L&P Global Bhd, a provider of integrated industrial packaging solutions, has appointed Lee Soon Swee as its Executive Director, effective Nov 13 2024.
With over 30 years of experience in engineering, Lee has specialised in applied science and R&D across the aerospace, semiconductor, and life science industries. He has held key roles with organisations such as the National Institute of Aviation Research (USA), MEMC Electronic Materials Inc (USA), and Pall Corporation in Malaysia and Singapore.
Executive Director and CEO of L&P Ooi Lay Pheng expressed confidence in Lee's appointment, stating, "With Lee's proven track record in R&D and material science, we are well-positioned to explore innovative packaging solutions and expand into new market segments." She added that his leadership would help optimise operations and support L&P's sustainable long-term growth.
Lee holds a Bachelor of Science in Aerospace Engineering and a Master of Science in Mechanical Engineering from Wichita State University, USA.
