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Qualcomm | 8-K: Entry into a Credit Agreement

Qualcomm | 8-K: Entry into a Credit Agreement

高通 | 8-K：簽訂信貸協議
美股SEC公告 ·  2024/08/10 04:08

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Qualcomm has entered into a new $4 billion Credit Agreement on August 8, 2024, replacing its existing credit facility from December 2020. The five-year revolving credit facility will mature on August 8, 2029, offering loans in multiple currencies including US Dollars, Euros, Pounds Sterling, and Yen. The facility is unsecured and not guaranteed by any subsidiary.The credit agreement features interest rates at either Term SOFR Rate plus 0.81% margin or Base Rate plus 0% margin, with a facility fee of 0.065%. Interest margins and fees will fluctuate based on the company's long-term unsecured senior debt ratings from S&P and Moody's. The agreement requires Qualcomm to maintain a ratio of consolidated EBITDA to interest expense of at least 3.00 to 1.00.The facility can be used for working capital, capital expenditures, and other general corporate purposes. Currently, Qualcomm has not drawn any funds under the new agreement. The company has terminated all remaining commitments under the previous credit agreement, which had no outstanding borrowings at termination.
Qualcomm has entered into a new $4 billion Credit Agreement on August 8, 2024, replacing its existing credit facility from December 2020. The five-year revolving credit facility will mature on August 8, 2029, offering loans in multiple currencies including US Dollars, Euros, Pounds Sterling, and Yen. The facility is unsecured and not guaranteed by any subsidiary.The credit agreement features interest rates at either Term SOFR Rate plus 0.81% margin or Base Rate plus 0% margin, with a facility fee of 0.065%. Interest margins and fees will fluctuate based on the company's long-term unsecured senior debt ratings from S&P and Moody's. The agreement requires Qualcomm to maintain a ratio of consolidated EBITDA to interest expense of at least 3.00 to 1.00.The facility can be used for working capital, capital expenditures, and other general corporate purposes. Currently, Qualcomm has not drawn any funds under the new agreement. The company has terminated all remaining commitments under the previous credit agreement, which had no outstanding borrowings at termination.
高通於2024年8月8日簽署了一項新的40億信用協議，取代了2020年12月的現有信貸設施。這項爲期五年的循環信貸設施將在2029年8月8日到期，提供以多種貨幣（包括美元、歐元、英鎊和日元）的貸款。該設施無擔保，且不由任何子公司擔保。信用協議的利率爲Term SOFR利率加上0.81%的利差或基準利率加上0%的利差，設施費用爲0.065%。利差和費用將根據公司從標準普爾和穆迪的長期無擔保高級債務評級波動。協議要求高通保持的合併EBITDA與利息費用的比例至少爲3.00比1.00。該設施可用於營運資金、資本支出及其他一般企業用途。目前，高通尚未根據新協議提取任何資金。該公司已終止之前信用協議下的所有剩餘承諾，該協議在終止時沒有未償還的借款。
高通於2024年8月8日簽署了一項新的40億信用協議，取代了2020年12月的現有信貸設施。這項爲期五年的循環信貸設施將在2029年8月8日到期，提供以多種貨幣（包括美元、歐元、英鎊和日元）的貸款。該設施無擔保，且不由任何子公司擔保。信用協議的利率爲Term SOFR利率加上0.81%的利差或基準利率加上0%的利差，設施費用爲0.065%。利差和費用將根據公司從標準普爾和穆迪的長期無擔保高級債務評級波動。協議要求高通保持的合併EBITDA與利息費用的比例至少爲3.00比1.00。該設施可用於營運資金、資本支出及其他一般企業用途。目前，高通尚未根據新協議提取任何資金。該公司已終止之前信用協議下的所有剩餘承諾，該協議在終止時沒有未償還的借款。
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該公告為獨立文件：

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