Jiaocheng Ultrasonic (688392.SH) recently participated in a strategy meeting. The related content is as follows:

Q1. Apart from power battery ultrasonic welding equipment, what is the layout of the company's new products in the lithium battery field?

A1:In the field of new energy power batteries, the company has launched new products such as ultrasonic dust removal system, laser welding quality monitoring system, and nano-material ultrasonic blasting dispersion machine to meet the higher requirements of head customers for improving product quality and continuously improve and consolidate the company's overall competitiveness based on market trends and customer needs.

Q2. What are the company's current customers in the wire harness field? What is the market size?

A2:In the wire harness field, the company has accumulated well-known customers such as TE Connectivity, Amphenol, Amphenol, BYD, AVIC Jonhon Optronic Technology, Kunshan Huguang Auto Harness, Ningbo Joyson Electronic Corp., Huafeng Technology, Zhejiang Yonggui Electric Equipment, Jieyi Corp., Tianhai Electric Appliances, etc. As the application scenarios such as high-voltage and fast charging increase, the demand for ultrasonic equipment power for wire harnesses with large diameters such as high and low voltage wire harnesses, charging stations, and energy storage scenarios is getting higher and higher. The ultrasonic welding equipment launched by the company can achieve the welding of copper and aluminum wires with a diameter of 185 square millimeters or more, effectively meeting the application needs of high and low voltage wire harnesses, charging stations, energy storage scenarios and so on.

Q3. Who are the company's competitors in the semiconductor field?

A3:In the semiconductor field, the company's main competitors are well-known companies such as K&S and ASMPT in the United States. In the semiconductor field, the company actively introduces professional talents and increases R&D investment in new products and new technologies, continuously enhancing the company's core competitiveness.

Q4. What recent progress has the company made in the semiconductor field?

A4:The company has launched the overall solution of ultrasonic wire bonding equipment, IGBT terminal ultrasonic welding equipment, Pin needle ultrasonic welding equipment, and ultrasonic scanning microscope in the semiconductor field, and continues to increase R&D investment in the advanced packaging field.

Q5. What are the company's products in the field of advanced packaging?

A5:The company's ultrasonic scanning microscope (C-SAM/SAT) is widely used in the testing of semiconductor wafers, chips, 2.5D/3D packaging, IGBT modules/SiC devices, substrates (ceramic DBC/metal plate AMB), and plays an important role in the advanced packaging process of semiconductors. The development of other products in the company's layout in the field of advanced packaging is also progressing in an orderly manner. With a high market share of imported equipment in this field and a low localization rate of core equipment, the company actively carries out technical and business layout to lay a solid foundation for long-term business development.