Gelonghui, Feb. 29丨According to Fangbang Co., Ltd. (688020.SH)'s investor relations activity records, products with specifications related to peelable copper have passed the certification of some carrier board manufacturers and terminals, and small-batch shipments have continued since the third and fourth quarters of 2023. Currently, they are mainly used in IoT (such as smart home) related scenarios, and the order volume is expected to gradually increase in 2024.
Compared with other application scenarios, mobile phone chip packaging has higher requirements for copper foil materials, and the verification of materials is more strict. As the company's strippable copper becomes more stable and continues to be iteratively upgraded, it is expected to enter the field of mobile phone chip packaging in the future, and the company and related terminals are actively promoting work in this area.
Compared to other copper foils, one of the most critical features of the company's peelable copper is that it can make finer wires. Compared with traditional HDI mobile phone motherboards, RCC materials used in carrier-like technology show the future development trend of mobile phone motherboards, that is, thinner lines to achieve higher integration and further lightness. We believe that the spread of RCC materials in carrier-like board technology will help promote the gradual penetration of stripable copper application scenarios from chip packaging substrates to motherboards, thereby bringing greater market demand.