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通富微电(002156.SZ):在多个先进封装技术领域积极开展国内外专利布局

Tongfu Microelectronics (002156.SZ): Actively carries out domestic and foreign patent layout in multiple advanced packaging technology fields.

Gelonghui Finance ·  Jul 8 04:12

On July 8, GraceLink reported that Tongfu Microelectronics (002156.SZ) stated on its investor interaction platform that the company has continuously strengthened independent innovation during its development, and has actively carried out domestic and international patent layouts in multiple advanced packaging technology fields. As of December 31, 2023, the company has accumulated 1,544 domestic and foreign patent applications, with advanced packaging technology layout accounting for more than 60%.

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