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Earnings Call Summary | Kulicke & Soffa Industries(KLIC.US) Q3 2024 Earnings Conference

Earnings Call Summary | Kulicke & Soffa Industries(KLIC.US) Q3 2024 Earnings Conference

业绩会总结 | 库利克与索法工业(KLIC.US)2024年Q3业绩会
moomoo AI ·  08/07 23:46  · 电话会议

The following is a summary of the Kulicke and Soffa Industries, Inc. (KLIC) Q3 2024 Earnings Call Transcript:

以下是历嘉科技(Kulicke and Soffa Industries, Inc.)2024Q3业绩发布会的摘要:

Financial Performance:

金融业绩:

  • Kulicke and Soffa Industries generated $181.7 million in revenue during Q3 2024.

  • Gross margin stood at 46.6%, influenced by product and customer mix.

  • Non-GAAP EPS exceeded expectations, although specific figures were not disclosed.

  • The company anticipates Q4 revenue to be approximately $180 million with a gross margin of 47%.

  • For Q4, projected GAAP EPS is $0.22 per share and non-GAAP EPS is $0.35 per share.

  • 2024Q3历嘉科技实现了1.817亿美元的营业收入。

  • 毛利率达到46.6%,受产品和客户组合的影响。

  • 尽管没有披露具体数字,但Non-GAAP每股收益超出预期。

  • 公司预计2024Q4营收约为1.8亿美元,毛利率为47%。

  • 2024Q4预计GAAP每股收益为0.22美元,Non-GAAP每股收益为0.35美元。

Business Progress:

业务进展:

  • Strategic advancements in thermocompression and fluxless bonding technologies, including successful deployment in diverse semiconductor fabrication processes.

  • Key victories in thermocompression bonding within the past four years reflected a 10x business growth.

  • Continued dominance in ball bonding with improvements, and capitalizing on robust demand in power semiconductor assembly for automotive and industrial applications.

  • 热压焊和无焊点连接技术的战略性进展,成功应用于不同的半导体制造流程中。

  • 在过去四年内,热压焊连接的重要进展体现了10倍的业务增长。

  • 在提高球焊连接技术上仍然占据主导地位,并利用汽车和工业应用中强劲的需求实现了增长。

Opportunities:

机会:

  • Strong positioning in new markets such as AI, HPC, and mobility, traditionally not part of Kulicke and Soffa's core market.

  • Advanced packaging technologies and low-barrier, cost-effective solutions for mass-market chiplet adoption show substantial growth prospects.

  • Expected industry-wide semiconductor revenue growth of 17% through calendar year 2025, promises enhanced demand for the company's high-volume solutions.

  • 在人工智能,高性能计算和移动性等新市场上具有强大的地位,这些市场通常不属于历嘉科技的核心市场。

  • 固体芯片封装技术和低阻,成本效益高的解决方案,为大众芯片采用提供了可观的增长前景。

  • 预计行业范围内的半导体收入增长将在2025年的日历年度内达到17%,这将增强对该公司高量级方案的需求。

Risks:

风险:

  • Economic fluctuations may influence overall utilization rates which though improving, must maintain consistent above-average percentages to ensure sustained recovery and growth, particularly past the 75% utilization rate needed to drive high-volume customer demands.

  • 经济波动可能会影响整体利用率,尽管有所改善,也必须保持持续的高于平均水平的百分比,以确保持续恢复和增长,特别是过去需要推动高量级客户需求的75%利用率。

More details: Kulicke & Soffa Industries IR

更多详情请参见历嘉科技公司IR页面。

Tips: This article is generated by AI. The accuracy of the content can not be fully guaranteed. For more comprehensive details, please refer to the IR website. The article is only for investors' reference without any guidance or recommendation suggestions.

提示:本文由AI生成。文章内容的准确性无法完全保证。有关更全面的详细信息,请参阅IR网站。本文只是为投资者提供参考,没有任何指导或推荐建议。

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