On July 16, Glon Hi-Tech announced that recently the company released the self-developed "Advanced Packaging Low Temperature Film Application Solution" for 2.5D and 3D advanced packaging technology's low-temperature process special requirements in the semiconductor field, which can achieve high uniformity, high quality, and high reliability thin-film deposition effect in the low-temperature range of 50~200°C at the first "16th Integrated Circuit Assembly and Test Innovation Development Forum (CIPA 2024)".
The solution includes multiple low-temperature film deposition equipment products that the company's self-developed, such as iTronix LTP series low-temperature plasma chemical vapor deposition system, iTomic PE series plasma-enhanced atomic layer deposition system, and iTomic MeT series metal and metal nitride deposition system.
The company has already launched a series of products in the semiconductor field, including iTomic series atomic layer deposition system, iTomic MW series batch atomic layer deposition system, iTomic PE series plasma-enhanced atomic layer deposition system, and iTronix series chemical vapor deposition system, which can achieve relatively comprehensive coverage of thin-film deposition applications in logic chips, storage chips, compound semiconductors, and new displays (silicon-based OLED). The company's current products have covered a variety of thin-film materials such as HfO₂, Al₂O3, ZrO₂, TiO₂, La₂O3, ZnO, SiO₂, TiN, TiAl, TaN, AlN, SiN, SiON, SiCN, amorphous carbon, and SiGe.
At the same time, the company aims to continuously enrich the product matrix and provide customers with the most advanced integrated vacuum technology and process solutions by targeting the development direction of domestic and foreign advanced semiconductor technology and processes, and meet the needs of domestic advanced semiconductor next-generation technology iterations. Currently, 2.5D and 3D packaging technologies are becoming important means for promoting the miniaturization and performance improvement of electronic devices due to their high integration and superior performance. The release of the company's new products reflects the company's technological innovation capabilities and further enriches the company's product line.