ASMPT (00522) rose more than 4%, with a cumulative increase of more than 17% this week. As of press time, it rose 4.12%, to HKD 85.85, with a turnover of HKD 0.264 billion.
According to the Wisdom Financial APP, ASMPT (00522) rose more than 4%, with a cumulative increase of more than 17% this week. As of press time, it rose 4.12%, to HKD 85.85, with a turnover of HKD 0.264 billion.
According to a report by Caijing.com, SK Hynix may receive a direct subsidy of up to USD 0.45 billion and a loan of up to USD 0.5 billion for its investment in an advanced semiconductor packaging factory in Indiana, USA. Yongxing Securities believes that the importance of advanced packaging in the era of computing power is gradually becoming prominent, and the relevant industry chain is expected to continue to benefit.
China Merchants Securities pointed out that advanced packaging equipment such as overseas HBM and heterogeneous integration have remained prosperous. In the second quarter, ASMPT's TCB orders continued to grow strongly. In terms of advanced packaging, the company has obtained C2W orders from IDM/OSAT and C2S orders from leading wafer foundries/OSAT, and continued to jointly develop a new generation of non-assisted solder TCB with leading wafer foundry customers. Regarding HBM, the company has made good progress in cooperation with the original factory in HBM stacking of 12 layers or more, and obtained two orders for the next-generation non-assisted solder TCB equipment in July 2024.