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Taiwan Semiconductor | 6-K: Report of foreign private issuer (related to financial reporting)

台积电 | 6-K:外国发行人报告(业绩相关)

美股SEC公告 ·  03/08 19:10

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Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a leading semiconductor manufacturer, reported its revenue for February 2024. The company's consolidated net revenue for the month was NT$181.65 billion, marking a 15.8% decrease from January 2024 but an 11.3% increase from February 2023. The cumulative revenue for the first two months of 2024 reached NT$397.43 billion, representing a 9.4% increase from the same period the previous year. Additionally, TSMC disclosed information on funds lent to other parties, endorsements and guarantees, and financial derivative transactions for February 2024. TSMC China, a wholly-owned subsidiary, had an outstanding lending amount of NT$38.75 billion. The company also provided guarantees to several of its subsidiaries, including TSMC Global, TSMC Arizona, TSMC Design Technology Japan, and TSMC North America. In terms of financial derivatives, TSMC reported outstanding notional amounts and unrealized profit/loss figures for various contracts, both applying and not applying hedge accounting. The report was signed by Wendell Huang, Senior Vice President and Chief Financial Officer, and was filed with the United States Securities and Exchange Commission on March 8, 2024.
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a leading semiconductor manufacturer, reported its revenue for February 2024. The company's consolidated net revenue for the month was NT$181.65 billion, marking a 15.8% decrease from January 2024 but an 11.3% increase from February 2023. The cumulative revenue for the first two months of 2024 reached NT$397.43 billion, representing a 9.4% increase from the same period the previous year. Additionally, TSMC disclosed information on funds lent to other parties, endorsements and guarantees, and financial derivative transactions for February 2024. TSMC China, a wholly-owned subsidiary, had an outstanding lending amount of NT$38.75 billion. The company also provided guarantees to several of its subsidiaries, including TSMC Global, TSMC Arizona, TSMC Design Technology Japan, and TSMC North America. In terms of financial derivatives, TSMC reported outstanding notional amounts and unrealized profit/loss figures for various contracts, both applying and not applying hedge accounting. The report was signed by Wendell Huang, Senior Vice President and Chief Financial Officer, and was filed with the United States Securities and Exchange Commission on March 8, 2024.
领先的半导体制造商台湾半导体制造股份有限公司(TSMC)公布了2024年2月的收入。该公司当月的合并净收入为新台币1,816.5亿元,较2024年1月下降了15.8%,但比2023年2月增长了11.3%。2024年前两个月的累计收入达到新台币3974.3亿元,比去年同期增长9.4%。此外,台积电还披露了2024年2月有关向其他各方借出的资金、背书和担保以及金融衍生品交易的信息。全资子公司台积电中国未偿贷款额为新台币387.5亿元。该公司还为其几家子公司提供担保,包括台积电全球、亚利桑那州台积电、日本台积电设计技术和台积电北美。在金融衍生品方面,台积电报告了各种合约的未清名义金额和未实现的损益数字,包括适用和未应用套期保值会计。该报告由高级副总裁兼首席财务官黄文德签署,并于2024年3月8日提交给美国证券交易委员会。
领先的半导体制造商台湾半导体制造股份有限公司(TSMC)公布了2024年2月的收入。该公司当月的合并净收入为新台币1,816.5亿元,较2024年1月下降了15.8%,但比2023年2月增长了11.3%。2024年前两个月的累计收入达到新台币3974.3亿元,比去年同期增长9.4%。此外,台积电还披露了2024年2月有关向其他各方借出的资金、背书和担保以及金融衍生品交易的信息。全资子公司台积电中国未偿贷款额为新台币387.5亿元。该公司还为其几家子公司提供担保,包括台积电全球、亚利桑那州台积电、日本台积电设计技术和台积电北美。在金融衍生品方面,台积电报告了各种合约的未清名义金额和未实现的损益数字,包括适用和未应用套期保值会计。该报告由高级副总裁兼首席财务官黄文德签署,并于2024年3月8日提交给美国证券交易委员会。
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