SINGAPORE – July 10, 2024 – Dow (NYSE:DOW) today announced that the 35th Packaging Innovation Awards (PIA) will culminate in an awards ceremony set to take place in October this year, at Tokyo Pack 2024.
This year's edition saw a record-breaking number of entries, with over 300 submissions received from packaging professionals and companies across the globe. Following a rigorous evaluation process led by 18 judges from packaging value chains across the world in June 2024, the finalist entries will be revealed in August this year.
Winners will be unveiled at a prestigious ceremony on October 24 at Tokyo Pack, in the esteemed company of industry leaders across the packaging value chain. This marks a significant first for the PIA, with the awards ceremony being held in Asia for the very first time. Winning entries will also be on display at Tokyo Pack, from October 23 to 25.
"We are incredibly excited to be unveiling the winners in Asia this year. Asia is a hotbed of innovation in the packaging industry, and this move reflects the region's growing importance in shaping the future of sustainable packaging solutions that contribute meaningfully to human progress," said Daniella Souza Miranda, global marketing director, Dow.
David Luttenberger, the jury chairperson for the 35th edition of the PIA and global packaging director for Mintel Group Ltd, also commented on the program's significance. "Our judges gathered in Bangkok to evaluate each and every submission, ensuring that we cast the spotlight on the innovations that will shape the future of our industry," said Luttenberger. "Award programs like the Dow Packaging Innovation Awards play a vital role in encouraging and recognizing advancements in packaging that prioritize sustainability and responsible practices. The record-breaking participation this year is a testament to the industry's commitment to building a better future."
Since its inception, the Packaging Innovation Awards (PIA) has been the packaging industry's premier accolade for recognizing breakthroughs in technological advancement, sustainability and enhanced user experience. It offers a platform for packaging professionals around the world to showcase their most innovative designs and gain valuable recognition among industry peers. Entries are evaluated on their ability to leverage cutting-edge technologies, benefit the greater-good, and provide an enhanced user-experience.
About the Packaging Innovation Awards
The Packaging Innovation Awards has been one of the packaging industry's premier awards competitions for over 30 years. Emerging up-and-comers and well-established brands alike have the opportunity for their most innovative packaging to be judged on the world's stage. The Packaging Innovation Awards celebrates creations that challenge the accepted limits of what's possible, showcase new technologies or techniques and inspire future innovation. The winning packages are celebrated and showcased across the global packaging industry – receiving recognition among industry peers and gaining exposure in new markets and with new audiences. You can learn more at .
About Dow
Dow (NYSE: DOW) is one of the world's leading materials science companies, serving customers in high-growth markets such as packaging, infrastructure, mobility and consumer applications. Our global breadth, asset integration and scale, focused innovation, leading business positions and commitment to sustainability enable us to achieve profitable growth and help deliver a sustainable future. We operate manufacturing sites in 31 countries and employ approximately 35,900 people. Dow delivered sales of approximately $45 billion in 2023. References to Dow or the Company mean Dow Inc. and its subsidiaries. Learn more about us and our ambition to be the most innovative, customer-centric, inclusive and sustainable materials science company in the world by visiting .
For media queries, please contact:
Caroline Huang
+86 139 1771 3817
chuang19@dow.com
BCW for Dow
pia_bcw@bcw-global.com