Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
Resonac Announces New US-JOINT Consortium; Ten Partners to Collaborate on Next-Generation Semiconductor Packaging in Silicon Valley
The consortium will help to further advance technology in back-end packaging, an area that has not been significantly focused on in the US
该联盟将有助于进一步推进后端封装技术,这是美国尚未重点关注的领域。
UNION CITY, Calif. – July 8, 2024 – Resonac Corporation today unveiled a new consortium of ten partners, called "US-JOINT," for its semiconductor back-end process R&D in Silicon Valley. The ten American and Japanese semiconductor materials and equipment companies are: Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; TOK; TOWA; and Resonac.
加利福尼亚联合城-2024年7月8日-Resonac Corporation今天在硅谷推出了一个名为"US-JOINt"的由十个合作伙伴组成的新联盟,用于其半导体后端工艺研发。这十家美国和日本的半导体材料和设备公司分别是:Azimuth; KLA; Kulicke & Soffa; Moses Lake Industries; MEC; ULVAC; NAMICS; TOK; TOWA;和Resonac。
US-JOINT expands the activities of Japan-based open consortiums led by Resonac (known as "JOINT" and "JOINT2") in the U.S. and includes the participation of five U.S.-based companies. US-JOINT R&D will take place at a new R&D center in Union City, Calif., set up through co-investment with the partners. The construction of cleanrooms and equipment installation will begin this year, and the facility is expected to be fully operational in 2025.
US-JOINt扩展了由Resonac领导的日本开放联盟在美国的活动(称为"JOINT"和"JOINT2"),并包括五家美国公司的参与。US-JOINt R&D将在加利福尼亚联和城的一个新研发中心开展,该中心通过与合作伙伴的联合投资建立。洁净室的建设和设备的安装将于今年开始,该设施预计将在2025年全面投入运营。
Mr. Rahm Emanuel, the U.S. Ambassador to Japan, said, "With nearly every area of our daily lives now dependent on semiconductors, it is critical that we strengthen supply chains through cooperation with trusted partners in the sector. This new consortium of leading American and Japanese companies in the semiconductor industry is the latest example of our two nations joining forces to accelerate the development of advanced technologies of global importance."
美国驻日本大使拉姆·伊曼纽尔表示:“由于我们日常生活的几乎每个领域现在都依赖于半导体,因此通过与在该行业有信任的合作伙伴合作来加强供应链至关重要。这家半导体行业领先的美国和日本公司的新联盟是我们两个国家联手加快全球重要先进技术发展的最新例子。
US-JOINT is an open consortium designed for end-customer collaboration to verify the latest requirements for semiconductor packaging of advanced devices and validate new concepts in development. In addition, by co-creating with customers, Resonac and the US-JOINT members will capture market needs in real time, accelerating the R&D of materials and equipment technologies.
US-JOINt是一个面向最终客户合作的开放性联盟,以验证先进设备的半导体封装的最新要求并验证正在开发的新概念。此外,通过与客户共同创建,Resonac和US-JOINt成员将实时捕捉市场需求,加速材料和设备技术的研发。
"Today's rapidly expanding next-generation semiconductors for generative AI and autonomous driving require new approaches to advanced packaging technologies, such as 2.5D and 3D*1," said Hidenori Abe, executive director of Electronics Business Headquarters, Resonac. "In recent years, major semiconductor manufacturers and fabless companies in Silicon Valley, including GAFAM*2, are designing semiconductors in-house and creating new concepts in back-end packaging one after another. This is where the US-JOINT consortium can contribute significantly with our leading technology in materials and equipment on-shore in the U.S."
Resonac电子商务总部执行主任Hidenori Abe表示:“今天快速扩展的生成AI和自动驾驶的下一代半导体需要采用新的先进封装技术,例如2.5D和3D *1。近年来,硅谷的主要半导体制造商和无厂半导体公司(包括GAFAM *2)正在自主设计半导体,并在后端封装领域中不断创造新的概念。这就是US-JOINt联盟在美国领先的材料和设备技术可以带来的贡献所在。
Advanced packaging and back-end processing of semiconductors has traditionally been located primarily in Asia. Bringing packaging R&D closer to major semiconductor device makers in Silicon Valley will help to further advance the technology and solve technical issues, especially in the areas that other U.S. consortiums do not cover enough, including advancements in the substrate, interposer and fabrication of the package.
半导体先进封装和后端处理传统上主要位于亚洲。将封装端的研发提前到硅谷的主要半导体器件制造商附近,将有助于进一步推进技术并解决技术问题,特别是在其他美国联盟板块没有充分覆盖的领域,包括基板、中间层和封装制造的进展。
Jan Vardaman, president, TechSearch International, Inc., said, "This represents a tremendous opportunity for U.S. companies to take advantage of the expertise gathered in material and equipment for advanced packaging development."
TechSearch International,Inc.总裁Jan Vardaman表示:“这代表美国公司利用材料和设备方面的专业知识开发先进封装的巨大机会。”
For details, please refer to the website, Resonac Holdings Corporation:
详细信息请参见网站Resonac Holdings Corporation:
*1 2.5D packaging is a technology to place semiconductor chips in parallel on the interposer. 3D packaging is a technology to laminate chips with TSV (through silicon via).
*2 GAFAM stands for Google, Apple, Facebook, Amazon, Microsoft.
*1 2.5D封装是一种将半导体芯片平行放置在中间层上的技术。3D封装是一种利用TSV(透过硅孔)层压芯片的技术。
*2 GAFAm是谷歌、苹果、Facebook、亚马逊和微软的缩写。