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思泰克(301568.SZ):3DSPI和3DAOI可适用于LED晶元锡膏焊点的检测及半导体后道封装过程中芯片锡球与锡膏的检测

SITAC(301568.SZ): 3DSPI and 3DAOI can be used for the detection of LED chip solder paste solder joints and the detection of chip solder balls and solder paste during the back-end packaging process of semiconductors.

Gelonghui Finance ·  Jul 30 08:00

On July 30, Gelunhui reported that Sitak (301568.SZ) stated on the investor platform that its 3DSPI (3D solder paste printing inspection equipment) and 3DAOI (3D automatic optical inspection equipment) can be used for testing LED chip solder paste points and semiconductor post-packaging processes, including the detection of chip solder balls and solder paste.

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