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深科达(688328.SH)：芯片倒装贴合机可适用于Flip Chip、MEMS等先进封装领域，目前已在客户端进行验证

Shenkeda (688328.SH): The chip flip laminating machine can be applied to advanced packaging fields such as Flip Chip and MEMS, and has now been verified on the client side

Gelonghui Finance ·  Nov 30, 2023 06:22

Gelonghui November 30 | Shenzhen Keda (688328.SH) said on the interactive platform that the packaging forms suitable for different types of chips are different. The company's product integrated circuit test sorter is mainly suitable for QFN (four-sided flat, pinless package), QFP (square flat package), BGA (ball grid array package), LGA (grid array package), PGA (pin grid array package), CSP (chip-level package), TSOP (thin small package) and other packaging types of chips. Chips using advanced packaging technology such as CoWoS, TSV, and Chiplet can be tested and sorted using Shenkeda's test sorter if the finished product is in the BGA or QFN package format. The chip flip laminating machine developed and produced by the company can also be applied to advanced packaging fields such as Flip Chip and MEMS, and has now been verified on the client side.

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