科睿斯拟定的主营业务为FCBGA(ABF)高端载板的生产和销售。公司产品主要应用于CPU、GPU、AI及车载等高算力芯片的封装。FCBGA载板属于IC载板，IC载板即封装基板，是芯片封装环节不可或缺的一部分。项目专注于FCBGA载板(ABF载板)产品的研发及量产业务，致力于缓解因封测需求爆发而导致的封装基板的紧缺现状，同时填补FCBGA国内工艺领域空白。科睿斯尚在建设中，未开始生产经营。Shenzhen Strongteam Decoration Engineering Co., Ltd. (002989.SZ) released an announcement that its wholly-owned subsidiary, Shenzhen Zhongtian Jingyi Investment Co., Ltd. (referred to as 'Zhongtian Jingyi'), plans to acquire, in cash, 49% equity of Shenzhen Tianjingdiyi Enterprise Management Co., Ltd. (referred to as 'Tianjingdiyi') held by Shenzhen Huayu Shidai Technology Co., Ltd. (referred to as 'Huayu Shidai'), 2% equity of Tianjingdiyi and 48.5% and 12.1261% property of Shenzhen Jingtianweidi Enterprise Management Partnership Enterprise (Limited Partnership) (referred to as 'Jingtianweidi') held by Shenzhen Jintai Dayou Private Equity Investment Fund Management Co., Ltd. (referred to as 'Shenzhen Jintai Dayou'). At the same time, Zhongtian Jingyi plans to acquire 52% property of Dongyang City Zhongjing Kerui Equity Investment Partnership Enterprise (Limited Partnership) (referred to as 'Zhongjing Kerui') held by Shenzhen Jintai Dayou.
Zhongtian Jingdian (002989.SZ) announced that its wholly-owned subsidiary, Shenzhen Zhongtian Jingyi Investment Co., Ltd. (referred to as 'Zhongtian Jingyi'), plans to acquire a 49% equity interest in Shenzhen Tianjingdiyi Enterprise Management Co., Ltd. (referred to as 'Tianjingdiyi') held by Shenzhen Huayu Shidai Technology Co., Ltd. (referred to as 'Huayu Shidai') in cash. It also plans to acquire 2% equity of Tianjingdiyi and 48.5% and 12.1261% property of Shenzhen Jingtianweidi Enterprise Management Partnership Enterprise (Limited Partnership) (referred to as 'Jingtianweidi') and Suzhou Weicheng Technology Service Co., Ltd. (referred to as 'Suzhou Weicheng') respectively held by Tianjingdiyi, Shenzhen Jingtianweidi Enterprise Management Partnership Enterprise (Limited Partnership) and 52% property of Dongyang City Zhongjing Kerui Equity Investment Partnership Enterprise (Limited Partnership) (referred to as 'Zhongjing Kerui') held by Shenzhen Jintai Dayou Private Equity Investment Fund Management Co., Ltd. (referred to as 'Shenzhen Jintai Dayou')
It is reported that Jingtianweidi and Zhongjing Kerui hold 23.5790% and 36.4676% contribution in KLS Semiconductor Technology (Dongyang) Co., Ltd. (referred to as 'KLS') respectively. After the transaction is completed, the company indirectly holds 33.3784% contribution in KLS.
KLS Semiconductor Technology (Dongyang) Co., Ltd. (referred to as 'KLS') is planning to produce and sell FCBGA (ABF) high-end carrier boards as its main business. The company's products are mainly used in CPU, GPU, AI, and car and other high-performance chip packages. FCBGA carrier board is an IC carrier board, which is an indispensable part of chip packaging process. The project focuses on the R&D and mass production of FCBGA carrier board (ABF carrier board) products, aims to alleviate the shortage of carrier board caused by the outbreak of chip packaging demand, and fill the gap in the domestic process field of FCBGA. KLS is still under construction and has not started production operation.
The company said that the purpose of the external investment is to optimize the company's industrial structure, cultivate and try new business and new industries, and conforms to the company's overall development strategy. The target company of this investment is only to participate in KLS indirectly. KLS is engaged in the relevant business of ABF carrier board industry, which can fill the blank in this field for Chinese enterprises and has good market prospects. With the rapid development of 5G, AI, and HPC industry, the demand for ABF carrier board will increase significantly, and the downstream demand for ABF carrier board is expected to grow significantly. The industry is entering a period of rapid development, and KLS has good prospects in the industry.
