share_log

Earnings Call Summary | BE SEMICONDUCTOR INDUSTRIES NV ORD EUR0.91 (NY REG SHARES)(BESIY.US) Q1 2024 Earnings Conference

決算説明会の概要 | BEセミコンダクター・インダストリーズNV ORD EUR0.91(ニューヨーク株式)(BESIY.US)2024年第1四半期決算会議

moomoo AI ·  04/25 19:37  · 電話会議

The following is a summary of the BE Semiconductor Industries N.V. (BESIY) Q1 2024 Earnings Call Transcript:

Financial Performance:

  • BE Semiconductor reported Q1 revenue of €146.3 million, up 9.7% year-on-year.

  • Order trends decreased by 10.1% compared to Q1 the previous year and declined by 23.3% sequentially.

  • Net income, adjusted for share-based compensation, increased by 15.1% to €49.5 million compared to the same quarter last year.

  • Gross margins increased by 3.0 points to 67.2% due to a favorable product mix and net forex benefits.

  • Expenses were controlled with increased R&D spending to support next-generation product development.

  • Net cash increased by 60.1% from the year-end to reach €180.9 million.

Business Progress:

  • BE Semiconductor is expanding its advanced packaging market share in 2.5D, 3D, and photonics applications to cater to expected strong growth for AI-related applications.

  • The company anticipates orders for 25 to 35 hybrid bonding systems in Q2.

  • BE Semiconductor is increasing R&D investment in assembly processes to capitalize on anticipated growth in the period 2024, 2025 and 2027.

  • The company's progress on its hybrid bonders has been positive and a second TC system has recently been shipped and is being installed.

  • BESIY plans to have the 50 nanometer system ready by the end of 2025 and is evaluating both TCB and hybrid bonding for smartphone applications.

Tips: This article is generated by AI. The accuracy of the content can not be fully guaranteed. For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.

これらの内容は、情報提供及び投資家教育のためのものであり、いかなる個別株や投資方法を推奨するものではありません。 更に詳しい情報
    コメントする