market conditions of the industries in which AMD products are sold; AMD's ability to introduce products on a timely basis with expected features and performance levels; loss of a significant customer; economic and market uncertainty; quarterly and seasonal sales patterns; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; availability of essential equipment, materials, substrates or manufacturing processes; ability to achieve expected manufacturing yields for AMD's products; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential security incidents including IT outages, data loss, data breaches and cyberattacks; uncertainties involving the ordering and shipment of AMD's products; AMD's reliance on third-party intellectual property to design and introduce new products; AMD's reliance on third-party companies for design, manufacture and supply of motherboards, software, memory and other computer platform components; AMD's reliance on Microsoft and other software vendors' support to design and develop software to run on AMD's products; AMD's reliance on third-party distributors and add-in-board partners; impact of modification or interruption of AMD's internal business processes and information systems; compatibility of AMD's products with some or all industry-standard software and hardware; costs related to defective products; efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD's ability to effectively control sales of its products on the gray market; long-term impact of climate change on AMD's business; impact of government actions and regulations such as export regulations, tariffs and trade protection measures; AMD's ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; impact of environmental laws, conflict minerals related provisions and other laws or regulations; evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters; issues related to the responsible use of AI; restrictions imposed by agreements governing AMD's notes, the guarantees of Xilinx's notes and the revolving credit agreement; impact of acquisitions, joint ventures and/or investments on AMD's business and AMD's ability to integrate acquired businesses; AMD's ability to complete the acquisition of ZT Systems; impact of any impairment of the combined company's assets; political, legal and economic risks and natural disasters; future impairments of technology license purchases; AMD's ability to attract and retain qualified personnel; and AMD's stock price volatility. Investors are urged to review in detail the risks and uncertainties in AMD's Securities and Exchange Commission filings, including but not limited to AMD's most recent reports on Forms 10-K and 10-Q.
本新聞稿包含了有關美國超微公司的前瞻性陳述,如AMD產品的特性、功能、性能、可用性、時間及預期利益,包括Ryzen AI Max、Ryzen AI 300系列和Ryzen 200系列微處理器,以及Ryzen AI Max PRO、Ryzen AI 300 PRO和Ryzen 200 PRO系列微處理器,以及AMD的OEM合作伙伴關係的預期利益,這些陳述是根據1995年《私人證券訴訟改革法》的安全港條款作出的。前瞻性陳述通常以「將」、「可能」、「預期」、「相信」、「計劃」、「打算」、「項目」等類似詞彙進行識別。投資者應注意,這份新聞稿中的前瞻性陳述基於當前的信念、假設和預期,僅代表新聞稿發佈之日的意見,並涉及可能導致實際結果與當前預期嚴重不同的風險和不確定性。這些陳述受一些已知和未知風險及不確定性的約束,其中許多是難以預測並通常超出美國超微公司的控制範圍,可能導致實際結果及其他未來事件與前瞻性信息及陳述中的表達、暗示或預測出現重大差異。可能導致實際結果與當前預期重大不同的關鍵因素包括但不限於:英特爾在微處理器市場的主導地位及其激進的商業行爲;英偉達在圖形處理單元市場的主導地位及其激進的商業行爲;美國超微產品銷售的競爭市場;半導體行業的週期性特點;美國超微產品銷售相關行業的市場狀況;美國超微按時推出預期特性和性能水平的能力;重要客戶的流失;經濟和市場的不確定性;季度和季節性銷售模式;美國超微對於技術或其他知識產權的有效保護能力;不利的貨幣兌換率波動;第三方製造商及時生產美國超微產品的能力(數量足夠且使用競爭性技術);必需的設備、材料、基板或製造工藝的可用性;實現美國超微產品預期製造產量的能力;美國超微從其半定製SoC產品中產生營業收入的能力;潛在的安防漏洞;潛在的安防事件,包括IT宕機、數據丟失、數據泄露和網絡攻擊;涉及美國超微產品訂購和交通的不確定性;美國超微對於第三方知識產權的依賴,以設計和推出新產品;美國超微對於第三方公司在主板、軟體、內存和其他計算機平台元件的設計、製造和供應的依賴;美國超微對於微軟和其他軟體供應商支持的依賴,以設計和開發能夠在美國超微產品上運行的軟體;美國超微對於第三方分銷商和增值板合作伙伴的依賴;對美國超微內部業務流程和信息系統修改或中斷的影響;美國超微產品與某些或所有行業標準軟體和硬件的兼容性;與產品缺陷有關的成本;美國超微供應鏈的效率;美國超微對第三方供應鏈物流職能的依賴;美國超微有效控制其產品在灰色市場上銷售的能力;氣候變化對美國超微業務的長期影響;政府行動和法規的影響,如出口法規、關稅和貿易保護措施;美國超微實現其遞延稅資產的能力;潛在的稅務責任;當前及未來的索賠及訴訟;環保法律、衝突礦產相關條款及其他法律或法規的影響;政府、投資者、客戶及其他利益相關者對企業責任事務的期望變化;與人工智能的負責使用相關的問題;協議對美國超微票據、賽靈思票據的擔保及循環信貸協議施加的限制;收購、合資和/或投資對美國超微業務的影響以及美國超微整合收購企業的能力;美國超微完成收購Zt Systems的能力;合併公司資產減值的影響;政治、法律及經濟風險和自然災害;未來技術許可證購買的減值;美國超微吸引和留住合格人才的能力;以及美國超微股價的波動性。投資者被敦促詳細審查美國超微在證券交易委員會的文件中列出的風險和不確定性,包括但不限於美國超微最新的10-K表格和10-Q表格報告。
2025 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Radeon, RDNA, Ryzen, XDNA and combinations thereof are trademarks of Advanced Micro Devices, Inc. Certain AMD technologies may require third-party enablement or activation. Supported features may vary by operating system. Please confirm with the system manufacturer for specific features. No technology or product can be completely secure.
2025 美國超微公司。版權所有。AMD、AMD箭頭logo、Radeon、RDNA、Ryzen、XDNA及其組合是美國超微公司的商標。某些AMD技術可能需要第三方啓用或激活。支持的功能可能因操作系統而異。請與系統製造商確認具體功能。沒有任何技術或產品可以完全安全。
The information contained herein is for informational purposes only and is subject to change without notice. Timelines, roadmaps, and/or product release dates shown in this Press Release are plans only and subject to change.
本文件中包含的信息僅供參考,並可能隨時更改,恕不另行通知。新聞稿中顯示的時間表、路線圖和/或產品發佈日期僅爲計劃,可能會有所更改。
Contact:
Stacy MacDiarmid
AMD Communications
+1 (512) 658-2265
Stacy.MacDiarmid@amd.com
聯繫:
斯泰西·麥克迪爾米德
通信
+1 (512) 658-2265
Stacy.MacDiarmid@amd.com
A photo accompanying this announcement is available at
此公告的配圖可在此查看
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1 Trillions of Operations per Second (TOPS) for an AMD Ryzen processor is the maximum number of operations per second that can be executed in an optimal scenario and may not be typical. TOPS may vary based on several factors, including the specific system configuration, AI model, and software version. GD-243.
2 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
3 Based on AMD product specifications and competitive products announced as of Oct 2024. AMD Ryzen AI PRO 300 Series processors' NPU offers up to 55 peak TOPS. This is the most TOPS offered on any system found in enterprise today. AI PC is defined as a laptop PC with a processor that includes a neural processing unit (NPU). STXP-06.
4 Testing as of Sept 2024 by AMD performance labs on a Lenovo ThinkPad T14s Gen 6 with an AMD Ryzen AI 7 PRO 360 processor @22W, Radeon 880M graphics, 32GB RAM, 1TB SSD, VBS=ON, Windows 11 Pro vs. a Dell Latitude 7450 with an Intel Core Ultra 7 165U processor @15W (vPro enabled), Intel Integrated Graphics, VBS=ON, 32GB RAM, 512GB NVMe SSD, Microsoft Windows 11 Professional in the application(s) (Best Performance Mode): Cinebench R24 nT. Laptop manufactures may vary configurations yielding different results. STXP-13.
5 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
6 Boost Clock Frequency is the maximum frequency achievable on the CPU running a bursty workload. Boost clock achievability, frequency, and sustainability will vary based on several factors, including but not limited to: thermal conditions and variation in applications and workloads. GD-150.
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AMD Ryzen處理器的每秒萬億次操作(TOPS)是在最佳情況下可以執行的最大操作數,這可能並不典型。TOPS可能會根據多個因素而變化,包括特定的系統配置、人工智能模型和軟體版本。GD-243。
提升時鐘頻率是CPU在運行突發工作負載時可以達到的最高頻率。提升時鐘的可實現性、頻率和可持續性將依據多個因素而變化,包括但不限於:熱條件以及應用和工作負載的變化。GD-150。
2. 基於AMD產品規格和截至2024年10月宣佈的競爭產品。AMD Ryzen AI PRO 300系列處理器的NPU提供高達55個TOPS的峯值性能。這是當今企業中任何系統中所提供的最高TOPS。AI PC被定義爲具有包括神經處理單元(NPU)的處理器的筆記本電腦。STXP-06。
截至2024年9月在美國超微公司的性能實驗室對LENOVO B2401 ThinkPad T14s Gen 6進行的測試,配備AMD Ryzen AI 7 PRO 360處理器@22W,Radeon 88000萬顯卡,32Gb內存,1Tb SSD,VBS=開啓,Windows 11 Pro,與配備英特爾-T的Core Ultra 7 165U處理器@15W(啓用vPro)、英特爾集成顯卡、VBS=開啓,32Gb內存,512Gb NVMe SSD的戴爾Latitude 7450進行比較,在應用程序中(最佳性能模式):Cinebench R24 nt。筆記本生產商可能會因配置變化而產生不同結果。STXP-13。
5 Boost時鐘頻率是在運行突發工作負載時CPU可達到的最大頻率。Boost時鐘的可實現性、頻率和可持續性將根據多種因素而有所不同,包括但不限於:熱條件以及應用程序和工作負載的變化。GD-150。
6 Boost Clock Frequency是CPU在運行突發工作負載時可以達到的最大頻率。提升時鐘的可實現性、頻率和持續性將根據多種因素而變化,包括但不限於:熱態條件和應用程序以及工作負載的變化。GD-150。